LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND ILLUMINATION SYSTEM
    1.
    发明申请
    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND ILLUMINATION SYSTEM 有权
    发光装置,发光装置包装和照明系统

    公开(公告)号:US20110254035A1

    公开(公告)日:2011-10-20

    申请号:US13004676

    申请日:2011-01-11

    IPC分类号: H01L33/42 H01L33/00

    摘要: Disclosed are a light emitting device, a light emitting device package, and an illumination system. The light emitting device includes a substrate; a light emitting structure layer including a first conductive type semiconductor layer formed on the substrate and having first and second upper surfaces, in which the second upper surface is closer to the substrate than the first upper surface, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer; a second electrode on the second conductive type semiconductor layer; and at least one first electrode extending at least from the second upper surface of the first conductive type semiconductor layer to a lower surface of the substrate by passing through the substrate.

    摘要翻译: 公开了一种发光器件,发光器件封装和照明系统。 发光装置包括:基板; 发光结构层,包括形成在所述基板上的第一和第二上表面的第一导电类型半导体层,其中所述第二上表面比所述第一上表面更靠近所述基板,所述第一导电类型半导体上的有源层 层和有源层上的第二导电类型半导体层; 第二导电型半导体层上的第二电极; 以及至少一个第一电极,所述至少一个第一电极至少从第一导电类型半导体层的第二上表面延伸通过衬底到衬底的下表面。

    Light emitting device, light emitting device package, and illumination system
    2.
    发明授权
    Light emitting device, light emitting device package, and illumination system 有权
    发光器件,发光器件封装和照明系统

    公开(公告)号:US08415699B2

    公开(公告)日:2013-04-09

    申请号:US13004676

    申请日:2011-01-11

    IPC分类号: H01L33/00

    摘要: Disclosed are a light emitting device, a light emitting device package, and an illumination system. The light emitting device includes a substrate; a light emitting structure layer including a first conductive type semiconductor layer formed on the substrate and having first and second upper surfaces, in which the second upper surface is closer to the substrate than the first upper surface, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer; a second electrode on the second conductive type semiconductor layer; and at least one first electrode extending at least from the second upper surface of the first conductive type semiconductor layer to a lower surface of the substrate by passing through the substrate.

    摘要翻译: 公开了一种发光器件,发光器件封装和照明系统。 发光装置包括:基板; 发光结构层,包括形成在所述基板上的第一和第二上表面的第一导电类型半导体层,其中所述第二上表面比所述第一上表面更靠近所述基板,所述第一导电类型半导体上的有源层 层和有源层上的第二导电类型半导体层; 第二导电型半导体层上的第二电极; 以及至少一个第一电极,所述至少一个第一电极至少从第一导电类型半导体层的第二上表面延伸通过衬底到衬底的下表面。

    Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting system
    4.
    发明授权
    Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting system 有权
    发光器件,制造发光器件的方法,发光器件封装和照明系统

    公开(公告)号:US08878212B2

    公开(公告)日:2014-11-04

    申请号:US13020041

    申请日:2011-02-03

    摘要: A light emitting device includes a substrate, at least one electrode, a first contact layer, a second contact layer, a light emitting structure layer, and an electrode layer. The electrode is disposed through the substrate. The first contact layer is disposed on a top surface of the substrate and electrically connected to the electrode. The second contact layer is disposed on a bottom surface of the substrate and electrically connected to the electrode. The light emitting structure layer is disposed above the substrate at a distance from the substrate and electrically connected to the first contact layer. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The electrode layer is disposed on the light emitting structure layer.

    摘要翻译: 发光器件包括衬底,至少一个电极,第一接触层,第二接触层,发光结构层和电极层。 电极通过衬底设置。 第一接触层设置在基板的顶表面上并电连接到电极。 第二接触层设置在基板的底表面上并与电极电连接。 发光结构层设置在基板的上方距离基板一定距离处并电连接到第一接触层。 发光结构层包括第一导电类型半导体层,有源层和第二导电类型半导体层。 电极层设置在发光结构层上。

    Light emitting diode
    5.
    发明授权
    Light emitting diode 有权
    发光二极管

    公开(公告)号:US08669582B2

    公开(公告)日:2014-03-11

    申请号:US13354138

    申请日:2012-01-19

    IPC分类号: H01L33/00

    摘要: Disclosed is a light emitting device a light transmissive substrate, a light emitting structure disposed on the light transmissive substrate, comprising a first conductive type semiconductor layer, an active layer and a second conductive type semiconductor layer, a conductive layer disposed on the second conductive type semiconductor layer, a first electrode part disposed on the conductive layer, with at least predetermined region in contact with the first conductive type semiconductor layer, passing through the conductive layer, the second conductive type semiconductor layer and the active, and a first insulation layer disposed between the conductive layer and the first electrode part, between the second conductive type semiconductor layer and the first electrode part and between the active layer and the first electrode part.

    摘要翻译: 公开了一种发光装置,透光基板,设置在透光基板上的发光结构,包括第一导电类型半导体层,有源层和第二导电类型半导体层,设置在第二导电类型上的导电层 半导体层,设置在导电层上的第一电极部分,至少与第一导电类型半导体层接触的预定区域,穿过导电层,第二导电类型半导体层和有源层,以及第一绝缘层, 在第二导电类型半导体层和第一电极部之间以及有源层和第一电极部之间的导电层和第一电极部之间。

    LIGHT EMITTING DEVICE
    6.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号:US20120113673A1

    公开(公告)日:2012-05-10

    申请号:US13354138

    申请日:2012-01-19

    IPC分类号: H01L33/38 G09F13/18

    摘要: Disclosed is a light emitting device a light transmissive substrate, a light emitting structure disposed on the light transmissive substrate, comprising a first conductive type semiconductor layer, an active layer and a second conductive type semiconductor layer, a conductive layer disposed on the second conductive type semiconductor layer, a first electrode part disposed on the conductive layer, with at least predetermined region in contact with the first conductive type semiconductor layer, passing through the conductive layer, the second conductive type semiconductor layer and the active, and a first insulation layer disposed between the conductive layer and the first electrode part, between the second conductive type semiconductor layer and the first electrode part and between the active layer and the first electrode part.

    摘要翻译: 公开了一种发光装置,透光基板,设置在透光基板上的发光结构,包括第一导电类型半导体层,有源层和第二导电类型半导体层,设置在第二导电类型上的导电层 半导体层,设置在导电层上的第一电极部分,至少与第一导电类型半导体层接触的预定区域,穿过导电层,第二导电类型半导体层和有源层,以及第一绝缘层, 在第二导电类型半导体层和第一电极部之间以及有源层和第一电极部之间的导电层和第一电极部之间。

    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE AND PACKAGE, AND LIGHTING SYSTEM
    7.
    发明申请
    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE AND PACKAGE, AND LIGHTING SYSTEM 有权
    发光装置,发光装置和包装以及照明系统

    公开(公告)号:US20110140161A1

    公开(公告)日:2011-06-16

    申请号:US12964454

    申请日:2010-12-09

    IPC分类号: H01L33/38

    摘要: Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a light emitting structure layer comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and an electrode comprising a pad part and a finger part on the light emitting structure layer. The pad part comprises a pattern in which at least one opening is defined, and the finger part comprises a pattern electrically connected to the pad part and linearly extending from the pad part.

    摘要翻译: 提供了一种发光器件,发光器件封装和照明系统。 发光器件包括发光结构层,其包括第一导电类型半导体层,第二导电类型半导体层和在第一导电类型半导体层和第二导电类型半导体层之间的有源层,以及包括衬垫 部分和手指部分在发光结构层上。 垫部分包括其中限定了至少一个开口的图案,并且指部分包括电连接到垫部分并且从垫部分线性延伸的图案。

    Light emitting device, light emitting device and package, and lighting system
    8.
    发明授权
    Light emitting device, light emitting device and package, and lighting system 有权
    发光装置,发光装置和封装以及照明系统

    公开(公告)号:US08053805B2

    公开(公告)日:2011-11-08

    申请号:US12964454

    申请日:2010-12-09

    IPC分类号: H01L33/38

    摘要: Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a light emitting structure layer comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and an electrode comprising a pad part and a finger part on the light emitting structure layer. The pad part comprises a pattern in which at least one opening is defined, and the finger part comprises a pattern electrically connected to the pad part and linearly extending from the pad part.

    摘要翻译: 提供了一种发光器件,发光器件封装和照明系统。 发光器件包括发光结构层,其包括第一导电类型半导体层,第二导电类型半导体层和在第一导电类型半导体层和第二导电类型半导体层之间的有源层,以及包括衬垫 部分和手指部分在发光结构层上。 垫部分包括其中限定了至少一个开口的图案,并且指部分包括电连接到垫部分并且从垫部分线性延伸的图案。

    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM HAVING THE SAME
    9.
    发明申请
    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM HAVING THE SAME 有权
    发光装置,发光装置包装及具有该发光装置的照明系统

    公开(公告)号:US20110198563A1

    公开(公告)日:2011-08-18

    申请号:US13025662

    申请日:2011-02-11

    IPC分类号: H01L33/06

    摘要: A light emitting device includes a light emitting structure including a first conductive type semiconductor layer, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer; and a transparent electrode layer formed at least one of on and under the light emitting structure, wherein the transparent electrode layer has a thickness in a range of 30 nm to 70 nm to obtain a transmittance equal to or greater than 70% with respect to a wavelength range of light of 420 nm to 510 nm.

    摘要翻译: 发光器件包括:发光结构,包括第一导电类型半导体层,第一导电类型半导体层上的有源层和有源层上的第二导电类型半导体层; 以及形成在所述发光结构的上下的至少一个的透明电极层,其中,所述透明电极层的厚度在30nm〜70nm的范围内,以获得相对于a的透射率等于或大于70% 420nm至510nm的波长范围。

    Light emitting device, method of manufacturing the same, light emitting device package, and lighting system
    10.
    发明授权
    Light emitting device, method of manufacturing the same, light emitting device package, and lighting system 有权
    发光器件,其制造方法,发光器件封装和照明系统

    公开(公告)号:US08536602B2

    公开(公告)日:2013-09-17

    申请号:US13071922

    申请日:2011-03-25

    IPC分类号: H01L33/00

    摘要: Disclosed is a light emitting device. The light emitting device includes a light emitting structure layer including a first conductive type semiconductor layer, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer, a first light extracting structure formed on an outer portion of the first conductive type semiconductor layer and having a plurality of side surfaces and a plurality of upper surfaces formed in a step structure, and a transmissive layer on the first light extracting structure of the first conductive type semiconductor layer.

    摘要翻译: 公开了一种发光器件。 发光器件包括发光结构层,其包括第一导电类型半导体层,第一导电类型半导体层上的有源层和有源层上的第二导电类型半导体层,形成在外部的第一光提取结构 第一导电型半导体层的第一导光型半导体层的第一光提取结构的多个侧面和多个上表面形成为台阶结构,以及透射层。