公开(公告)号：US20170103910A1

公开(公告)日：2017-04-13

申请号：US15386032

申请日：2016-12-21

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Wen-Chih Chiou ,  Yung-Chi Lin ,  Yu-Liang Lin ,  Hung-Jung Tu

IPC: H01L21/683 ,  H01L21/673

CPC classification number: H01L21/6831 ,  H01L21/67383 ,  H01L21/67386

Abstract: A method comprising placing a wafer assembly in a wafer cassette, wherein the wafer assembly includes a wafer and an electrostatic carrier attached to the wafer. In addition, the electrostatic carrier is charged through the wafer cassette, the wafer cassette is transported to a next process stage, and the wafer assembly is removed from the wafer cassette.

公开(公告)号：US09978628B2

公开(公告)日：2018-05-22

申请号：US15075729

申请日：2016-03-21

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/66 ,  H01L21/67 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L21/6835 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6836 ,  H01L22/12 ,  H01L22/26 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A method of wafer bonding includes bonding a wafer to a carrier in a bonding system. The method further includes measuring thickness profile of the bonded wafer. The method further includes modifying surface contours of at least one of an upper plate or a lower plate of the bonding system during a bonding operation to improve planarity of bonded wafers based on the measured thickness profile, wherein modifying the surface contours of at least one of the upper plate or the lower plate comprises modifying the surface contours using a plurality of height adjusters.

公开(公告)号：US09406650B2

公开(公告)日：2016-08-02

申请号：US14257833

申请日：2014-04-21

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Shin-Puu Jeng ,  Wen-Chih Chiou ,  Tu-Hao Yu ,  Hung-Jung Tu ,  Yu-Liang Lin ,  Shih-Hui Wang

IPC: H01L21/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/0655 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/09 ,  H01L24/17 ,  H01L24/81 ,  H01L24/89 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/08235 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13811 ,  H01L2224/13816 ,  H01L2224/13839 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/80805 ,  H01L2224/81805 ,  H01L2224/83 ,  H01L2224/83192 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/0496 ,  H01L2924/12042 ,  H01L2924/151 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/161 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/014

Abstract: Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging semiconductor devices includes coupling integrated circuit dies to a substrate, and disposing a molding material around the integrated circuit dies. A cap layer is disposed over the molding material and the plurality of integrated circuit dies.

Abstract translation: 公开了封装半导体器件和封装半导体器件的方法。 在一些实施例中，封装半导体器件的方法包括将集成电路管芯耦合到衬底，以及将模制材料设置在集成电路管芯周围。 盖层设置在成型材料和多个集成电路管芯之上。

公开(公告)号：US20140261997A1

公开(公告)日：2014-09-18

申请号：US13897031

申请日：2013-05-17

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Tu-Hao Yu ,  Wen-Chih Chiou ,  Hung-Jung Tu ,  Yu-Liang Lin

IPC: H01L21/683

CPC classification number: H01L21/6836 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T156/10

Abstract: Embodiments of the present disclosure include methods of forming a semiconductor device. An embodiment is a method for forming a semiconductor device, the method including applying a substrate to a carrier with an adhesive layer between the carrier and the substrate, curing a portion of the adhesive layer, the cured portion surrounding an uncured portion of the adhesive layer, removing the carrier from adhesive layer, removing the uncured portion of the adhesive layer, and removing the cured portion of the adhesive layer.

Abstract translation: 本公开的实施例包括形成半导体器件的方法。 一个实施方案是一种形成半导体器件的方法，该方法包括将载体与载体和基片之间的粘合层施加到载体上，固化粘合剂层的一部分，围绕粘合剂层的未固化部分的固化部分 从粘合层去除载体，除去粘合剂层的未固化部分，以及去除粘合剂层的固化部分。

公开(公告)号：US09806062B2

公开(公告)日：2017-10-31

申请号：US15212782

申请日：2016-07-18

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Shin-Puu Jeng ,  Wen-Chih Chiou ,  Tu-Hao Yu ,  Hung-Jung Tu ,  Yu-Liang Lin ,  Shih-Hui Wang

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/60 ,  H01L23/36 ,  H01L23/498

CPC classification number: H01L25/0655 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/09 ,  H01L24/17 ,  H01L24/81 ,  H01L24/89 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/08235 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13811 ,  H01L2224/13816 ,  H01L2224/13839 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/80805 ,  H01L2224/81805 ,  H01L2224/83 ,  H01L2224/83192 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/0496 ,  H01L2924/12042 ,  H01L2924/151 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/161 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/014

Abstract: Packaged semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes a substrate and a plurality of integrated circuit dies coupled to the substrate. The device also includes a molding material disposed over the substrate between adjacent ones of the plurality of integrated circuit dies. A cap layer is disposed over the molding material and the plurality of integrated circuit dies, wherein the cap layer comprises an electrically conductive material that directly contacts the molding material and each of the plurality of integrated circuit dies.

公开(公告)号：US20160329302A1

公开(公告)日：2016-11-10

申请号：US15212782

申请日：2016-07-18

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Shin-Puu Jeng ,  Wen-Chih Chiou ,  Tu-Hao Yu ,  Hung-Jung Tu ,  Yu-Liang Lin ,  Shih-Hui Wang

IPC: H01L25/065 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0655 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/09 ,  H01L24/17 ,  H01L24/81 ,  H01L24/89 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/08235 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13811 ,  H01L2224/13816 ,  H01L2224/13839 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/80805 ,  H01L2224/81805 ,  H01L2224/83 ,  H01L2224/83192 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/0496 ,  H01L2924/12042 ,  H01L2924/151 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/161 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/014

Abstract: Packaged semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes a substrate and a plurality of integrated circuit dies coupled to the substrate. The device also includes a molding material disposed over the substrate between adjacent ones of the plurality of integrated circuit dies. A cap layer is disposed over the molding material and the plurality of integrated circuit dies, wherein the cap layer comprises an electrically conductive material that directly contacts the molding material and each of the plurality of integrated circuit dies.

Abstract translation: 封装的半导体器件被公开。 在一些实施例中，封装半导体器件包括衬底和耦合到衬底的多个集成电路管芯。 该装置还包括在多个集成电路管芯中相邻的集成电路管芯之间设置在衬底上的成型材料。 盖层设置在成型材料和多个集成电路管芯之上，其中盖层包括直接接触模制材料和多个集成电路管芯中的每一个的导电材料。

公开(公告)号：US09093489B2

公开(公告)日：2015-07-28

申请号：US13897031

申请日：2013-05-17

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Tu-Hao Yu ,  Wen-Chih Chiou ,  Hung-Jung Tu ,  Yu-Liang Lin

IPC: B29C65/48 ,  B32B37/00 ,  B32B43/00 ,  C08J5/12 ,  C09J5/00 ,  H01L21/683

CPC classification number: H01L21/6836 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T156/10

Abstract: Embodiments of the present disclosure include methods of forming a semiconductor device. An embodiment is a method for forming a semiconductor device, the method including applying a substrate to a carrier with an adhesive layer between the carrier and the substrate, curing a portion of the adhesive layer, the cured portion surrounding an uncured portion of the adhesive layer, removing the carrier from adhesive layer, removing the uncured portion of the adhesive layer, and removing the cured portion of the adhesive layer.

Abstract translation: 本公开的实施例包括形成半导体器件的方法。 一个实施方案是一种形成半导体器件的方法，该方法包括将载体与载体和基片之间的粘合层施加到载体上，固化粘合剂层的一部分，围绕粘合剂层的未固化部分的固化部分 从粘合层去除载体，除去粘合剂层的未固化部分，以及去除粘合剂层的固化部分。

公开(公告)号：US20150221611A1

公开(公告)日：2015-08-06

申请号：US14257833

申请日：2014-04-21

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Shin-Puu Jeng ,  Wen-Chih Chiou ,  Tu-Hao Yu ,  Hung-Jung Tu ,  Yu-Liang Lin ,  Shih-Hui Wang

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L25/0655 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/09 ,  H01L24/17 ,  H01L24/81 ,  H01L24/89 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/08235 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13811 ,  H01L2224/13816 ,  H01L2224/13839 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/80805 ,  H01L2224/81805 ,  H01L2224/83 ,  H01L2224/83192 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/0496 ,  H01L2924/12042 ,  H01L2924/151 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/161 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/014

Abstract: Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging semiconductor devices includes coupling integrated circuit dies to a substrate, and disposing a molding material around the integrated circuit dies. A cap layer is disposed over the molding material and the plurality of integrated circuit dies.

Abstract translation: 公开了封装半导体器件和封装半导体器件的方法。 在一些实施例中，封装半导体器件的方法包括将集成电路管芯耦合到衬底，以及将模制材料设置在集成电路管芯周围。 盖层设置在成型材料和多个集成电路管芯之上。

公开(公告)号：US10381254B2

公开(公告)日：2019-08-13

申请号：US14479806

申请日：2014-09-08

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Wen-Chih Chiou ,  Yu-Liang Lin ,  Hung-Jung Tu

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/02

Abstract: A wafer debonding and cleaning apparatus comprises a wafer debonding module configured to separate a semiconductor wafer from a carrier wafer. The wafer debonding and cleaning apparatus also comprises a first wafer cleaning module configured perform a first cleaning process to clean a surface of the semiconductor wafer. The wafer debonding and cleaning apparatus further comprises an automatic wafer handling module configured to transfer the semiconductor wafer from one of the wafer debonding module or the first wafer cleaning module to the other of the wafer debonding module or the first wafer cleaning module. The semiconductor wafer has a thickness ranging from about 0.20 μm to about 3 mm.

公开(公告)号：US10068789B2

公开(公告)日：2018-09-04

申请号：US15386032

申请日：2016-12-21

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Wen-Chih Chiou ,  Yung-Chi Lin ,  Yu-Liang Lin ,  Hung-Jung Tu

IPC: H01L21/673 ,  H01L21/683

Abstract: A method comprising placing a wafer assembly in a wafer cassette, wherein the wafer assembly includes a wafer and an electrostatic carrier attached to the wafer. In addition, the electrostatic carrier is charged through the wafer cassette, the wafer cassette is transported to a next process stage, and the wafer assembly is removed from the wafer cassette.