公开(公告)号：US20110108997A1

公开(公告)日：2011-05-12

申请号：US13003996

申请日：2010-04-19

申请人： Naomichi Ohashi ,  Atsushi Yamaguchi ,  Arata Kishi ,  Masato Udaka ,  Seiji Tokii

发明人： Naomichi Ohashi ,  Atsushi Yamaguchi ,  Arata Kishi ,  Masato Udaka ,  Seiji Tokii

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L24/83 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K3/305 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/0545 ,  H05K2203/1476 ,  Y02P70/613

摘要： A semiconductor package component (3) is mounted on a substrate (1) in such a manner that an electrode (2) of the substrate (1) and an electrode of the semiconductor package component (3) are brought into contact with each other through a joining material (4). A reinforcing adhesive (5c) is applied between the substrate (1) and the outer surface of the semiconductor package component (3). Then, reflow is performed to melt the joining metal (4) with the reinforcing adhesive (5c) uncured. After the reinforcing adhesive (5c) is cured, the joining metal (4) is solidified.

摘要翻译： 半导体封装部件（3）以这样的方式安装在基板（1）上，使得基板（1）的电极（2）和半导体封装部件（3）的电极彼此接触通过 接合材料（4）。 在基板（1）和半导体封装件（3）的外表面之间施加增强粘合剂（5c）。 然后，进行回流，使加固用粘合剂（5c）未熔融而熔融接合金属（4）。 在增强粘合剂（5c）固化之后，使接合金属（4）固化。

公开(公告)号：US20100101845A1

公开(公告)日：2010-04-29

申请号：US12605750

申请日：2009-10-26

申请人： Arata Kishi ,  Naomichi Ohashi ,  Atsushi Yamaguchi ,  Seiji Tokii ,  Masato Udaka

发明人： Arata Kishi ,  Naomichi Ohashi ,  Atsushi Yamaguchi ,  Seiji Tokii ,  Masato Udaka

IPC分类号： H05K1/02 ,  B23K31/02

CPC分类号： H05K3/3489 ,  B23K1/0016 ,  B23K1/203 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73104 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： An electronic device manufacturing method includes: setting a solder material on electrodes of a first circuit assembly; setting a resin having a flux action on one surface of a second circuit assembly so as to entirely cover solder bumps formed on the one surface of the second circuit assembly; setting the second circuit assembly on the first circuit assembly via the resin so that the solder material set on the electrodes of the first circuit assembly and the solder bumps of the second circuit assembly are put into contact with each other; and applying thermal energy to connecting portions between the solder material and the solder bumps and to the resin. By carrying out these processes, an electronic device in which the first circuit assembly and the second circuit assembly are joined together and in which their junction portions are sealed by the resin is manufactured. As a result, in the electronic device, junction reliability can be improved.

摘要翻译： 一种电子器件制造方法，包括：在第一电路组件的电极上设置焊料; 在第二电路组件的一个表面上设置具有磁通作用的树脂，以便完全覆盖形成在第二电路组件的一个表面上的焊料凸块; 通过树脂将第二电路组件设置在第一电路组件上，使得设置在第一电路组件的电极上的焊料材料和第二电路组件的焊料凸块彼此接触; 并且将热能施加到焊料材料和焊料凸块之间的连接部分和树脂上。 通过进行这些处理，制造其中第一电路组件和第二电路组件接合在一起并且其接合部分被树脂密封的电子设备。 结果，在电子设备中，可以提高结点的可靠性。

公开(公告)号：US08218333B2

公开(公告)日：2012-07-10

申请号：US12401247

申请日：2009-03-10

申请人： Masato Udaka ,  Seiji Tokii

发明人： Masato Udaka ,  Seiji Tokii

IPC分类号： H05K1/18

CPC分类号： H05K3/3436 ,  H01R12/523 ,  H05K1/113 ,  H05K2201/09381 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09572 ,  Y02P70/613 ,  Y10T29/49213

摘要： The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGA package as a surface mounted device includes a plurality of solder balls arranged thereon and a printed circuit board includes a plurality of mounting pads corresponding respectively to the plurality of solder balls. The BGA package is connected to the mounting pads on the printed circuit board due to melting of the solder balls, thereby mounted on the printed circuit board. A concave via hole is formed on each of the mounting pads having a circular surface shape and a part of the solder ball is in the convex via hole. Here, the center of the convex via hole is apart from the center of each of the mounting pads by at least the diameter of the concave via hole.

摘要翻译： 本发明提供了一种印刷电路板，其能够在安装表面安装装置时足以确保接合强度和接头可靠性，以及使用印刷电路板的表面安装装置的安装结构。 作为表面安装器件的BGA封装包括布置在其上的多个焊球，并且印刷电路板包括分别对应于多个焊球的多个安装焊盘。 BGA封装由于焊球的熔化而连接到印刷电路板上的安装焊盘，从而安装在印刷电路板上。 在具有圆形表面形状的每个安装焊盘上形成凹通孔，并且焊球的一部分在凸通孔中。 这里，凸通孔的中心至少与凹通孔的直径相距离每个安装焊盘的中心。

公开(公告)号：US09331047B2

公开(公告)日：2016-05-03

申请号：US14092407

申请日：2013-11-27

申请人： Naomichi Ohashi ,  Atsushi Yamaguchi ,  Arata Kishi ,  Masato Udaka ,  Seiji Tokii

发明人： Naomichi Ohashi ,  Atsushi Yamaguchi ,  Arata Kishi ,  Masato Udaka ,  Seiji Tokii

IPC分类号： H01L21/00 ,  H01L23/00 ,  H05K3/30 ,  H05K3/34

CPC分类号： H01L24/83 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K3/305 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/0545 ,  H05K2203/1476 ,  Y02P70/613

摘要： A semiconductor package component (3) is mounted on a substrate (1) in such a manner that an electrode (2) of the substrate (1) and an electrode of the semiconductor package component (3) are brought into contact with each other through a joining material (4). A reinforcing adhesive (5c) is applied between the substrate (1) and the outer surface of the semiconductor package component (3). Then, reflow is performed to melt the joining metal (4) with the reinforcing adhesive (5c) uncured. After the reinforcing adhesive (5c) is cured, the joining metal (4) is solidified.

摘要翻译： 半导体封装部件（3）以这样的方式安装在基板（1）上，使得基板（1）的电极（2）和半导体封装部件（3）的电极彼此接触通过 接合材料（4）。 在基板（1）和半导体封装件（3）的外表面之间施加增强粘合剂（5c）。 然后，进行回流，使加固用粘合剂（5c）未熔融而熔融接合金属（4）。 在增强粘合剂（5c）固化之后，使接合金属（4）固化。

公开(公告)号：US08233288B2

公开(公告)日：2012-07-31

申请号：US12107454

申请日：2008-04-22

申请人： Seiji Tokii

发明人： Seiji Tokii

IPC分类号： H01R9/00

CPC分类号： H01R43/0256 ,  G01N2223/611 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component package includes: an insulating carrier substrate; a connection wiring that is provided on one side of the carrier substrate; an IC chip that is connected to the connection wiring; an external connection land that is disposed on the other side of the carrier substrate and is connected to the connection wiring via a wiring in the carrier substrate; and a solder ball that is disposed on the external connection land. A region of the external connection land that can be bonded to the solder ball has an outer shape that includes at least one arc portion and at least one straight portion. With this configuration, it is possible to provide an electronic component mounted apparatus in which bonding failure of the external connection land and the circuit board-side land with the solder ball can be reduced, and the bonding state can be easily inspected, and a method of inspecting a bonding portion therein.

摘要翻译： 电子部件封装包括：绝缘载体基板; 连接布线，其设置在所述载体基板的一侧; 连接到连接线的IC芯片; 外部连接区域，其设置在所述载体基板的另一侧，并且经由所述载体基板中的布线连接到所述连接布线; 以及设置在外部连接台面上的焊球。 可以结合到焊球的外部连接焊盘的区域具有包括至少一个弧形部分和至少一个直线部分的外部形状。 利用这种结构，可以提供一种电子部件安装装置，其中可以减少外部连接焊盘和电路板侧焊盘与焊球的接合故障，并且可以容易地检查接合状态， 检查其中的接合部分。

公开(公告)号：US08116094B2

公开(公告)日：2012-02-14

申请号：US12401247

申请日：2009-03-10

申请人： Masato Udaka ,  Seiji Tokii

发明人： Masato Udaka ,  Seiji Tokii

IPC分类号： H05K1/18

摘要： The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGA package as a surface mounted device includes a plurality of solder balls arranged thereon and a printed circuit board includes a plurality of mounting pads corresponding respectively to the plurality of solder balls. The BGA package is connected to the mounting pads on the printed circuit board due to melting of the solder balls, thereby mounted on the printed circuit board. A concave via hole is formed on each of the mounting pads having a circular surface shape and a part of the solder ball is in the convex via hole. Here, the center of the convex via hole is apart from the center of each of the mounting pads by at least the diameter of the concave via hole.

公开(公告)号：US20090229879A1

公开(公告)日：2009-09-17

申请号：US12401247

申请日：2009-03-10

申请人： Masato Udaka ,  Seiji Tokii

发明人： Masato Udaka ,  Seiji Tokii

IPC分类号： H05K7/14 ,  H05K1/02 ,  H01R43/02

CPC分类号： H05K3/3436 ,  H01R12/523 ,  H05K1/113 ,  H05K2201/09381 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09572 ,  Y02P70/613 ,  Y10T29/49213

摘要： The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGApackage as a surface mounted device includes a plurality of solder balls arranged thereon and a printed circuit board includes a plurality of mounting pads corresponding respectively to the plurality of solder balls. The BGApackage is connected to the mounting pads on the printed circuit board due to melting of the solder balls, thereby mounted on the printed circuit board. A concave via hole is formed on each of the mounting pads having a circular surface shape and a part of the solder ball is in the convex via hole. Here, the center of the convex via hole is apart from the center of each of the mounting pads by at least the diameter of the concave via hole.

摘要翻译： 本发明提供了一种印刷电路板，其能够在安装表面安装装置时足以确保接合强度和接头可靠性，以及使用印刷电路板的表面安装装置的安装结构。 作为表面安装装置的BGA封装包括布置在其上的多个焊球，并且印刷电路板包括分别对应于多个焊球的多个安装焊盘。 BGA封装由于焊球的熔化而连接到印刷电路板上的安装焊盘，从而安装在印刷电路板上。 在具有圆形表面形状的每个安装焊盘上形成凹通孔，并且焊球的一部分在凸通孔中。 这里，凸通孔的中心至少与凹通孔的直径相距离每个安装焊盘的中心。