摘要:
Disclosed herein is a solid state imaging device including a support substrate; an imaging semiconductor chip having a pixel array disposed on the support substrate; and an image processing semiconductor chip disposed on the support substrate, wherein the imaging semiconductor chip and the image processing semiconductor chip are connected by through-vias, and interconnects formed on the support substrate.
摘要:
A plurality of sub word lines each have a length equivalent to the division of a main word line along the extension direction thereof, arranged along a bit line crossing said main word line, and are connected with a plurality of memory cells. A first sub word select line arranged in parallel to the main word line is extended to a plurality of sub arrays arranged in the extension direction of the word line. A second sub word select line is connected to the corresponding one of said first sub word select line to be extended orthogonally to a word line driving circuit area of an adjacent sub array. In the sub word line driving circuit provided for each sub array, a sub word line is selected and deselected by signals supplied from said main word line and said second sub word select line.
摘要:
A semiconductor device includes a first plate member having a circuit surface on which a circuit is provided, a second plate member having a circuit surface on which a circuit is provided, a plurality of first flat plates disposed on the circuit surface of the first plate member, a first communicating section disposed on the circuit surface of the first plate member, a plurality of second flat plates disposed on the circuit surface of the second plate member, and a second communicating section disposed on the circuit surface of the second plate member. The first plate member and the second plate member are arranged so that a surface of the first plate member opposite to the circuit surface faces a surface of the second plate member opposite to the circuit surface.
摘要:
A communication semiconductor chip performs wireless communication with another communication semiconductor chip. The semiconductor chip includes a communication module and a control unit. The communication module performs the wireless communication with another communication semiconductor chip and has a receiving circuit for receiving data. The control unit supplies a reference voltage to the receiving circuit and performs a calibration operation on the reference voltage.
摘要:
A semiconductor memory device for realizing high speed writing while maintaining the credibility of write data, wherein a write gate is provided between a bit line and an input/output data line of a memory cell array, the write gate becomes open when a selected word line becomes an activation state and a write signal set to the input/output data line in accordance with write data is applied to the selected bit line via the write gate when writing, so that writing of data to a selected memory cell can be performed immediately after activating the selected word line when writing, and writing to the selected memory cell can be performed in parallel with reading and refreshing of non-selected memory cells, and consequently, a time for storing charges to the selected memory cell can be sufficiently secured and writing at a high speed can be realized.
摘要:
To reduce both the noise level according to separation or short-circuitng of the electrical supply line of the sense amplifiers and the electrical supply line of the word line driving circuit and to effectively prevent destruction of the stored data in the nonselecteded memory cell. Electrical supply line (Vssw) of the power supply voltage with respect to word line driving circuit (SWD) and electrical supply line (Vssa) of power supply voltage with respect to sense amplifier driving circuit (SAD) are arranged separately in memory array area 2 (e.g., in the space in the row direction of memory array (SMAx,y)) and connected to shared electrical supply wiring (Vsso) within peripheral circuit area 3.
摘要:
A semiconductor memory device has an address buffer (200, 230). A pre-decoder circuit (202, 232) receives the output of the address buffer (200, 230), and a memory array (212) receives the output of the pre-decoder circuit. A main amplifier (216, 248) in turn receives the output of the memory array (212, 244). An address transition detector (ATD) pulse generator circuit (204, 234) also receives the output of the address buffer (200, 230), and a pulse delay circuit (208, 240) receives the output of the address transition detector pulse generator circuit (204, 234). The pulse delay circuit (208, 240) also provides a main amplifier signal to the main amplifier (216, 248). The memory device further includes a voltage generator (206, 236) that generates a back gate voltage which is provided as a low voltage supply (V.sub.BB) for the address transition detector (ATD) pulse generator circuit (204, 234) and the pulse delay circuit (208, 240). The address transition detector (ATD) pulse generator (204, 234) and the pulse delay circuit (208, 240) have a delay that is controlled by the back gate voltage (V.sub.BB) and has a reduced dependency on a high voltage supply (V.sub.DD) of the memory device.
摘要:
A semiconductor memory device in which erroneous operation with respect to undesired level changes of the input address signal is prevented, and appropriate operation of the main amplifier is ensured. The semiconductor memory device has a main amplifier activating pulse generator 112' which includes response sensitivity reduction circuit 10, response sensitivity selector 12, and main amplifier activating pulse generator 14. The response sensitivity reduction circuit 10 can reduce the response sensitivity or input sensitivity of the circuit 112' with respect to an input address transition detection pulse ATD. The response sensitivity selector 12 selects either a first input terminal A1 or a second input terminal A2, depending on the output state of the main amplifier activating pulse generator 14. Consequently, when there is no output of a main amplifier activating pulse MA from the main amplifier activating pulse generator 14, the response sensitivity selector 12 switches to first input terminal A1 to select response sensitivity reduction circuit 10; when a main amplifier activating pulse MA is output, the selector 12 switches to second input terminal A2 to select bypass circuit 11.
摘要:
A dynamic RAM is provided with a main word lines; a plurality of subsidiary word lines which are arranged in the direction of bit lines crossing the main word line and to which a plurality of dynamic memory cells are connected; a plurality of subsidiary word selection lines which are extended so as to perpendicularly intersect the main word line and through which a selection signal for selecting one of the plurality of subsidiary word lines is transmitted; and a logic circuit for receiving a selection signal from the main word line and a selection signal from each of the subsidiary word selection lines to thereby form a selection signal for selecting one of the subsidiary word lines. In the dynamic RAM, the voltage level of each of the main word line and the subsidiary word selection lines is made to be equal to the ground potential when the line is in a not-selected state.
摘要:
A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, and a control circuit for controlling input to and output from the input-output circuits disposed on the first region or the second region of the first substrate. Each of the input-output circuits includes an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit.