公开(公告)号：US20110140161A1

公开(公告)日：2011-06-16

申请号：US12964454

申请日：2010-12-09

申请人： Woo Sik LIM ,  Sung Kyoon Kim ,  Sung Ho Choo ,  Byeong Kyun Choi

发明人： Woo Sik LIM ,  Sung Kyoon Kim ,  Sung Ho Choo ,  Byeong Kyun Choi

IPC分类号： H01L33/38

CPC分类号： H01L33/38 ,  H01L24/05 ,  H01L33/387 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a light emitting structure layer comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and an electrode comprising a pad part and a finger part on the light emitting structure layer. The pad part comprises a pattern in which at least one opening is defined, and the finger part comprises a pattern electrically connected to the pad part and linearly extending from the pad part.

摘要翻译： 提供了一种发光器件，发光器件封装和照明系统。 发光器件包括发光结构层，其包括第一导电类型半导体层，第二导电类型半导体层和在第一导电类型半导体层和第二导电类型半导体层之间的有源层，以及包括衬垫 部分和手指部分在发光结构层上。 垫部分包括其中限定了至少一个开口的图案，并且指部分包括电连接到垫部分并且从垫部分线性延伸的图案。

公开(公告)号：US08053805B2

公开(公告)日：2011-11-08

申请号：US12964454

申请日：2010-12-09

申请人： Woo Sik Lim ,  Sung Kyoon Kim ,  Sung Ho Choo ,  Byeong Kyun Choi

发明人： Woo Sik Lim ,  Sung Kyoon Kim ,  Sung Ho Choo ,  Byeong Kyun Choi

IPC分类号： H01L33/38

CPC分类号： H01L33/38 ,  H01L24/05 ,  H01L33/387 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a light emitting structure layer comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and an electrode comprising a pad part and a finger part on the light emitting structure layer. The pad part comprises a pattern in which at least one opening is defined, and the finger part comprises a pattern electrically connected to the pad part and linearly extending from the pad part.

摘要翻译： 提供了一种发光器件，发光器件封装和照明系统。 发光器件包括发光结构层，其包括第一导电类型半导体层，第二导电类型半导体层和在第一导电类型半导体层和第二导电类型半导体层之间的有源层，以及包括衬垫 部分和手指部分在发光结构层上。 垫部分包括其中限定了至少一个开口的图案，并且指部分包括电连接到垫部分并且从垫部分线性延伸的图案。

公开(公告)号：US20110210345A1

公开(公告)日：2011-09-01

申请号：US13031788

申请日：2011-02-22

申请人： Woo Sik LIM ,  Sung Kyoon Kim ,  Sung Ho Choo ,  Byeong Kyun Choi

发明人： Woo Sik LIM ,  Sung Kyoon Kim ,  Sung Ho Choo ,  Byeong Kyun Choi

IPC分类号： H01L33/62

CPC分类号： H01L33/24 ,  H01L33/08 ,  H01L33/20 ,  H01L33/38 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： Provided is a light emitting device. The light emitting device includes a light emitting structure layer comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a first electrode connected to the first conductive type semiconductor layer, a current spreading layer on the second conductive type semiconductor layer, an insulation layer on the first electrode, and a second electrode comprising at least one bridge portion on the insulation layer and a first contact portion contacting at least one of the second conductive type semiconductor layer and the current spreading layer.

摘要翻译： 提供了一种发光装置。 发光器件包括发光结构层，其包括第一导电类型半导体层，有源层和第二导电类型半导体层，连接到第一导电类型半导体层的第一电极，第二导电类型的电流扩散层 第一电极上的绝缘层，以及包括绝缘层上的至少一个桥接部分的第二电极和与第二导电类型半导体层和电流扩展层中的至少一个接触的第一接触部分。

公开(公告)号：US08884328B2

公开(公告)日：2014-11-11

申请号：US13031788

申请日：2011-02-22

申请人： Woo Sik Lim ,  Sung Kyoon Kim ,  Sung Ho Choo ,  Byeong Kyun Choi

发明人： Woo Sik Lim ,  Sung Kyoon Kim ,  Sung Ho Choo ,  Byeong Kyun Choi

IPC分类号： H01L33/38 ,  H01L33/20 ,  H01L33/08

CPC分类号： H01L33/24 ,  H01L33/08 ,  H01L33/20 ,  H01L33/38 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： Provided is a light emitting device. The light emitting device includes a light emitting structure layer comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a first electrode connected to the first conductive type semiconductor layer, a current spreading layer on the second conductive type semiconductor layer, an insulation layer on the first electrode, and a second electrode comprising at least one bridge portion on the insulation layer and a first contact portion contacting at least one of the second conductive type semiconductor layer and the current spreading layer.

摘要翻译： 提供了一种发光装置。 发光器件包括发光结构层，其包括第一导电类型半导体层，有源层和第二导电类型半导体层，连接到第一导电类型半导体层的第一电极，第二导电类型的电流扩散层 第一电极上的绝缘层，以及包括绝缘层上的至少一个桥接部分的第二电极和与第二导电类型半导体层和电流扩展层中的至少一个接触的第一接触部分。

公开(公告)号：US08878212B2

公开(公告)日：2014-11-04

申请号：US13020041

申请日：2011-02-03

申请人： Woo Sik Lim ,  Sung Kyoon Kim ,  Sung Ho Choo ,  Hee Young Beom

发明人： Woo Sik Lim ,  Sung Kyoon Kim ,  Sung Ho Choo ,  Hee Young Beom

IPC分类号： H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L33/60

CPC分类号： H01L33/62 ,  H01L33/0079 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light emitting device includes a substrate, at least one electrode, a first contact layer, a second contact layer, a light emitting structure layer, and an electrode layer. The electrode is disposed through the substrate. The first contact layer is disposed on a top surface of the substrate and electrically connected to the electrode. The second contact layer is disposed on a bottom surface of the substrate and electrically connected to the electrode. The light emitting structure layer is disposed above the substrate at a distance from the substrate and electrically connected to the first contact layer. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The electrode layer is disposed on the light emitting structure layer.

摘要翻译： 发光器件包括衬底，至少一个电极，第一接触层，第二接触层，发光结构层和电极层。 电极通过衬底设置。 第一接触层设置在基板的顶表面上并电连接到电极。 第二接触层设置在基板的底表面上并与电极电连接。 发光结构层设置在基板的上方距离基板一定距离处并电连接到第一接触层。 发光结构层包括第一导电类型半导体层，有源层和第二导电类型半导体层。 电极层设置在发光结构层上。

公开(公告)号：US08866180B2

公开(公告)日：2014-10-21

申请号：US13031803

申请日：2011-02-22

申请人： Sung Kyoon Kim ,  Myeong Soo Kim ,  Woo Sik Lim ,  Min Gyu Na ,  Sung Ho Choo

发明人： Sung Kyoon Kim ,  Myeong Soo Kim ,  Woo Sik Lim ,  Min Gyu Na ,  Sung Ho Choo

IPC分类号： H01L33/38 ,  H01L33/60 ,  H01L33/42 ,  H01L33/40 ,  H01L33/20 ,  H01L33/00

CPC分类号： H01L33/58 ,  H01L33/007 ,  H01L33/20 ,  H01L33/382 ,  H01L33/387 ,  H01L33/405 ,  H01L33/42 ,  H01L2224/48091 ,  H01L2933/0016 ,  H01L2924/00014

摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate, a light emitting structure layer, a second electrode, a first electrode, a contact portion, and a first electrode layer. The first electrode is disposed in the substrate from a lower part of the substrate to a lower part of a first conductive type semiconductor layer in a region under an active layer. The contact portion is wider than the first electrode and makes contact with the lower part of the first conductive type semiconductor layer. The first electrode layer is disposed under the substrate and connected to the first electrode.

摘要翻译： 提供了一种发光器件，发光器件封装和照明系统。 发光器件包括衬底，发光结构层，第二电极，第一电极，接触部分和第一电极层。 第一电极在有源层下方的区域中从基板的下部到第一导电型半导体层的下部设置在基板中。 接触部分比第一电极宽，并与第一导电型半导体层的下部接触。 第一电极层设置在基板下方并连接到第一电极。

公开(公告)号：US20110198563A1

公开(公告)日：2011-08-18

申请号：US13025662

申请日：2011-02-11

申请人： Sung Kyoon Kim ,  Woo Sik Lim ,  Myeong Soo Kim ,  Sung Ho Choo

发明人： Sung Kyoon Kim ,  Woo Sik Lim ,  Myeong Soo Kim ,  Sung Ho Choo

IPC分类号： H01L33/06

CPC分类号： H01L33/42 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting device includes a light emitting structure including a first conductive type semiconductor layer, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer; and a transparent electrode layer formed at least one of on and under the light emitting structure, wherein the transparent electrode layer has a thickness in a range of 30 nm to 70 nm to obtain a transmittance equal to or greater than 70% with respect to a wavelength range of light of 420 nm to 510 nm.

摘要翻译： 发光器件包括：发光结构，包括第一导电类型半导体层，第一导电类型半导体层上的有源层和有源层上的第二导电类型半导体层; 以及形成在所述发光结构的上下的至少一个的透明电极层，其中，所述透明电极层的厚度在30nm〜70nm的范围内，以获得相对于a的透射率等于或大于70％ 420nm至510nm的波长范围。

公开(公告)号：US08373178B2

公开(公告)日：2013-02-12

申请号：US13025662

申请日：2011-02-11

申请人： Sung Kyoon Kim ,  Woo Sik Lim ,  Myeong Soo Kim ,  Sung Ho Choo

发明人： Sung Kyoon Kim ,  Woo Sik Lim ,  Myeong Soo Kim ,  Sung Ho Choo

IPC分类号： H01L27/15

CPC分类号： H01L33/42 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting device includes a light emitting structure including a first conductive type semiconductor layer, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer; and a transparent electrode layer formed at least one of on and under the light emitting structure, wherein the transparent electrode layer has a thickness in a range of 30 nm to 70 nm to obtain a transmittance equal to or greater than 70% with respect to a wavelength range of light of 420 nm to 510 nm.

摘要翻译： 发光器件包括：发光结构，包括第一导电类型半导体层，第一导电类型半导体层上的有源层和有源层上的第二导电类型半导体层; 以及形成在所述发光结构的上下的至少一个的透明电极层，其中，所述透明电极层的厚度在30nm〜70nm的范围内，以获得相对于a的透射率等于或大于70％ 420nm至510nm的波长范围。

公开(公告)号：US20140183573A1

公开(公告)日：2014-07-03

申请号：US14140765

申请日：2013-12-26

申请人： Sung Kyoon Kim ,  Young Bong Yoo ,  Sung Ho Choo

发明人： Sung Kyoon Kim ,  Young Bong Yoo ,  Sung Ho Choo

IPC分类号： H01L33/08

CPC分类号： H01L33/08 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting device includes a substrate, a plurality of light emitting cells disposed on the substrate to be spaced apart from each other, and a connection wire electrically connecting adjacent ones of the light emitting cells. A first separation distance between first adjacent light emitting cells that are not connected by the connection wire among the light emitting cells is smaller than a second separation distance between second adjacent light emitting cells connected by the connection wire among the light emitting cells.

摘要翻译： 发光器件包括基板，设置在基板上以彼此间隔开的多个发光单元，以及连接相邻的发光单元的连接线。 在发光单元之间未被连接线连接的第一相邻发光单元之间的第一分隔距离小于通过发光单元之间的连接线连接的第二相邻发光单元之间的第二间隔距离。

公开(公告)号：US20110254035A1

公开(公告)日：2011-10-20

申请号：US13004676

申请日：2011-01-11

申请人： Sung Kyoon Kim ,  Hee Young Beom ,  Woo Sik Lim ,  Min Gyu Na

发明人： Sung Kyoon Kim ,  Hee Young Beom ,  Woo Sik Lim ,  Min Gyu Na

IPC分类号： H01L33/42 ,  H01L33/00

CPC分类号： H01L33/382 ,  F21K9/23 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L33/20 ,  H01L33/385 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0016 ,  H01L2924/00014

摘要： Disclosed are a light emitting device, a light emitting device package, and an illumination system. The light emitting device includes a substrate; a light emitting structure layer including a first conductive type semiconductor layer formed on the substrate and having first and second upper surfaces, in which the second upper surface is closer to the substrate than the first upper surface, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer; a second electrode on the second conductive type semiconductor layer; and at least one first electrode extending at least from the second upper surface of the first conductive type semiconductor layer to a lower surface of the substrate by passing through the substrate.

摘要翻译： 公开了一种发光器件，发光器件封装和照明系统。 发光装置包括：基板; 发光结构层，包括形成在所述基板上的第一和第二上表面的第一导电类型半导体层，其中所述第二上表面比所述第一上表面更靠近所述基板，所述第一导电类型半导体上的有源层 层和有源层上的第二导电类型半导体层; 第二导电型半导体层上的第二电极; 以及至少一个第一电极，所述至少一个第一电极至少从第一导电类型半导体层的第二上表面延伸通过衬底到衬底的下表面。