公开(公告)号：US09030298B2

公开(公告)日：2015-05-12

申请号：US13424737

申请日：2012-03-20

申请人： Shunpei Yamazaki ,  Takeshi Osada ,  Yasuyuki Arai ,  Yuko Tachimura

发明人： Shunpei Yamazaki ,  Takeshi Osada ,  Yasuyuki Arai ,  Yuko Tachimura

IPC分类号： G06K9/00 ,  H01L23/66 ,  G06K19/07 ,  G06K7/00 ,  G06K19/077

CPC分类号： G06K19/072 ,  G06K7/0008 ,  G06K19/0723 ,  G06K19/07718 ,  G06K19/07749

摘要： The present invention provides a thin semiconductor device in which its security such as prevention of counterfeit or information leakage is to be enhanced. One feature of the present invention is a thin semiconductor device in which a plurality of thin film integrated circuits are mounted and in which at least one integrated circuit is different from the other integrated circuits in any one of a specification, layout, frequency for transmission or reception, a memory, a communication means, a communication rule and the like. According to the present invention, a thin semiconductor device tag having the plurality of thin film integrated circuits communicates with a reader/writer and at least one of the thin film integrated circuits receives a signal to write information in a memory, and the information written in the memory determines which of the thin film integrated circuits communicates.

摘要翻译： 本发明提供一种薄型半导体器件，其中要防止伪造或信息泄漏的安全性得到提高。 本发明的一个特征是薄型半导体器件，其中安装了多个薄膜集成电路，并且其中至少一个集成电路与其他集成电路不同，其中任何一个规格，布局，传输频率或 接收，存储器，通信装置，通信规则等。 根据本发明，具有多个薄膜集成电路的薄的半导体器件标签与读取器/写入器通信，并且至少一个薄膜集成电路接收将信息写入存储器的信号，并且写入的信息 存储器确定薄膜集成电路中的哪一个通信。

公开(公告)号：US20070273476A1

公开(公告)日：2007-11-29

申请号：US10592371

申请日：2005-03-24

申请人： Shunpei Yamazaki ,  Takeshi Osada ,  Yasuyuki Arai ,  Yuko Tachimura

发明人： Shunpei Yamazaki ,  Takeshi Osada ,  Yasuyuki Arai ,  Yuko Tachimura

IPC分类号： G06K19/077 ,  H01L29/94

CPC分类号： G06K19/072 ,  G06K7/0008 ,  G06K19/0723 ,  G06K19/07718 ,  G06K19/07749

摘要： The present invention provides a thin semiconductor device in which its security such as prevention of counterfeit or information leakage is to be enhanced. One feature of the present invention is a thin semiconductor device in which a plurality of thin film integrated circuits are mounted and in which at least one integrated circuit is different from the other integrated circuits in any one of a specification, layout, frequency for transmission or reception, a memory, a communication means, a communication rule and the like. According to the present invention, a thin semiconductor device tag having the plurality of thin film integrated circuits communicates with a reader/writer and at least one of the thin film integrated circuits receives a signal to write information in a memory, and the information written in the memory determines which of the thin film integrated circuits communicates.

摘要翻译： 本发明提供一种薄型半导体器件，其中要防止伪造或信息泄漏的安全性得到提高。 本发明的一个特征是薄型半导体器件，其中安装了多个薄膜集成电路，并且其中至少一个集成电路与其他集成电路不同，其中任何一个规格，布局，传输频率或 接收，存储器，通信装置，通信规则等。 根据本发明，具有多个薄膜集成电路的薄的半导体器件标签与读取器/写入器通信，并且至少一个薄膜集成电路接收将信息写入存储器的信号，并且写入的信息 存储器确定薄膜集成电路中的哪一个通信。

公开(公告)号：US09013303B2

公开(公告)日：2015-04-21

申请号：US13555519

申请日：2012-07-23

申请人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

发明人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

IPC分类号： G08B1/08 ,  H04B5/00 ,  G06K7/10 ,  G06K17/00 ,  G06K19/077 ,  H04Q5/22 ,  G08B13/14 ,  H01L21/336

CPC分类号： H04B5/0012 ,  G06K7/10178 ,  G06K17/00 ,  G06K19/07758 ,  G06K2017/0051 ,  H04B5/0056 ,  H04B5/0081

摘要： One feature of the present invention is a product management system that includes a package body for packing a product attached with an ID tag, and a reader/writer. The ID tag includes a thin film integrated circuit portion and an antenna, the package body includes a resonance circuit portion having an antenna coil and a capacitor, and the resonance circuit portion can communicate with the reader/writer and the ID tag. Accordingly, the stability of communication between an ID tag attached to a product and an R/W can be secured, and management of products can be conducted simply and efficiently, even if a product is packed by a package body.

摘要翻译： 本发明的一个特征是产品管理系统，其包括用于打包附有ID标签的产品的包装体和读取器/写入器。 ID标签包括薄膜集成电路部分和天线，封装主体包括具有天线线圈和电容器的谐振电路部分，并且谐振电路部分可以与读取器/写入器和ID标签通信。 因此，即使产品被包装体包装，也可以确保附着在产品上的ID标签与R / W之间的通信的稳定性，并且可以简单有效地进行产品的管理。

公开(公告)号：US07994617B2

公开(公告)日：2011-08-09

申请号：US10587237

申请日：2005-02-01

申请人： Yasuyuki Arai ,  Yuko Tachimura ,  Yohei Kanno ,  Mai Akiba

发明人： Yasuyuki Arai ,  Yuko Tachimura ,  Yohei Kanno ,  Mai Akiba

IPC分类号： H01L23/02

CPC分类号： H01L27/1266 ,  G06K19/025 ,  G06K19/07728 ,  G06K19/07749 ,  H01L27/1214 ,  H01L27/13 ,  H01L2221/6835 ,  H01L2224/73204

摘要： An object of the present invention is providing a semiconductor device that is capable of improving the reliability of a semiconductor element and enhancing the mechanical strength without suppressing the scale of a circuit. The semiconductor device includes an integrated circuit sandwiched between first and second sealing films, an antenna electrically connected to the integrated circuit, the first sealing film sandwiched between a substrate and the integrated circuit, which includes a plurality of first insulating films and at least one second insulating film sandwiched therebetween, the second sealing film including a plurality of third insulating films and at least one fourth insulating film sandwiched therebetween. The second insulating film has lower stress than the first insulting film and the fourth insulating film has lower stress than the third insulating film. The first and third insulating films are inorganic insulating films.

摘要翻译： 本发明的目的在于提供一种能够提高半导体元件的可靠性并提高机械强度而不抑制电路规模的半导体装置。 半导体器件包括夹在第一和第二密封膜之间的集成电路，与集成电路电连接的天线，夹在基板和集成电路之间的第一密封膜，其包括多个第一绝缘膜和至少一个第二绝缘膜 夹在其间的绝缘膜，所述第二密封膜包括多个第三绝缘膜和夹在其间的至少一个第四绝缘膜。 第二绝缘膜具有比第一绝缘膜低的应力，并且第四绝缘膜具有比第三绝缘膜更低的应力。 第一和第三绝缘膜是无机绝缘膜。

公开(公告)号：US07463049B2

公开(公告)日：2008-12-09

申请号：US11862448

申请日：2007-09-27

申请人： Yasuyuki Arai ,  Yuko Tachimura ,  Mai Akiba

发明人： Yasuyuki Arai ,  Yuko Tachimura ,  Mai Akiba

IPC分类号： G01R31/26

CPC分类号： G01R31/2889 ,  G01R31/2886 ,  G01R31/3025 ,  G01R31/303 ,  G06K7/0095

摘要： The present invention provides an inspection system of ID chips that can supply a signal or power supply voltage to an ID chip without contact, and can increase throughput of an inspection process and an inspection method using the inspection system. The inspection system according to the present invention includes a plurality of inspection electrodes, a plurality of inspection antennas, a position control unit, a unit for applying voltage to each of the inspection antennas, and a unit for measuring potentials of the inspection electrodes. One feature of the inspection system is that a plurality of ID chips and the plurality of inspection electrodes are overlapped with a certain space therebetween, and the plurality of ID chips and the plurality of inspection antennas are overlapped with a certain space therebetween, and the plurality of ID chips are interposed between the plurality of inspection electrodes and the plurality of inspection antennas by the position control unit.

摘要翻译： 本发明提供一种可以向ID芯片提供信号或电源电压而不接触的ID芯片的检查系统，并且可以增加检查过程的吞吐量和使用该检查系统的检查方法。 根据本发明的检查系统包括多个检查电极，多个检查天线，位置控制单元，向每个检查天线施加电压的单元和用于测量检查电极的电位的单元。 检查系统的一个特征在于，多个ID芯片和多个检查电极在其间具有一定的间隔重叠，并且多个ID芯片和多个检查天线在它们之间以一定的间隔重叠，并且多个 的ID芯片通过位置控制单元插入在多个检查电极和多个检查天线之间。

公开(公告)号：US08633473B2

公开(公告)日：2014-01-21

申请号：US11318783

申请日：2005-12-27

申请人： Takeshi Noda ,  Masayuki Sakakura ,  Yasuyuki Arai ,  Yuko Tachimura

发明人： Takeshi Noda ,  Masayuki Sakakura ,  Yasuyuki Arai ,  Yuko Tachimura

IPC分类号： H01L29/08 ,  H01L35/24 ,  H01L51/00

CPC分类号： H01L33/58 ,  H01L27/322 ,  H01L27/3244 ,  H01L33/44 ,  H01L33/60 ,  H01L51/5281 ,  H01L2251/558

摘要： It is an object of the present invention to provide a high-contrast light-emitting device without using a polarization plate. In particular, it is an object of the present invention to make contrast control simpler for a light-emitting device provided with a color filter.A light-emitting device according to the present invention has a feature of having a structure for reducing reflection of light from a light-emitting later at a reflective electrode, and further, has a feature of absorbing wavelengths other than the light by a color filter to enhance the contrast. Accordingly, contrast control can be performed in consideration of only a luminescence component from the light-emitting layer, and is thus made simpler.

摘要翻译： 本发明的目的是提供一种不使用偏光板的高对比度发光装置。 特别地，本发明的目的是为具有滤色器的发光装置对对比度控制更简单。 根据本发明的发光器件具有的特征在于具有减少来自反射电极的稍后发光的光的反射的结构，并且还具有通过滤色器吸收除了光之外的波长的特征 以增强对比度。 因此，可以仅考虑来自发光层的发光成分来进行对比度控制，从而变得更简单。

公开(公告)号：US08237569B2

公开(公告)日：2012-08-07

申请号：US10594308

申请日：2005-04-06

申请人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

发明人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

IPC分类号： G08B13/14 ,  G08B13/00 ,  H04Q5/22 ,  G06Q30/00 ,  G06Q20/00

CPC分类号： H04B5/0012 ,  G06K7/10178 ,  G06K17/00 ,  G06K19/07758 ,  G06K2017/0051 ,  H04B5/0056 ,  H04B5/0081

摘要： When a product attached with an ID tag is placed inside a package body, there is a risk that communication with an ID tag using a reader/writer is blocked. Then, it is difficult to manage products in a distribution process of products, which leads to lose convenience of ID tags. One feature of the present invention is a product management system that includes a package body for packing a product attached with an ID tag, and a reader/writer. The ID tag includes a thin film integrated circuit portion and an antenna, the package body includes a resonance circuit portion having an antenna coil and a capacitor, and the resonance circuit portion can communicate with the reader/writer and the ID tag. Accordingly, the stability of communication between an ID tag attached to a product and an R/W can be secured, and management of products can be conducted simply and efficiently, even if a product is packed by a package body.

摘要翻译： 当附有ID标签的产品放置在包装体内时，存在与使用读写器的ID标签进行通信的风险。 然后，在产品分销过程中难以管理产品，导致ID标签的便利性不足。 本发明的一个特征是产品管理系统，其包括用于打包附有ID标签的产品的包装体和读取器/写入器。 ID标签包括薄膜集成电路部分和天线，封装主体包括具有天线线圈和电容器的谐振电路部分，并且谐振电路部分可以与读取器/写入器和ID标签通信。 因此，即使产品被包装体包装，也可以确保附着在产品上的ID标签与R / W之间的通信的稳定性，并且可以简单有效地进行产品的管理。

公开(公告)号：US20080149731A1

公开(公告)日：2008-06-26

申请号：US10586156

申请日：2005-01-20

申请人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

发明人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

IPC分类号： G06K19/06

CPC分类号： H01L27/1266 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  H01L27/1203 ,  H01L27/1214 ,  H01L27/13 ,  H01L29/78603 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079

摘要： As a non-contact ID label, ID tag and the like being widespread, it is required to manufacture a considerable quantity of ID labels at quite a low cost. An ID label attached to a product is, for example, required to be manufactured at 1 to several yens each, or preferably less than one yen. Thus, such a structure and a process are demanded that an ID label can be manufactured in a large quantity at a low cost. A thin film integrated circuit device included in the ID label, the ID card, and the ID tag of the invention each includes a thin film active element such as a thin film transistor (TFT). Therefore, by peeling a substrate on which TFTs are formed for separating elements, the ID label and the like can be manufactured in a large quantity at a low cost.

摘要翻译： 作为非接触式ID标签，ID标签等广泛使用，需要以相当低的成本制造大量的ID标签。 例如，附着在产品上的ID标签需要以1至几个日元制造，或优选小于1日元。 因此，要求能够以低成本大量制造ID标签的结构和工序。 包括在本发明的ID标签，ID卡和ID标签中的薄膜集成电路器件各自包括诸如薄膜晶体管（TFT）的薄膜有源元件。 因此，通过剥离其上形成有用于分离元件的TFT的基板，可以以低成本大量地制造ID标签等。

公开(公告)号：US20050168339A1

公开(公告)日：2005-08-04

申请号：US11044609

申请日：2005-01-28

申请人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

发明人： Yasuyuki Arai ,  Mai Akiba ,  Yuko Tachimura ,  Yohei Kanno

IPC分类号： G06K19/077 ,  G08B13/14

CPC分类号： G06K19/07722 ,  G06K19/07749 ,  G08B13/2417 ,  G08B13/2437

摘要： In commercial products to which a non-contact type or contact type ID label or ID tag is attached and ID cards, there is fear that, due to a difference between coefficients of thermal expansion between an antenna for communication and a resin provided around the antenna, stress is applied to the resin with the larger coefficient of thermal expansion to break the resin. This contributes to decrease in manufacturing yield, lifetime, and reliability of an ID label or the like. In an article such as an ID label, an ID tag, and an ID card according to the present invention, a filler is included in a filling layer provided around an antenna forming an ID label, an ID tag, and an ID card so that the difference in coefficient of thermal expansion between the antenna and the filling layer can be reduced. This makes it possible to ease generation of stress due to the difference in coefficient of thermal expansion and prevent peeling and cracks of the filling layer.

摘要翻译： 在与非接触型或接触型ID标签或ID标签相连的商业产品中，ID卡有恐惧，由于通信用天线与设置在天线周围的树脂之间的热膨胀系数之间的差异 对具有较大的热膨胀系数的树脂施加应力以破坏树脂。 这导致ID标签等的制造产量，寿命和可靠性的降低。 在根据本发明的诸如ID标签，ID标签和ID卡的物品中，在形成ID标签，ID标签和ID卡的天线周围的填充层中包括填充物，使得 可以降低天线与填充层之间的热膨胀系数的差异。 这使得可以缓解由于热膨胀系数的差异导致的应力的产生，并且防止填充层的剥离和裂纹。

公开(公告)号：US07333072B2

公开(公告)日：2008-02-19

申请号：US10801135

申请日：2004-03-16

申请人： Shunpei Yamazaki ,  Yuko Tachimura ,  Yasuko Watanabe

发明人： Shunpei Yamazaki ,  Yuko Tachimura ,  Yasuko Watanabe

IPC分类号： G09G5/00

CPC分类号： G07F7/1008 ,  G06K19/07703 ,  G07F7/086 ,  G07F7/1025 ,  H01L27/3244 ,  H01L51/5234 ,  H01L2251/5323

摘要： A device having an integrated circuit, especially an IC card, for reliably verifying a person's identity by display of PIN numbers or passwords with ingenuity. Portable electronic devices such as a PDA or a cellular phone, or other products can have plural displays in a display area (display part) provided in a limited area. A first display area and a second display area having transparency are stacked together in a thin film integrated circuit device of the present invention. The area of display can be reduced and display of more complicated PIN numbers or passwords is enabled by layering the display of the first display area and the display of the second display area.

摘要翻译： 具有集成电路，特别是IC卡的装置，用于通过以巧妙的方式显示PIN号或密码来可靠地验证人的身份。 诸如PDA或蜂窝电话的便携式电子设备或其他产品可以在设置在有限区域中的显示区域（显示部分）中具有多个显示器。 具有透明性的第一显示区域和第二显示区域在本发明的薄膜集成电路器件中堆叠在一起。 通过对第一显示区域的显示和第二显示区域的显示进行分层，可以减少显示区域并显示更复杂的PIN号或密码。