摘要:
This invention relates to a method of producing a metal-contained composite material from a metal and a sinterable material such as a ceramic material, and to a metal-contained composite material produced by the method. Conventional composite materials consisting of metal and ceramic material do not have sufficient mechanical and electrical properties, under some conditions in use, and are too expensive to be applied extensively. To solve this problem, the invention provides a manufacturing method comprising a process of fabricating a roll of a laminate consisting of a metal strip and a sinterable material, by winding up the laminate, and a process of subjecting the roll to plastic working; a manufacturing method including a heat treatment process carried out at a predetermined temperature, in addition to the above processes; and metal-contained composite materials produced by these methods. The metal-contained composite materials produced by the methods of the invention can be suitably used for machine parts, electrical sliding contact materials, electrical and thermal conductors, electromagnetic shielding materials, and the like.
摘要:
This invention discloses an oxide superconductor shaped body including a noble metal layer formed on at least one surface of an oxide superconductor layer formed on a substrate, and a method of manufacturing oxide superconductor shaped body.
摘要:
A method for producing a multilayer printed wiring board by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) over a first insulating laminate (12), and second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern over through studs (15) and a second insulating laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.
摘要:
Many boards 7 to be processed are disposed within a metal chamber 1 in an isolated state, and many ground electrode plates 9 are disposed near by both surfaces of the boards 7 so as to be at the same potential as the chamber 1. While a microwave generated by a magnetron 3 from an upper portion of the chamber 1 is applied in the chamber 1, both surfaces of the boards 7 are processed at a time with plasma by using glow discharges produced between the boards 7 and plates 9 due to a difference in high-frequency potential between the boards 7 and plates 9 under presence of reaction gas.
摘要:
Disclosed herein is a ceramic superconductor comprising a ceramic superconductive member, and a high-conductivity metal layer covering the ceramic superconductive member. At least one portion of the metal layer having low electrical conductivity or low thermal conductivity. Also disclosed is a method of manufacturing a ceramic superconductor, comprising the steps of filling a ceramic superconductor or a precursor thereof in a high-conductivity metal pipe, thereby forming a composite member, rolling the composite member into a ceramic superconductor element of a desired shape, which comprises a ceramic superconductive member and a high-conductivity metal layer covering the ceramic superconductive member, performing a predetermined heat treatment on the ceramic superconductor element, and alloying a predetermined portion of the high-conductivity metal layer, thereby rendering the portion less conductive either electrically or thermally.
摘要:
A method of manufacturing an oxide superconductor including (a) alternately laminating at least one first layer including an oxide superconductor or a precursor thereof with at least one second layer including a metal material to form a laminated body, (b) forming an outermost metal coating layer of the metal material on the laminated body to form a laminated structure, and (c) heating and cooling the laminated structure or elongating the laminated structure into a desired shape and then carrying out heating and cooling.
摘要:
A method for manufacturing a superconductive multilayer circuit has a first thin film forming step for forming a thin film, which is composed of superconductive material or a similar material thereto, on a substrate, a first circuit layer forming step for forming a superconductive circuit by discharging a specific component from a predetermined part of the thin film or implanting the component in the thin film, a second thin film forming step for forming a thin film, which is composed of a superconducting material or the simulant thereto, on the first circuit layer, and a second circuit layer forming step for forming a superconductive circuit by removing a specific component from a predetermined part of the thin film or implanting the component in the thin film.
摘要:
A copper alloy is disclosed which comprises 0.01 to 1.0 wt. % of Cr, 0.01 to 8 wt. % of Sn, 0.001 to 5 wt. % of at least one of 0.001 to 5 wt. % of Zn, 0.001 to 0.5 wt. % of Mn and 0.001 to 0.2 wt. % of Mg and the remainder of Cu, the content of O.sub.2 therein being not more than 0.005 wt. %. A method of manufacturing therefor is described wherein, after the hot processing or the heat treatment at 800.degree. to 950.degree. C., the alloy is cooled by passage through a region of 800.degree. to 400.degree. C. within 20 minutes, then following cold processing, heating treatment is carried out for at least 1 minute at 400.degree. to 650.degree. C. The alloy with the composition aforementioned is used as an alloy material for electric or electronic instruments.
摘要:
The present invention provides a method of manufacturing superconductive products comprising heating a superconductive matter or incorporation including its precursor to a temperature higher than its or its precursor's melting point to melt it or its precursor, and then solidifying and cooling it in a direction in such a way that it is re-crystalized to have an orientation in the longitudinal direction of its incorporation.
摘要:
A method for forming a superconducting circuit is disclosed, comprising the steps of forming a mask pattern on a superconducting layer, forming a covering layer, containing a modifying element for superconductor, on the resultant structure, diffusing the modifying element for a superconductor, which is contained in the covering layer, into the superconducting layer to modify a corresponding location to a nonsuperconducting layer. A method for forming a multi-layer superconducting circuit is also disclosed, comprising sequentially repeating the same steps as set forth above over a substrate.