公开(公告)号：US06612912B2

公开(公告)日：2003-09-02

申请号：US09371003

申请日：1999-08-10

申请人： Kan Yasui ,  Souichi Katagiri ,  Shigeo Moriyama ,  Yoshio Kawamura ,  Ryousei Kawai ,  Sadayuki Nishimura ,  Masahiko Sato

发明人： Kan Yasui ,  Souichi Katagiri ,  Shigeo Moriyama ,  Yoshio Kawamura ,  Ryousei Kawai ,  Sadayuki Nishimura ,  Masahiko Sato

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B1/04 ,  B24B37/042 ,  B24B53/12

摘要： A method for fabricating a semiconductor device includes grindstone surface activation treatment by means of a brush or ultrasonic wave carried out when a concave/convex pattern of a semiconductor wafer is planarized by polishing a semiconductor wafer held by a wafer holder by using a grindstone constituted of abrasive grains and material for holding the abrasive grains onto which the semiconductor wafer is pressed with relative motion. The semiconductor wafer is processed with high removal rate and the polishing thickness is controlled accurately.

摘要翻译： 一种制造半导体器件的方法包括：当半导体晶片的凹凸图案通过使用由晶片保持器保持的半导体晶片进行平面化而进行的刷子或超声波的磨石表面激活处理， 磨料颗粒和用于保持磨料颗粒的材料，半导体晶片被相对运动地压在其上。 半导体晶片以高去除率进行处理，并且精确地控制抛光厚度。

公开(公告)号：US06524961B1

公开(公告)日：2003-02-25

申请号：US09359760

申请日：1999-07-22

申请人： Souichi Katagiri ,  Kan Yasui ,  Ryousei Kawai ,  Sadayuki Nishimura ,  Masahiko Sato ,  Yoshio Kawamura ,  Shigeo Moriyama

发明人： Souichi Katagiri ,  Kan Yasui ,  Ryousei Kawai ,  Sadayuki Nishimura ,  Masahiko Sato ,  Yoshio Kawamura ,  Shigeo Moriyama

IPC分类号： H01L21461

CPC分类号： B24B37/245 ,  B24D3/32 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76819 ,  H01L21/7684

摘要： A film formed on a surface of a wafer on which an integrated circuit is to be constructed can be planarized by using a fixed abrasive tool regardless of the width of elements of a pattern underlying the film. The fixed abrasive tool is liable to form scratches in the surface of the film. A planarizing process of the present invention employs a fixed abrasive tool containing substances harder than the film to be planarized in a content of 10 ppm or below and having a mean pore diameter of 0.2 &mgr;m or below.

公开(公告)号：US5609511A

公开(公告)日：1997-03-11

申请号：US421247

申请日：1995-04-13

申请人： Shigeo Moriyama ,  Yoshio Kawamura ,  Yoshio Homma ,  Kikuo Kusukawa ,  Takeshi Furusawa

发明人： Shigeo Moriyama ,  Yoshio Kawamura ,  Yoshio Homma ,  Kikuo Kusukawa ,  Takeshi Furusawa

IPC分类号： B23Q17/24 ,  B24B49/04 ,  B24B49/12 ,  B24D7/12 ,  H01L21/304 ,  B24B49/00 ,  B24B51/00

CPC分类号： B24B37/013 ,  B24B49/12 ,  B24D7/12

摘要： Disclosed is a method of polishing a thin film layer to be polished, which is formed on the surface of a substrate, by pressing the substrate on the surface of a polishing pad and relatively moving the substrate and the polishing pad, the method comprising the steps of: detecting the position of a front surface of the thin film layer to be polished using a first sensor and also detecting the position of a bottom surface of the thin film layer using a second sensor, on the way of the polishing; calculating the residual thickness of the thin film layer on the basis of the detected positions of the front and bottom surfaces of the thin film layer; and controlling the processing condition of the subsequent polishing on the basis of the calculated residual thickness of the thin film layer.

摘要翻译： 本发明公开了一种通过将基板压在抛光垫的表面上并使基板和抛光垫相对移动而形成在基板表面上的抛光薄膜层的方法，该方法包括步骤 使用第一传感器检测待研磨的薄膜层的前表面的位置，并且在抛光的同时使用第二传感器检测薄膜层的底面的位置; 基于检测到的薄膜层的前表面和底表面的位置计算薄膜层的剩余厚度; 并根据计算出的薄膜层的残留厚度来控制后续研磨的处理条件。

公开(公告)号：US4045141A

公开(公告)日：1977-08-30

申请号：US695556

申请日：1976-06-14

申请人： Shigeo Moriyama ,  Yoshio Kawamura

发明人： Shigeo Moriyama ,  Yoshio Kawamura

IPC分类号： G01B9/04 ,  G01B11/02

CPC分类号： G01B9/04 ,  G01B11/02

摘要： Description is made of improvements in a photoelectric microscope which is employed for the measurement of a very small distance. According to this invention, an optical system for making point-symmetric images is disposed in an optical path of an objective of a photoelectric microscope so as to form on an identical focal plane a pair of (two) images of a reference line (or mark) on a test piece which are in the relation of point symmetry to each other, and the distance between the pair of (two) images is measured, whereby the deviating distance of the reference line (or mark) on the test piece from the optic axis of the objective is evaluated. The distance between the pair of images is evaluated by gauging the time difference between two detection signals which are obtained by scanning the pair of images at equal speeds with photoelectric detectors.

摘要翻译： 描述用于测量非常小距离的光电显微镜的改进。 根据本发明，用于制造点对称图像的光学系统设置在光电显微镜的物镜的光路中，以便在同一焦平面上形成参考线（或标记）的一对（两个）图像 ），并且测量一对（两个）图像之间的距离，由此测试片上的参考线（或标记）与光学元件的偏离距离 评估目标轴。 通过测量通过用光电检测器以等速扫描一对图像而获得的两个检测信号之间的时间差来评估该对图像之间的距离。

公开(公告)号：US5981399A

公开(公告)日：1999-11-09

申请号：US894308

申请日：1997-08-14

申请人： Yoshio Kawamura ,  Tatuharu Yamamoto ,  Shigeo Moriyama ,  Yoshifumi Kawamoto ,  Natsuki Yokoyama ,  Fumihiko Uchida ,  Minoru Hidaka ,  Miyako Matsui

发明人： Yoshio Kawamura ,  Tatuharu Yamamoto ,  Shigeo Moriyama ,  Yoshifumi Kawamoto ,  Natsuki Yokoyama ,  Fumihiko Uchida ,  Minoru Hidaka ,  Miyako Matsui

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/677

CPC分类号： H01L21/67167 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67748

摘要： A semiconductor device fabrication apparatus having multiple processing chambers for different processes, where a substrate is carried in and out in a sophisticated manner, with their different internal ambient conditions being retained, so that the substrate is free from contamination, thereby manufacturing high-quality semiconductor devices at high throughput. The apparatus includes a movable buffer chamber having a wafer carriage means within a transfer chamber which faces a process chamber, an evacuation means which evacuates of gas the buffer chamber, transfer chamber and process chamber independently, a gas feed means, and a control means.

摘要翻译： PCT No.PCT / JP95 / 00210 Sec。 371日期1997年8月14日 102（e）日期1997年8月14日PCT提交1995年2月15日PCT公布。 公开号WO96 / 25760 PCT 日期1996年8月22日一种半导体器件制造装置，具有用于不同工艺的多个处理室，其中衬底以复杂的方式进出，同时保持其不同的内部环境条件，使得衬底没有污染，从而 以高产量制造高品质半导体器件。 该装置包括可移动缓冲室，其具有面向处理室的传送室内的晶片托架装置，独立地排出缓冲室，传送室和处理室的气体的抽气装置，气体供给装置和控制装置。

公开(公告)号：US5628828A

公开(公告)日：1997-05-13

申请号：US397991

申请日：1995-03-03

申请人： Yoshio Kawamura ,  Shigeo Moriyama ,  Tatuharu Yamamoto ,  Fumihiko Uchida

发明人： Yoshio Kawamura ,  Shigeo Moriyama ,  Tatuharu Yamamoto ,  Fumihiko Uchida

IPC分类号： H01L21/677 ,  C23C16/44 ,  C23C16/458 ,  C23C16/54 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/304 ,  C23C16/00

CPC分类号： H01L21/67167 ,  C23C16/4412 ,  C23C16/4583 ,  C23C16/54 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67748 ,  Y10S414/139

摘要： Process equipment and method for processing a semiconductor device comprising a buffer chamber, at least one process chamber connected to the buffer chamber through an opening portion, a holding/carrying unit disposed at a position facing the opening portion for holding and carrying a member to be processed such as a wafer, and a carrier unit disposed in the buffer chamber for transferring the member to be processed to and from the holding/carrying unit. The holding/carrying unit includes a flattened surface closely facing the opening portion for holding an atmosphere in the at least one process chamber independently from an atmosphere in the buffer chamber. The opening portion has a flattened surface closely facing the flattened surface of the holding/carrying unit.

摘要翻译： 用于处理半导体器件的工艺设备和方法，包括缓冲室，通过开口部连接到缓冲室的至少一个处理室，设置在面向开口部分的位置处的保持/承载单元，用于保持和承载构件 处理如晶片，以及设置在缓冲室中的载体单元，用于将待加工的构件传送到保持/携带单元。 保持/携带单元包括紧密面向开口部分的平坦表面，用于独立于缓冲室中的气氛保持至少一个处理室中的气氛。 开口部具有与保持/承载单元的平坦表面紧密相对的平坦表面。

公开(公告)号：US4798470A

公开(公告)日：1989-01-17

申请号：US927939

申请日：1986-11-07

申请人： Shigeo Moriyama ,  Toshiei Kurosaki ,  Tsuneo Terasawa ,  Shinji Okazaki ,  Yoshio Kawamura

发明人： Shigeo Moriyama ,  Toshiei Kurosaki ,  Tsuneo Terasawa ,  Shinji Okazaki ,  Yoshio Kawamura

IPC分类号： G03F9/00 ,  G01B11/00

CPC分类号： G03F9/7026 ,  G03F9/7076 ,  G03F9/7084

摘要： A pattern printing method includes a step of printing a pattern on a wafer on the basis of a target mark provided on the surface of the wafer which is opposite to the surface thereof on which the pattern is to be printed. Also disclosed is a pattern printing apparatus which comprises detecting means for detecting a target mark provided on the surface of a wafer which is opposite to the surface thereof on which a pattern is to be printed, and pattern printing means for printing the pattern on the pattern printing surface of the wafer on the basis of mark position data obtained by the detecting means.

摘要翻译： 图案印刷方法包括基于设置在与要印刷图案的表面相对的晶片表面上的目标标记在晶片上印刷图案的步骤。 还公开了一种图案打印装置，其包括检测装置，用于检测设置在与其上要印刷图案的表面相对的晶片表面上的目标标记，以及用于在图案上印刷图案的图案印刷装置 基于由检测装置获得的标记位置数据，晶片的印刷表面。

公开(公告)号：US4153341A

公开(公告)日：1979-05-08

申请号：US783141

申请日：1977-03-31

申请人： Yoshio Kawamura ,  Shigeo Moriyama

发明人： Yoshio Kawamura ,  Shigeo Moriyama

IPC分类号： G03B13/36 ,  G02B7/28 ,  G02B21/00 ,  G03B27/34 ,  G11B7/09 ,  H01L21/027 ,  H01L21/30 ,  H04N5/232 ,  G02B7/11

CPC分类号： G11B7/0914 ,  G02B7/28

摘要： This invention relates to an automatic focusing apparatus, in that a position of a substrate mounted on the base of the apparatus is detected as a pressure value by a first detecting means, such as an air micrometer, in that second detecting means, such as an air micrometer, are provided on a portion of the apparatus to determine a reference pressure, gas supplied into the second detecting means is derived from the same supply source as that of the first detecting means, and further, in that the base can be controlled and moved until the difference between the reference pressure and the detected pressure reaches a predetermined constant value, whereby the surface of the sample can be automatically positioned at a desired focusing position.

摘要翻译： 本发明涉及一种自动聚焦装置，其特征在于，通过第一检测装置（例如气流千分尺）将安装在装置的基座上的基板的位置作为压力值检测为第二检测装置，例如 空气千分表设置在设备的一部分上以确定参考压力，供应到第二检测装置中的气体源自与第一检测装置相同的供应源，并且还可以控制基座， 移动直到参考压力和检测到的压力之间的差达到预定的恒定值，由此样品的表面可以自动地定位在期望的聚焦位置。

公开(公告)号：US06723144B2

公开(公告)日：2004-04-20

申请号：US10308088

申请日：2002-12-03

申请人： Souichi Katagiri ,  Kan Yasui ,  Ryousei Kawai ,  Sadayuki Nishimura ,  Masahiko Sato ,  Yoshio Kawamura ,  Shigeo Moriyama

发明人： Souichi Katagiri ,  Kan Yasui ,  Ryousei Kawai ,  Sadayuki Nishimura ,  Masahiko Sato ,  Yoshio Kawamura ,  Shigeo Moriyama

IPC分类号： B24D302

CPC分类号： B24B37/245 ,  B24D3/32 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76819 ,  H01L21/7684

摘要： A film formed on a surface of a wafer on which an integrated circuit is to be constructed can be planarized by using a fixed abrasive tool regardless of the width of elements of a pattern underlying the film. The fixed abrasive tool is liable to form scratches in the surface of the film. A planarizing process of the present invention employs a fixed abrasive tool containing substances harder than the film to be planarized in a content of 10 ppm or below and having a mean pore diameter of 0.2 &mgr;m or below.

摘要翻译： 形成在其上将要构造集成电路的晶片的表面上的膜可以通过使用固定的研磨工具进行平面化，而与薄膜下面的图案的元件的宽度无关。 固定的研磨工具易于在膜表面形成划痕。 本发明的平面化方法使用含有比待平坦化的膜更硬的物质的固定研磨工具，其含量为10ppm以下，平均孔径为0.2μm以下。

公开(公告)号：US6077027A

公开(公告)日：2000-06-20

申请号：US289677

申请日：1999-04-12

申请人： Yoshio Kawamura ,  Hideo Kashima ,  Shigeo Moriyama

发明人： Yoshio Kawamura ,  Hideo Kashima ,  Shigeo Moriyama

IPC分类号： B65G49/07 ,  H01L21/677 ,  B25J17/00

CPC分类号： H01L21/67742 ,  Y10S414/139 ,  Y10T74/20329

摘要： In order to manufacture a semiconductor device of high performance a small-sized transfer arm mechanism, capable of retaining a predetermined transfer stroke, is put to practical use without any increase in the height of the arm mechanism. The transfer arm includes arcuate portions having center axes different from each other, and restraint generating means for generating restraints in directions where the individual center axes are attracted. This way, a plurality of arms are joined by joints having a structure for transmitting rolling motions to the arcuate portions contacting each other to thereby control the drive shaft of the arcuate portions rotationally and thereby move the arms. This transfer arm mechanism is used in various environments including semiconductor manufacturing, such as DRAMs.

摘要翻译： 为了制造高性能的半导体装置，能够保持预定的传送冲程的小型传送臂机构被实际使用，而不会增加臂机构的高度。 传送臂包括具有彼此不同的中心轴的弓形部分，以及用于在各个中心轴被吸引的方向上产生约束的约束产生装置。 这样，多个臂通过具有用于将滚动运动传递到彼此接触的弓形部分的结构的接头连接，从而旋转地控制弓形部分的驱动轴，从而移动臂。 该转移臂机构用于包括半导体制造在内的各种环境，例如DRAM。