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公开(公告)号：US10224406B2
公开(公告)日：2019-03-05
申请号：US15325985
申请日：2016-10-12
发明人： Zhichao Zhou , Yulien Chou , Yue Wu
IPC分类号： H01L21/77 , H01L27/12 , H01L29/417 , G02F1/1368
摘要： A TFT array substrate includes a glass substrate, a buffer layer on the glass substrate, a source electrode, a passivation layer on the buffer layer, a gate electrode on the passivation layer, a gate insulating layer on the passivation layer and the gate electrode, an active layer, and a pixel electrode on the gate insulating layer and the active layer. A first source hole is formed in the buffer layer. The source electrode is disposed in the first source hole. A second source hole is formed in the passivation layer and over the first source hole. The source electrode extends into the second source hole. An active layer mounting hole is formed in the gate insulating layer and over the second source hole. The active layer is in the active layer mounting hole.
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2.发明授权公开(公告)号：US10509287B2
公开(公告)日：2019-12-17
申请号：US15648631
申请日：2017-07-13
发明人： Yue Wu
IPC分类号： G02F1/1368 , H01L21/3213 , H01L21/027 , H01L21/311 , G02F1/1362 , H01L27/12 , H01L27/32
摘要： A COA substrate manufacturing method including: forming a TFT on a base substrate; forming a second insulation layer on the TFT; forming a color resist layer on the second insulation layer; forming a third insulation layer on the color resist layer; forming a through hole which exposes the drain electrode of the TFT; forming an ITO film layer on the third insulation layer; forming a photoresist layer on the ITO film layer; performing a light-shielding process to the photoresist layer on the vias-region ITO film layer and an exposure process to the photoresist layer on the non vias-region ITO film layer; developing the photoresist layer on the vias-region ITO and the non vias-region ITO film layers to obtain a photoresist layer plug covered on the vias-region ITO film layer. The photoresist is provided to fill the through hole so as to improve the quality of a display device.
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公开(公告)号：US10385169B2
公开(公告)日：2019-08-20
申请号：US16024912
申请日：2018-07-02
IPC分类号： C09D125/18 , C08J3/07 , C08J5/18 , C08L65/00 , C09D7/61 , C08J3/215 , C09D5/24 , H01L51/00 , C08L25/18 , C08K3/04 , H01B1/04 , H01B1/12 , G02F1/1343 , H01L51/10 , H01L51/44 , H01L51/52
摘要： A method for manufacturing a fullerence/PEDOT:PSS mixed solution includes the following steps: Step 1, preparing a fullerence solution by mixing fullerence molecules and water or a strong polar solvent, wherein the fullerence molecules are fullerence or fullerence derivants and the fullerence derivants are water-soluble fullerence derivants or water-insoluble fullerence derivants; and Step 2, mixing the fullerence solution and a PEDOT:PSS dilute solution of a certain concentration at a mass ration of 1:100 to 100:1 via mechanical agitation or ultrasonication to form a fullerence/PEDOT:PSS mixed solution in homogeneous dispersions.
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公开(公告)号：US20180312644A1
公开(公告)日：2018-11-01
申请号：US16024912
申请日：2018-07-02
IPC分类号： C08J3/07 , C09D5/24 , C09D7/61 , B05D1/02 , B05D3/04 , C08J3/215 , C08J5/18 , C08L25/18 , C08L65/00 , C08K3/04 , C09D125/06 , C09D125/18 , C09D165/00 , H01L51/00 , G02F1/1343 , H01L51/52 , H01L51/10 , H01L51/44
CPC分类号： C08J3/07 , C08G2261/1424 , C08G2261/3223 , C08G2261/794 , C08J3/215 , C08J5/18 , C08J2325/18 , C08J2465/00 , C08K3/045 , C08L25/18 , C08L65/00 , C09D5/24 , C09D7/61 , C09D125/18 , G02F1/13439 , G02F2202/022 , G02F2202/16 , H01B1/04 , H01B1/127 , H01L51/0003 , H01L51/0021 , H01L51/0037 , H01L51/004 , H01L51/0046 , H01L51/102 , H01L51/441 , H01L51/5206
摘要： A method for manufacturing a fullerence/PEDOT:PSS mixed solution includes the following steps: Step 1, preparing a fullerence solution by mixing fullerence molecules and water or a strong polar solvent, wherein the fullerence molecules are fullerence or fullerence derivants and the fullerence derivants are water-soluble fullerence derivants or water-insoluble fullerence derivants; and Step 2, mixing the fullerence solution and a PEDOT:PSS dilute solution of a certain concentration at a mass ration of 1:100 to 100:1 via mechanical agitation or ultrasonication to form a fullerence/PEDOT:PSS mixed solution in homogeneous dispersions.
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公开(公告)号：US09726956B2
公开(公告)日：2017-08-08
申请号：US14908080
申请日：2015-12-28
发明人： Yue Wu
IPC分类号： H01L27/12 , G02F1/1362 , G02F1/1368 , H01L21/027 , H01L21/3213 , H01L21/311 , H01L27/32
CPC分类号： G02F1/1368 , G02F1/136227 , G02F2001/136222 , G02F2001/136236 , G02F2001/13625 , H01L21/0274 , H01L21/31138 , H01L21/32133 , H01L27/1214 , H01L27/124 , H01L27/1248 , H01L27/1288 , H01L27/1296 , H01L27/3248
摘要： A COA substrate manufacturing method including: forming a TFT on a base substrate; forming a second insulation layer on the TFT; forming a color resist layer on the second insulation layer; forming a third insulation layer on the color resist layer; forming a through hole which reveals the drain electrode of the TFT; forming an ITO film layer on the third insulation layer; forming a photoresist layer on the ITO film layer; performing a light-shielding process to the photoresist layer on the vias-region ITO film layer and an exposure process to the photoresist layer on the non vias-region ITO film layer; developing the photoresist layer on the vias-region ITO and the non vias-region ITO film layers to obtain a photoresist layer plug covered on the vias-region ITO film layer. The present invention utilizes the photoresist to fill the through hole which can improve the quality of a display device.
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公开(公告)号：US20170152352A1
公开(公告)日：2017-06-01
申请号：US14786549
申请日：2015-08-20
IPC分类号： C08J3/07 , C09D125/06 , C09D7/12 , B05D3/04 , H01L51/00 , C08J3/215 , B05D1/02 , C09D165/00 , C09D5/24
CPC分类号： C08J3/07 , B05D1/02 , B05D3/0406 , C08G2261/1424 , C08G2261/3223 , C08G2261/794 , C08J3/215 , C08J5/18 , C08J2325/06 , C08J2325/18 , C08J2365/00 , C08J2465/00 , C08K3/045 , C08L25/18 , C08L65/00 , C09D5/24 , C09D7/61 , C09D125/06 , C09D125/18 , C09D165/00 , G02F1/13439 , G02F2202/022 , G02F2202/16 , H01L51/0003 , H01L51/0021 , H01L51/0037 , H01L51/004 , H01L51/0046 , H01L51/102 , H01L51/441 , H01L51/5206
摘要： A manufacture method for fullerence/PEDOT:PSS mixed solution and a manufacture method for compound transparent conductive film having fullerence/PEDOT:PSS are provided in the present invention: making fullerence/PEDOT:PSS mixed solution to manufacture a transparent conductive film; sources of applicable materials are broad and prices thereof are cheap; the fullerence/PEDOT:PSS mixed solution can be further utilized to manufacture a compound transparent conductive film having fullerence/PEDOT:PSS on substrates or a variety of devices; the present invention discloses a manufacture method for a compound transparent conductive film having fullerence/PEDOT:PSS, and when manufacturing the compound transparent conductive film having fullerence/PEDOT:PSS via wet coating process which is with low cost and high efficiency comparing with manufacture of ITO film, and furthermore expensive PVD equipment can be waived, production cost can be reduced, manufacturing method can be simplified at the same time, production time is shorter and economic efficiency can be increased; the compound transparent conductive film having fullerence/PEDOT:PSS manufacturing in the present invention has high conductivity and high light transmittance to replace ITO films in the market.
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公开(公告)号：US20170141236A1
公开(公告)日：2017-05-18
申请号：US14777744
申请日：2015-08-21
发明人： Yue Wu
IPC分类号： H01L29/786 , H01L27/12 , H01L21/02 , H01L29/49
CPC分类号： H01L29/78606 , H01L21/02115 , H01L21/022 , H01L21/02282 , H01L21/02532 , H01L21/02565 , H01L21/02584 , H01L21/02592 , H01L21/0262 , H01L21/02631 , H01L27/1222 , H01L27/1225 , H01L27/127 , H01L27/1288 , H01L29/06 , H01L29/4908 , H01L29/66765 , H01L29/66969 , H01L29/78618 , H01L29/78669 , H01L29/7869 , H01L29/78696
摘要： The present invention provides a TFT substrate structure and a manufacturing method thereof. In the manufacturing method of a TFT substrate structure according to present invention, a graphene layer is formed on a semiconductor layer and after the formation of a second metal layer, the second metal layer is used as a shielding mask to conduct injection of fluoride ions into the graphene layer to form a modified area in a portion of the graphene layer that is located on and corresponds to a channel zone of the semiconductor layer, wherein the modified area of the graphene layer shows a property of electrical insulation and a property of blocking moisture/oxygen so as to provide protection to the channel zone; portions of the graphene layer that are located under source and drain electrodes are not doped with ions and preserves the excellent electrical conduction property of graphene and thus electrical connection between the source and drain electrodes and the semiconductor layer can be achieved without formation of a via in the graphene layer, making a TFT device so manufactured showing excellent I-V (current-voltage) output characteristics and stability, saving one mask operation process, shortening the manufacturing time, and lowering down the manufacturing cost.
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公开(公告)号：US09371170B2
公开(公告)日：2016-06-21
申请号：US13704241
申请日：2012-10-19
发明人： Yuchun Hsiao , Yicheng Kuo , Yue Wu
CPC分类号： B65D81/051 , B65D81/03 , B65D81/052 , B65D81/053 , B65D81/054 , B65D81/055 , B65D81/057 , B65D81/107 , B65D85/00 , B65D85/48
摘要： The present invention provides a package cushioning material for liquid crystal glass, which includes an air sack sheet and scratch protection layers arranged at contact sites of the air sack sheet with four corners of a piece of liquid crystal glass. The air sack sheet is formed by connecting a plurality of air sacks. The scratch protection layers are single-sided adhesive tapes or foamed PE cushioning materials. The package cushioning material for liquid crystal glass according to the present invention uses an air sack sheet as a basic material to be used in combination with scratch protection layers arranged at contact sites of the air sack sheet with the four corners of the liquid crystal glass so as to prevent the liquid crystal glass from scratching and breaking the air sacks thereby providing improved effect of cushioning and thus highly effective protection of the liquid crystal glass during transportation.
摘要翻译： 本发明提供了一种用于液晶玻璃的包装缓冲材料，其包括空气袋片和在具有一片液晶玻璃的四个角的空气袋片的接触位置处布置的防刮层。 空气袋片通过连接多个空气袋而形成。 防刮层是单面胶带或泡沫PE缓冲材料。 根据本发明的用于液晶玻璃的包装缓冲材料使用空气袋片材作为基本材料，与在液袋玻璃的四个角部布置在空气袋片材的接触位置处的防刮层组合使用 以防止液晶玻璃刮擦和破坏空气袋，从而提供改进的缓冲效果，从而在运输过程中高度有效地保护液晶玻璃。
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公开(公告)号：US09882055B2
公开(公告)日：2018-01-30
申请号：US15616931
申请日：2017-06-08
发明人： Yue Wu
IPC分类号： H01L29/786 , H01L21/84 , H01L21/02 , H01L29/49 , H01L27/12
CPC分类号： H01L29/78606 , H01L21/02115 , H01L21/022 , H01L21/02282 , H01L21/02532 , H01L21/02565 , H01L21/02584 , H01L21/02592 , H01L21/0262 , H01L21/02631 , H01L27/1222 , H01L27/1225 , H01L27/127 , H01L27/1288 , H01L29/06 , H01L29/4908 , H01L29/66765 , H01L29/66969 , H01L29/78618 , H01L29/78669 , H01L29/7869 , H01L29/78696
摘要： A manufacturing method of a TFT substrate structure is provided, in which a graphene layer is formed on a semiconductor layer and after the formation of a second metal layer, the second metal layer is used as a shielding mask to conduct injection of fluoride ions into the graphene layer to form a modified area in a portion of the graphene layer that is located on and corresponds to a channel zone of the semiconductor layer. The modified area of the graphene layer shows a property of electrical insulation and a property of blocking moisture/oxygen so as to provide protection to the channel zone. Portions of the graphene layer that are located under source and drain electrodes are not doped with ions and preserve the excellent electrical conduction property of graphene to provide electrical connection between the source and drain electrodes and the semiconductor layer.
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公开(公告)号：US08801258B2
公开(公告)日：2014-08-12
申请号：US13703901
申请日：2012-10-19
发明人： Yuchun Hsiao , Pangling Zhang , Yue Wu , Quan Li
IPC分类号： F21V7/04
CPC分类号： G02B6/0013 , G02B6/0031 , G02B6/0088
摘要： The present invention provides a backlight module, which includes a backplane, a reflector plate arranged inside the backplane, a light guide plate arranged on the reflector plate, an optic film assembly arranged above the light guide plate, a backlight source arranged inside the backplane and corresponding to the light guide plate, a mold frame mounted to the backplane, and a resilient block wall that is arranged above the backlight source and a light incidence end of the light guide plate and is fixed to the mold frame by means of force-fitting, bonding, or snap fitting. The resilient block wall has a bottom face and a side face perpendicular to the bottom face. The bottom face and the side face are set in tight engagement with an upper surface of the light guide plate and the backlight source.
摘要翻译： 本发明提供了一种背光模块，其包括背板，布置在背板内的反射板，布置在反射板上的导光板，布置在导光板上方的光学膜组件，布置在背板内部的背光源， 对应于导光板，安装到背板的模架，以及布置在背光源上方的弹性块壁和导光板的光入射端，并通过力配合固定到模架上 ，粘合或卡扣配合。 弹性块壁具有垂直于底面的底面和侧面。 底面和侧面设置成与导光板和背光源的上表面紧密接合。
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