公开(公告)号：US6099393A

公开(公告)日：2000-08-08

申请号：US80728

申请日：1998-05-21

申请人： Soichi Katagiri ,  Shigeo Moriyama ,  Kan Yasui ,  Katsuhiko Yamaguchi

发明人： Soichi Katagiri ,  Shigeo Moriyama ,  Kan Yasui ,  Katsuhiko Yamaguchi

IPC分类号： B24B37/00 ,  B24B53/007 ,  B24B53/013 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B53/017 ,  B24B53/013

摘要： In the polishing machine 10 for pressing the polished surface 7 of the workpiece 1 against the face where there are abrasives 15 of the rotating polishing tool 11 and executing chemical mechanical polishing, the brushing device 30, the cleaner 40, the abrasive supplier 52, and the pure water supplier 60 are sequentially arranged behind the location of the head 20 for pressing the workpiece 1 against the polishing tool 11 in the rotational direction. The cleaner 40 sprays the cleaning water 47 to the face where there are abrasives 15 of the rotating polishing tool 11 and sucks and collects it by the vacuum hole 45. Fresh slurry 62 is always supplied by the slurry supplier 63 comprising the abrasive supplier 52 and the pure water supplier 60.

摘要翻译： 在用于将工件1的抛光表面7压靠在旋转抛光工具11的磨料15的表面上并执行化学机械抛光的抛光机10中，刷洗装置30，清洁器40，磨料供应器52和 纯水供应器60顺序地布置在头部20的位置之后，用于将工件1沿着旋转方向压靠在抛光工具11上。 清洁器40将清洗水47喷射到旋转研磨工具11的磨料15的表面，并通过真空孔45吸收并收集。新鲜浆料62总是由包含磨料供应器52的浆料供给器63供应， 纯水供应商60。

公开(公告)号：US06676496B2

公开(公告)日：2004-01-13

申请号：US09835359

申请日：2001-04-17

申请人： Kan Yasui ,  Shigeo Moriyama ,  Katsuhiko Yamaguchi ,  Yoshio Homma

发明人： Kan Yasui ,  Shigeo Moriyama ,  Katsuhiko Yamaguchi ,  Yoshio Homma

IPC分类号： B24B100

CPC分类号： B24B37/04 ,  B24B57/02

摘要： A method for processing semiconductor wafers, which provides planarized surface in a well controllable manner and with high accuracy by processing a film with uneven surface, formed over a semiconductor wafer, within the area of a working surface with a diameter larger than that of said semiconductor wafer by not more than two times, and by processing the film with a polishing liquid supplied from a supply unit disposed on a vertically arranged working surface is disclosed. Additionally, high quality dressing of the working surface can be easily performed by virtue of the smaller diameter of the working surface. Furthermore, the vertical arrangement of the working surface makes possible ready compatibility with semiconductor wafers of enlarged diameters.

摘要翻译： 一种用于处理半导体晶片的方法，其在工作表面的直径大于所述半导体的直径的区域内，以半导体晶片形成在半导体晶片上，通过处理具有不平坦表面的膜，以良好可控的方式并且以高精度提供平坦化表面 晶片不超过两次，并且通过用设置在垂直布置的工作表面上的供应单元供应的抛光液处理该膜。 此外，通过工作表面的较小直径，可以容​​易地进行工作表面的高质量的修整。 此外，工作表面的垂直布置使得可以准确地兼容扩大直径的半导体晶片。

公开(公告)号：US06221773B1

公开(公告)日：2001-04-24

申请号：US09254431

申请日：1999-03-09

申请人： Kan Yasui ,  Shigeo Moriyama ,  Katsuhiko Yamaguchi ,  Yoshio Homma

发明人： Kan Yasui ,  Shigeo Moriyama ,  Katsuhiko Yamaguchi ,  Yoshio Homma

IPC分类号： H01L21302

CPC分类号： H01L21/31053 ,  B24B7/228 ,  B24B37/04 ,  B24B37/042 ,  B24B37/08 ,  B24B53/017 ,  Y10S438/959

摘要： A method for processing semiconductor wafers, which provides planarized surface in a well controllable manner and with high accuracy by processing a film with uneven surface, formed over a semiconductor wafer, within the area of a working surface with a diameter larger than that of said semiconductor wafer by not more than two times, and by processing the film with a polishing liquid supplied from a supply unit disposed on a vertically arranged working surface is disclosed. Additionally, high quality dressing of the working surface can be easily performed by virtue of the smaller diameter of the working surface. Furthermore, the vertical arrangement of the working surface makes possible ready compatibility with semiconductor wafers of enlarged diameters.

摘要翻译： 一种用于处理半导体晶片的方法，其在工作表面的直径大于所述半导体的直径的区域内，以半导体晶片形成在半导体晶片上，通过处理具有不平坦表面的膜，以良好可控的方式并且以高精度提供平坦化表面 晶片不超过两次，并且通过用设置在垂直布置的工作表面上的供应单元供应的抛光液处理该膜。 此外，通过工作表面的较小直径，可以容​​易地进行工作表面的高质量的修整。 此外，工作表面的垂直布置使得可以准确地兼容扩大直径的半导体晶片。

公开(公告)号：US06478977B1

公开(公告)日：2002-11-12

申请号：US09500238

申请日：2000-02-08

申请人： Shigeo Moriyama ,  Katsuhiko Yamaguchi ,  Yoshio Homma ,  Sunao Matsubara ,  Yoshihiro Ishida ,  Ryousei Kawa-ai

发明人： Shigeo Moriyama ,  Katsuhiko Yamaguchi ,  Yoshio Homma ,  Sunao Matsubara ,  Yoshihiro Ishida ,  Ryousei Kawa-ai

IPC分类号： C01B3300

CPC分类号： B24B37/11 ,  B24B27/0076 ,  B24B37/04 ,  B24B37/042 ,  B24D3/002 ,  B24D3/28 ,  H01L21/31053

摘要： The present invention relates to a polishing method using a grindstone comprising abrasive grains and a bonding resin for bonding the abrasive grains, as well as to a polishing apparatus to be used for the polishing method. By using a resin for bonding abrasive grains, it is possible to obtain a grindstone having a desired modulus of elasticity. With such a grindstone, the surface of a substrate having concave and convex portions can be rendered uniformly flat, irrespective of the size of the concave and convex portions. Further, by first polishing the substrate surface with a polishing tool of a small elastic modulus and thereafter polishing it with a polishing tool of a large elastic modulus, it is possible to obtain a polished surface of reduced damage. The method of the invention is effective in planarizing various substrate surfaces having concave and convex portions.

摘要翻译： 本发明涉及使用包括磨粒的磨石和用于粘结磨粒的粘合树脂的抛光方法，以及用于抛光方法的抛光装置。 通过使用用于粘合磨粒的树脂，可以获得具有所需弹性模量的磨石。 利用这样的磨石，与凹部和凸部的尺寸无关地，具有凹凸部的基板的表面能够均匀地平坦化。 此外，通过用具有小的弹性模量的抛光工具首先抛光基板表面，然后用具有大的弹性模量的抛光工具进行抛光，可以获得损伤减小的抛光表面。 本发明的方法对于具有凹凸部分的各种基板表面进行平面化是有效的。

公开(公告)号：US06180020B2

公开(公告)日：2001-01-30

申请号：US09029903

申请日：1998-03-12

申请人： Shigeo Moriyama ,  Katsuhiko Yamaguchi ,  Yoshio Homma ,  Sunao Matsubara ,  Yoshihiro Ishida ,  Ryousei Kawa-ai

发明人： Shigeo Moriyama ,  Katsuhiko Yamaguchi ,  Yoshio Homma ,  Sunao Matsubara ,  Yoshihiro Ishida ,  Ryousei Kawa-ai

IPC分类号： C01B3300

CPC分类号： H01L21/31053 ,  B24B27/0076 ,  B24B37/04 ,  B24B37/042 ,  B24B37/24 ,  B24B37/245 ,  B24D3/002 ,  B24D3/28

摘要： The present invention relates to a polishing method using a grindstone comprising abrasive grains and a bonding resin for bonding the abrasive grains, as well as to a polishing apparatus to be used for the polishing method. By using a resin for bonding abrasive grains, it is possible to obtain a grindstone having a desired modulus of elasticity. With such a grindstone, the surface of a substrate having concave and convex portions can be rendered uniformly flat, irrespective of the size of the concave and convex portions. Further, by first polishing the substrate surface with a polishing tool of a small elastic modulus and thereafter polishing it with a polishing tool of a large elastic modulus, it is possible to obtain a polished surface of reduced damage. The method of the invention is effective in planarizing various substrate surfaces having concave and convex portions.

摘要翻译： 本发明涉及使用包括磨粒的磨石和用于粘结磨粒的粘合树脂的抛光方法，以及用于抛光方法的抛光装置。 通过使用用于粘合磨粒的树脂，可以获得具有所需弹性模量的磨石。 利用这样的磨石，与凹部和凸部的尺寸无关地，具有凹凸部的基板的表面能够均匀地平坦化。 此外，通过用具有小的弹性模量的抛光工具首先抛光基板表面，然后用具有大的弹性模量的抛光工具进行抛光，可以获得损伤减小的抛光表面。 本发明的方法对于具有凹凸部分的各种基板表面进行平面化是有效的。

公开(公告)号：US07715957B2

公开(公告)日：2010-05-11

申请号：US11358116

申请日：2006-02-22

申请人： Katsuhiko Yamaguchi ,  Osamu Harada

发明人： Katsuhiko Yamaguchi ,  Osamu Harada

IPC分类号： B60K6/00

CPC分类号： B60W20/00 ,  B60H1/00385 ,  B60H1/004 ,  B60K6/24 ,  B60K6/365 ,  B60K6/445 ,  B60L1/02 ,  B60L11/1861 ,  B60L2250/16 ,  B60W10/06 ,  B60W10/26 ,  B60W10/30 ,  B60W2510/244 ,  Y02T10/54 ,  Y02T10/6239 ,  Y02T10/6295 ,  Y02T10/7005 ,  Y02T10/7044 ,  Y02T10/705

摘要： A hybrid ECU executes a program including the steps of: calculating an SOC of a battery when turn-on of pre-air-conditioning is requested; prohibiting pre-air-conditioning when the SOC does not satisfy a condition that the SOC is greater than an SOC (Y %) necessary for warm-up and running; and notifying a driver of prohibition of pre-air-conditioning.

摘要翻译： 混合动力ECU执行程序，包括以下步骤：当请求打开预调节空调时计算电池的SOC; 当SOC不满足SOC大于预热和运行所需的SOC（Y％）的条件时，禁止空调; 并通知司机禁止空调。

公开(公告)号：US20090118980A1

公开(公告)日：2009-05-07

申请号：US12279272

申请日：2007-02-23

申请人： Koichiro Muta ,  Katsuhiko Yamaguchi ,  Eiji Masuda

发明人： Koichiro Muta ,  Katsuhiko Yamaguchi ,  Eiji Masuda

IPC分类号： F02D41/00

CPC分类号： B60W20/15 ,  B60K6/445 ,  B60L1/003 ,  B60L11/08 ,  B60L11/1861 ,  B60L2240/443 ,  B60L2240/80 ,  B60L2250/26 ,  B60L2260/26 ,  B60L2270/145 ,  B60W10/06 ,  B60W20/00 ,  B60W30/192 ,  B60W50/12 ,  B60W2710/0605 ,  B60W2710/087 ,  F02D11/105 ,  F02D41/0002 ,  F02D41/062 ,  F02N11/04 ,  F02N2300/104 ,  Y02T10/42 ,  Y02T10/6239 ,  Y02T10/70 ,  Y02T10/7005 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7077

摘要： An engine ECU (280) and an HV_ECU (320) control a throttle motor (296) such that the throttle valve opening degree (TH) does not exceed a prescribed limit (THlim) and a rate of increase (Ta/t) in the throttle valve opening degree is equal to or lower than a predetermined opening degree increase rate (Tb/t) for a predetermined time period after start-up of the engine (120) is initiated. Thus, power output from the engine is controlled so as not to increase significantly for the predetermined time period. Accordingly, while the engine starts up, a shock that can be felt by a driver can be suppressed. In addition, variation in the amount of air taken into the engine when the engine is started is also reduced, which reduces variation in the amount of pollutants in the exhaust gas emitted while the engine starts up.

摘要翻译： 发动机ECU（280）和HV_ECU（320）控制节气门马达（296），使得节气门开度（TH）不超过规定极限（THlim）和增加率（Ta / t） 节气门开度等于或低于在发动机（120）起动之后的预定时间段内的预定开度增加率（Tb / t）。 因此，来自发动机的动力输出被控制为在预定时间段内不显着增加。 因此，在发动机起动时，可以抑制驾驶员能感觉到的冲击。 此外，发动机起动时，在发动机中吸入的空气量的变化也降低，能够减少发动机起动时排出的废气中的污染物的变化。

公开(公告)号：US20050082097A1

公开(公告)日：2005-04-21

申请号：US10964896

申请日：2004-10-15

申请人： Kazuhiro Ichimoto ,  Osamu Harada ,  Yukio Kobayashi ,  Katsuhiko Yamaguchi ,  Kiyoshiro Ueoka ,  Takahiro Nishigaki ,  Makoto Yamazaki ,  Mamoru Tomatsuri

发明人： Kazuhiro Ichimoto ,  Osamu Harada ,  Yukio Kobayashi ,  Katsuhiko Yamaguchi ,  Kiyoshiro Ueoka ,  Takahiro Nishigaki ,  Makoto Yamazaki ,  Mamoru Tomatsuri

IPC分类号： B60W20/00 ,  B60K1/02 ,  B60K6/445 ,  B60K6/448 ,  B60K6/52 ,  B60L11/14 ,  B60W10/04 ,  B60W10/06 ,  B60W10/08 ,  B60W10/10 ,  F02D17/00 ,  F02D29/02 ,  F02D31/00 ,  F02D41/04 ,  F02D41/14 ,  F02D45/00 ,  F02N15/00 ,  B60K6/00 ,  G05D1/00

CPC分类号： B60W20/10 ,  B60K1/02 ,  B60K6/365 ,  B60K6/44 ,  B60K6/445 ,  B60K6/52 ,  B60K2006/262 ,  B60W10/06 ,  B60W10/08 ,  B60W20/00 ,  B60W2560/06 ,  B60W2710/0605 ,  B60W2710/0644 ,  B60W2710/0666 ,  F02D31/007 ,  F02D41/1497 ,  F02D2250/21 ,  Y02T10/56 ,  Y02T10/623 ,  Y02T10/6239 ,  Y02T10/6265 ,  Y02T10/6286

摘要： The control technique of the invention sets smaller values to an engine stop reference value and an engine start reference value in the state of use of a regular fuel, compared with values in the ordinal state. When a calculated engine power demand Pe* is less than the engine stop reference value, the control stops the operation of the engine. When the calculated engine power demand Pe* exceeds the engine start reference value, on the other hand, the control starts the operation of the engine. This arrangement facilitates the start of the engine in the state of use of the regular fuel, compared with the start in the ordinary state. A corrective revolution speed ΔN is added to a target revolution speed Ne* of the engine, in order to respond to a decrease in output power from the internal combustion engine.

摘要翻译： 与普通燃料的使用状态相比，本发明的控制技术将数值设定为发动机停止基准值和发动机起动基准值。 当计算的发动机功率需求Pe *小于发动机停止参考值时，控制器停止发动机的操作。 当计算的发动机功率需求Pe *超过发动机起动参考值时，另一方面，控制开始发动机的运转。 与常规状态的开始相比，这种布置有助于在正常燃料的使用状态下发动机的启动。 为了响应来自内燃机的输出功率的降低，将校正转速DeltaN加到发动机的目标转速Ne *上。

公开(公告)号：US06837215B2

公开(公告)日：2005-01-04

申请号：US10674543

申请日：2003-10-01

申请人： Takahiro Nishigaki ,  Katsuhiko Yamaguchi ,  Yukio Kobayashi ,  Osamu Harada ,  Kiyoshiro Ueoka ,  Mamoru Tomatsuri

发明人： Takahiro Nishigaki ,  Katsuhiko Yamaguchi ,  Yukio Kobayashi ,  Osamu Harada ,  Kiyoshiro Ueoka ,  Mamoru Tomatsuri

IPC分类号： B60W20/00 ,  B60K6/445 ,  B60L11/12 ,  B60L11/14 ,  B60W10/06 ,  B60W10/26 ,  F02D29/02 ,  F02D29/06 ,  F02D31/00

CPC分类号： B60L11/14 ,  B60L11/12 ,  B60L2200/26 ,  Y02T10/646 ,  Y02T10/7005 ,  Y02T10/7077

摘要： A hybrid automobile runs by transmitting a power from an engine and a power from a motor-generator MG2, and can store a part of the power from the engine and an electric power generated by a motor-generator MG1. In this hybrid automobile, a power requirement Pr* of a drive shaft is set based on an accelerator opening, and a battery charge electric power Pbi is set based on SOC, and the sum of the power requirement Pr* and the battery charge electric power Pbi are set as an engine target power Pe*. When the engine target power Pe* is less than a predetermined minimum value Plow, the engine target power Pe* is changed to the minimum value Plow. Further, in accordance with this change, the battery charge electric power Pbi is also changed, and the engine and the motor-generators MG1, MG2 are operated. Since the minimum value Plow is set to be a value such that the efficiency with respect to the output of the engine becomes optimal, it is possible to prevent the engine from being operated in a low output region where the efficiency is low.

摘要翻译： 混合动力汽车通过从发动机发送动力和来自电动发电机MG2的动力来运行，并且可以存储来自发动机的一部分动力和由电动发电机MG1产生的电力。 在该混合动力汽车中，基于加速器开度设定驱动轴的功率要求Pr *，并且基于SOC设定电池充电电力Pbi，并且功率要求Pr *与电池充电电力的和 Pbi设定为发动机目标功率Pe *。 当发动机目标功率Pe *小于预定最小值Plow时，发动机目标功率Pe *变为最小值Plow。 此外，根据该变化，电池充电电力Pbi也变化，发动机和电动发电机MG1，MG2动作。 由于最小值Plow被设定为使得相对于发动机的输出的效率变得最佳的值，因此可以防止发动机在效率低的低输出区域中操作。

公开(公告)号：US6034011A

公开(公告)日：2000-03-07

申请号：US266559

申请日：1999-03-11

申请人： Katsuhiko Yamaguchi ,  Naoyuki Goto

发明人： Katsuhiko Yamaguchi ,  Naoyuki Goto

IPC分类号： C03B32/00 ,  C03B32/02 ,  C03C3/097 ,  C03C10/00 ,  C03C10/04 ,  C03C10/14 ,  C03C19/00 ,  C03C23/00 ,  G11B5/31 ,  G11B25/04

CPC分类号： C03C23/007 ,  C03C10/0009 ,  C03C19/00 ,  C03C2204/08

摘要： A glass-ceramic substrate for a magnetic head has as its predominant crystal phase a mixed crystal of lithium disilicate (Li.sub.2 O.2SiO.sub.2) and either or both of .alpha.-quartz (.alpha.-SiO.sub.2) and .alpha.-cristobalite (.alpha.-SiO.sub.2), the .alpha.-quartz has a globular grain structure each globular crystral grain being made of aggregated particles and having a grain diameter within a range from 0.1 .mu.m to 3.0 .mu.m, the .alpha.-cristobalite has a globular grain structure each globular grain having a grain diamter within a range from 0.1 .mu.m to 1.0 .mu.m, and surface roughness (Ra) of the glass-ceramic substrate after polishing is within a range from 5 .ANG. to 50 .ANG..

摘要翻译： 用于磁头的玻璃陶瓷衬底具有作为其主要结晶相的是二硅酸锂（Li 2 O 2·SiO 2）和α-石英（α-SiO 2）和α-方英石（α-SiO 2）中的任一种或两者的混合晶体， α-石英具有球状晶粒结构，每个球状低温晶粒由凝集颗粒制成，粒径在0.1μm至3.0μm的范围内，α-方晶石具有球状晶粒结构，每个球状晶粒具有晶粒直径 在0.1μm〜1.0μm的范围内，研磨后的玻璃陶瓷基板的表面粗糙度（Ra）在5〜50的范围内。