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    Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
    2.
    发明授权
    Printed circuit board of semiconductor package and method for mounting semiconductor package using the same 失效
    半导体封装的印刷电路板和使用其的半导体封装的安装方法

    公开(公告)号：US07576437B2

    公开(公告)日：2009-08-18

    申请号：US11598755

    申请日：2006-11-14

    申请人： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

    发明人： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

    IPC分类号： H01L23/48 ,  H01L23/495

    CPC分类号： H05K3/3421 ,  H05K3/243 ,  H05K3/282 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/613

    摘要： Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

    摘要翻译： 示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。 半导体封装的引线可以安装在绝缘基板上。 连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。 阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。 在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊料焊接涂覆到半导体封装引线的肩部。

    Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
    5.
    发明申请
    Printed circuit board of semiconductor package and method for mounting semiconductor package using the same 失效
    半导体封装的印刷电路板和使用其的半导体封装的安装方法

    公开(公告)号：US20070109758A1

    公开(公告)日：2007-05-17

    申请号：US11598755

    申请日：2006-11-14

    申请人： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

    发明人： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

    IPC分类号： H05K7/00

    CPC分类号： H05K3/3421 ,  H05K3/243 ,  H05K3/282 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/613

    摘要： Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

    摘要翻译： 示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。 半导体封装的引线可以安装在绝缘基板上。 连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。 阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。 在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊锡涂层移动到半导体封装引线的肩部。

    Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof
    7.
    发明授权
    Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof 有权
    配有耦合装置的散热器，附有散热器的存储模块及其制造方法

    公开(公告)号：US06449156B1

    公开(公告)日：2002-09-10

    申请号：US09952303

    申请日：2001-09-12

    申请人： Seong-Chan Han ,  Dong-Woo Shin ,  Dong-Chun Lee ,  Wang-Jae Lee

    发明人： Seong-Chan Han ,  Dong-Woo Shin ,  Dong-Chun Lee ,  Wang-Jae Lee

    IPC分类号： H05K720

    CPC分类号： G11C5/04

    摘要： A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.

    摘要翻译： 公开了一种新颖的散热器结构，用于安装到模块板，半导体芯片被附着到模块板上，并用于散发或扩散从半导体芯片产生的热量。 散热器包括散热器基座和用于将散热器基座耦合到模块板的耦合装置。 联接装置通过散热器底座。 联接装置包括一体形成的上主体部分和至少穿过下主体部分的孔口，以及与下主体部分一体形成的凸缘基部。 带凸缘的底座将联接装置固定在散热器底座上。 上身部的外部尺寸小于下主体部的内部尺寸。 结果，许多散热器可以稳定堆叠。

    Open socket
    10.
    发明申请
    Open socket 失效
    打开插座

    公开(公告)号：US20050118878A1

    公开(公告)日：2005-06-02

    申请号：US10868976

    申请日：2004-06-17

    申请人： Dong-Chun Lee ,  Byung-Man Kim ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Young-Soo Lee

    发明人： Dong-Chun Lee ,  Byung-Man Kim ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Young-Soo Lee

    IPC分类号： H01R33/76 ,  H01R13/24 ,  H01R24/00

    CPC分类号： H01R13/2471 ,  H01R13/111

    摘要： An open socket, into which a module can be inserted, may include: a body into which the module is insertable; a pin to contact an electrical connection member of the inserted module, the pin serving as at least a part of an electrical signal path to/from the module upon insertion thereof; an elastic biasing member to exert an elastic biasing force to cause the pin to contact the module; and at least one lower support to limit insertion depth as being a depth at which a lower portion of the inserted module comes to rest upon the at least one lower support; the body and the at least one lower support being constructed and arranged to provide a gap adjacent the at least one support, which leaves an area of the socket underlying the lower portion of the inserted module open to the outside.

    摘要翻译： 可以插入模块的开放式插座可以包括：可插入模块的主体; 一个与所插入的模块的电连接构件接触的销，所述销用作在插入模块时与模块电信号路径的至少一部分的一部分; 弹性偏置构件，以施加弹性偏压力以使销与模块接触; 以及至少一个下部支撑件，以将插入深度限制为所述插入模块的下部部分停靠在所述至少一个下部支撑件上的深度; 所述主体和所述至少一个下支撑件被构造和布置成提供邻近所述至少一个支撑件的间隙，所述间隙将所述插入模块的下部的下方的所述插座的区域留在外部。