-
公开(公告)号：US20050151250A1
公开(公告)日：2005-07-14
申请号：US10998182
申请日：2004-11-29
申请人： Shuichi Chiba , Masahiko Ishiguri , Koichi Murata , Eiji Watanabe , Michiaki Tamagawa , Akira Satoh , Yasushi Toida , Kazuhiro Misawa
发明人： Shuichi Chiba , Masahiko Ishiguri , Koichi Murata , Eiji Watanabe , Michiaki Tamagawa , Akira Satoh , Yasushi Toida , Kazuhiro Misawa
IPC分类号： H01L21/288 , H01L21/60 , H01L23/00 , H01L23/485 , H01L23/544 , H01L29/40 , H01L29/78
CPC分类号： H01L24/05 , H01L21/2885 , H01L22/34 , H01L23/562 , H01L24/03 , H01L24/11 , H01L2224/02125 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/1147 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12044 , H01L2924/19043 , H01L2924/00014
摘要： A semiconductor device includes a substrate, a pad electrode formed on the substrate and a bump electrode formed on the pad electrode, wherein the pad electrode has an irregular flaw, and there is provided a pattern covering the irregular flaw between the pad electrode an the bump electrode.
摘要翻译： 半导体器件包括衬底，形成在衬底上的焊盘电极和形成在焊盘电极上的凸起电极，其中焊盘电极具有不规则的缺陷，并且提供覆盖焊盘电极与凸块之间的不规则缺陷的图案 电极。
-
公开(公告)号：US07095045B2
公开(公告)日：2006-08-22
申请号：US10998182
申请日：2004-11-29
申请人： Shuichi Chiba , Masahiko Ishiguri , Koichi Murata , Eiji Watanabe , Michiaki Tamagawa , Akira Satoh , Yasushi Toida , Kazuhiro Misawa
发明人： Shuichi Chiba , Masahiko Ishiguri , Koichi Murata , Eiji Watanabe , Michiaki Tamagawa , Akira Satoh , Yasushi Toida , Kazuhiro Misawa
CPC分类号： H01L24/05 , H01L21/2885 , H01L22/34 , H01L23/562 , H01L24/03 , H01L24/11 , H01L2224/02125 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/1147 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12044 , H01L2924/19043 , H01L2924/00014
摘要： A semiconductor device includes a substrate, a pad electrode formed on the substrate and a bump electrode formed on the pad electrode, wherein the pad electrode has an irregular flaw, and there is provided a pattern covering the irregular flaw between the pad electrode an the bump electrode.
摘要翻译： 半导体器件包括衬底，形成在衬底上的焊盘电极和形成在焊盘电极上的凸起电极，其中焊盘电极具有不规则的缺陷，并且提供覆盖焊盘电极与凸块之间的不规则缺陷的图案 电极。
-
公开(公告)号：US07217998B2
公开(公告)日：2007-05-15
申请号：US10994680
申请日：2004-11-23
CPC分类号： H01L23/36 , H01L23/13 , H01L23/492 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/48235 , H01L2224/49 , H01L2224/73207 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06586 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/0401
摘要： A semiconductor device is disclosed that includes a semiconductor element, a circuit board electrically connected to the semiconductor element, a heat dissipation member fixed to the first surface of the circuit board and thermally coupled to the semiconductor element, and an interposer provided to the second surface of the circuit board facing away from the heat dissipation member. The interposer is electrically connected to the circuit board. An opening is formed in the circuit board and the interposer so that the semiconductor element is thermally coupled directly to the heat dissipation member through the opening.
摘要翻译： 公开了一种半导体器件，其包括半导体元件，电连接到半导体元件的电路板，固定到电路板的第一表面并热耦合到半导体元件的散热构件，以及设置到第二表面的插入件 电路板背离散热部件。 插入器电连接到电路板。 在电路板和插入件中形成开口，使得半导体元件通过开口直接热耦合到散热构件。
-
公开(公告)号：US20070004091A1
公开(公告)日：2007-01-04
申请号：US11320737
申请日：2005-12-30
IPC分类号： H01L21/00
CPC分类号： H01L23/433 , H01L23/055 , H01L23/373 , H01L24/32 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/351 , H01L2924/01082 , H01L2924/00012 , H01L2924/00 , H01L2224/13111 , H01L2924/00014
摘要： A semiconductor device having high reliability and excellent heat radiation and a method for manufacturing the device at low coat. A semiconductor element and a cover as a heat radiation member are bonded through a solder-containing carbon member having a structure that outside solder layers are formed on a surface of a solder-containing carbon sintered body formed by impregnating a carbon sintered body with solder. By using the sintered body for a junction between the semiconductor element and the cover, thermal stress during heat generation in the semiconductor element can be relieved while securing high heat radiation. By impregnating the sintered body with inexpensive solder, the sintered body and the outside solder layers can be tightly bonded. Through the outside solder layers, the semiconductor element and the cover can be tightly bonded. Thus, the semiconductor device having high reliability and excellent heat radiation can be realized at low cost.
摘要翻译： 具有高可靠性和优异散热的半导体器件及其制造方法。 作为散热构件的半导体元件和盖子通过在通过用钎料浸渍碳烧结体而形成的含焊料的碳烧结体的表面上的具有焊料层外部的结构的含焊料的碳构件接合。 通过使用用于半导体元件和盖子之间的接合处的烧结体，可以在确保高散热的同时减轻半导体元件的发热过程中的热应力。 通过用廉价的焊料浸渍烧结体，烧结体和外部焊料层可以紧密结合。 通过外部焊料层，半导体元件和盖可以紧密结合。 因此，可以以低成本实现具有高可靠性和优异散热的半导体器件。
-
公开(公告)号：US20060043583A1
公开(公告)日：2006-03-02
申请号：US10994680
申请日：2004-11-23
IPC分类号： H01L23/34
CPC分类号： H01L23/36 , H01L23/13 , H01L23/492 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/48235 , H01L2224/49 , H01L2224/73207 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06586 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/0401
摘要： A semiconductor device is disclosed that includes a semiconductor element, a circuit board electrically connected to the semiconductor element, a heat dissipation member fixed to the first surface of the circuit board and thermally coupled to the semiconductor element, and an interposer provided to the second surface of the circuit board facing away from the heat dissipation member. The interposer is electrically connected to the circuit board. An opening is formed in the circuit board and the interposer so that the semiconductor element is thermally coupled directly to the heat dissipation member through the opening.
摘要翻译： 公开了一种半导体器件，其包括半导体元件，电连接到半导体元件的电路板，固定到电路板的第一表面并热耦合到半导体元件的散热构件，以及设置到第二表面的插入件 电路板背离散热部件。 插入器电连接到电路板。 在电路板和插入件中形成开口，使得半导体元件通过开口直接热耦合到散热构件。
-
-
-
-
搜索结果
5 条记录 (耗时 0.034 秒)
