CELL LYSIS DEVICE AND METHODS OF LYSING CELLS OR VIRUSES
    3.
    发明申请
    CELL LYSIS DEVICE AND METHODS OF LYSING CELLS OR VIRUSES 有权
    细胞检测装置和遗传细胞或病毒的方法

    公开(公告)号:US20120107912A1

    公开(公告)日:2012-05-03

    申请号:US13284364

    申请日:2011-10-28

    CPC分类号: C12M1/00 C12M1/33 C12M47/06

    摘要: A method of lysing at least one of a cell and a virus, the method including: contacting a sample, which includes at least one of a cell and a virus, with a plurality of beads which are disposed in a first chamber to obtain a combination of the sample and the beads; and agitating the combination of the sample and the beads to lyse the at least one of the cell and the virus, wherein in the first chamber a liquid volume fraction is 0.6 or less, and wherein the liquid volume fraction is a value obtained by dividing a liquid volume of the first chamber by a pure void volume equivalent to a sum of the liquid volume of the first chamber and a void volume of the first chamber.

    摘要翻译: 一种裂解细胞和病毒中的至少一种的方法,所述方法包括:将包括细胞和病毒中的至少一种的样品与设置在第一室中的多个珠接触以获得组合 的样品和珠粒; 并搅拌样品和珠的组合以裂解细胞和病毒中的至少一种,其中在第一室中液体体积分数为0.6或更小,并且其中液体体积分数是通过将 第一室的液体体积相当于第一室的液体体积和第一室的空隙体积的总和的纯空隙体积。

    MICROFLUIDIC CHIP AND METHOD OF FABRICATING THE SAME
    10.
    发明申请
    MICROFLUIDIC CHIP AND METHOD OF FABRICATING THE SAME 有权
    微流控芯片及其制造方法

    公开(公告)号:US20110081280A1

    公开(公告)日:2011-04-07

    申请号:US12949981

    申请日:2010-11-19

    IPC分类号: B01L3/00

    摘要: Provided are a microfluidic chip and a method of fabricating the same. The microfluidic chip includes: a lower substrate; an upper substrate formed of a silicone resin, wherein the lower substrate and the upper substrate, bonded together, provide a channel through which a fluid can flow and a chamber to receive the fluid; and an organic thin film formed on the upper surface of the lower substrate except for portions on which the lower substrate and the upper substrate are attached to each other.

    摘要翻译: 提供了一种微流控芯片及其制造方法。 微流体芯片包括:下基板; 由硅树脂形成的上基板,其中所述下基板和所述上基板接合在一起,提供流体可以流过的通道和容纳所述流体的室; 以及形成在下基板的上表面上的有机薄膜,除了下基板和上基板彼此附接的部分之外。