摘要:
A processing method of a substrate includes: a step of forming an Si—C based film and a resist film in turn on an objective film to be etched that has been formed on a substrate; a first etching step of etching the Si—C based film making use of the resist film as a mask; and a second etching step of etching the objective film to be etched making use of the resist film and the Si—C based film as a mask. The processing method further includes a peeling-off step of peeling-off the resist film at a desired timing. The peeling-off step includes a preparing step of preparing an organic solvent as a release agent, and an applying step of applying the organic solvent to the resist film.
摘要:
The present invention is a method of manufacturing a semiconductor device from a layered body including: a semiconductor substrate; a high dielectric film formed on the semiconductor substrate; and an SiC-based film formed on a position upper than the high dielectric film, the SiC-based film having an anti-reflective function and a hardmask function. The present invention comprises a plasma-processing step for plasma-processing the SiC-based film and the high dielectric film to modify the SiC-based film and the high dielectric film by an action of a plasma; and a cleaning step for wet-cleaning the SiC-based film and the high dielectric film modified in the plasma-processing step to collectively remove the SiC-based film and the high dielectric film.
摘要:
The present invention is a method of manufacturing a semiconductor device from a layered body including: a semiconductor substrate; a high dielectric film formed on the semiconductor substrate; and an SiC-based film formed on a position upper than the high dielectric film, the SiC-based film having an anti-reflective function and a hardmask function. The present invention comprises a plasma-processing step for plasma-processing the SiC-based film and the high dielectric film to modify the SiC-based film and the high dielectric film by an action of a plasma; and a cleaning step for wet-cleaning the SiC-based film and the high dielectric film modified in the plasma-processing step to collectively remove the SiC-based film and the high dielectric film.
摘要:
A plasma nitriding process is followed by a selective etching process which removes a silicon oxynitride film formed on surfaces of both an element separation film and an insulation film while leaving a silicon nitride film formed on an electrode layer. The selective etching process removes the silicon oxynitride film formed on the surfaces of the element separation film and the insulation film.
摘要:
A capacitor having a high quality and a manufacturing method of the same are provided. A capacitor has a lower electrode formed on an oxide film, a dielectric layer formed on the lower electrode, an upper electrode formed so as to face the lower electrode with the dielectric layer between, and an upper electrode formed so as to cover the upper electrode, an opening portion of the upper electrode and an opening portion of the dielectric layer. By forming the upper electrode on the dielectric layer, it is possible to pattern the dielectric layer by using the upper electrode as a mask, and provide a capacitor having a high-quality dielectric layer by preventing impurity diffusion into the dielectric layer. By forming the upper electrode on the dielectric layer, it is possible to prevent the dielectric layer from being exposed to etching liquid, liquid developer, etc.
摘要:
A dielectric film capacitor includes a lower electrode having an opening and formed of a material including platinum, a dielectric film provided over the lower electrode and including an oxide having an ABOx crystal structure, and an upper electrode provided over the dielectric film. The planar area of the lower electrode is 50% or more of the area of a formation region of the dielectric film. A dielectric film capacitor includes a lower electrode formed of a material including platinum and having a thickness of 10 to 100 nm, a dielectric film provided over the lower electrode and including an oxide having an ABOx crystal structure, and an upper electrode provided over the dielectric film.
摘要:
An electrostatic capacitance sensor, includes an electrostatic capacitance detector, an operational amplifier in which a feedback impedance circuit is connected between an output terminal and an inverse input terminal of the operational amplifier, a signal line connected between the inverse input terminal of the operational amplifier and the electrostatic capacitance detector, an alternating-current signal generator connected to a non-inverse input terminal of the operational amplifier, and a shield for shielding at least a portion of the signal line, the shield being connected to the non-inverse input terminal of the operational amplifier and the alternating-current signal generator. The electrostatic capacitance detector includes a detecting electrode and a shield electrode. The detecting electrode includes a detector-detecting electrode for detecting an object to be detected and an electrode introducer-detecting electrode for introducing an electrode to the detector-detecting electrode. The shield electrode is connected to the shield. At least a portion of the electrode introducer-detecting electrode is shielded by the shield electrode.
摘要:
There is provided a method for obtaining a high-purity alkyladamantyl ester from an alkyladamantyl ester composition containing a large quantity of alkyladamantyl halide obtained by, for example, alkylating raw material 2-adamantanone obtained through oxidation of adamantane by use of an organic metal reagent and then causing an acid halide to react with the resulting product, efficiently by a simple process. To an alkyladamantyl ester composition containing an alkyladamantyl halide such as 2-chloro-2-methyladamantane in an amount of larger than 0.5 parts by weight based on 100 parts by weight of alkyladamantyl ester such as 2-methyl-2-adamantyl methacrylate, a mixed solution of, for example, methanol and a sodium hydroxide aqueous solution is added. By bringing the alkali compound into contact with the alkyladamantyl halide in a homogeneous system so as to convert the halide into a compound which produces no acid when heated, the amount of the alkyladamantyl halide in the composition is reduced to 0.5 parts by weight or less based on 100 parts by weight of the alkyladamantyl ester, after which distillation is carried out.
摘要:
There is provided a probing and measurement system for measuring a capacitance value of a capacitance to be measured, by removing any influence made by a parasitic capacitance and a fluctuation thereof within a shield box 11. The probing and measurement system comprises a prober 1, a signal line having one end to be in contact with a sample to be measured, a shield line surrounding the signal line, and a capacitance measurement circuit 6. The capacitance measurement circuit 6 comprises an operational amplifier 61 having an inverting input terminal connected to the other end of the signal line and a non-inverting input terminal connected to the shield line, wherein an imaginary short state exists between the inverting input terminal and the non-inverting input terminal, and wherein a signal having a value corresponding to an electrostatic capacitance of the sample to be measured is outputted when an AC signal is applied to the non-inverting input terminal. Conductive portions of the shield box 11, conductive portions of a stand 13, a surface of the stand which contacts with the sample to be measured, and the shield line are placed at the same electric potential.
摘要:
The invention provides a MOS semiconductor memory device that achieves excellent data retention characteristics while also achieving high-speed data write performance, low-power operation performance, and high reliability. A MOS semiconductor memory device 601 includes a first insulating film 111 and fifth insulating film 115 having large bandgaps 111a and 115a, a third insulating film 113 having the smallest bandgap 113a, and a second insulating film 112 and fourth insulating film 114 interposed between the third insulating film 113 and the first and fifth insulating films 111 and 115, respectively, and having intermediate bandgaps 112a and 114a.