摘要:
A method of producing a bipolar transistor composed of collector, base and emitter regions disposed sequentially on a semiconductor substrate. According to the method, a semiconductor layer is deposited on the collector region, the semiconductor layer is cleaned to expose an active surface, an impurity source gas is applied to the exposed active surface while heating the substrate to form an impurity adsorption layer, the impurity is diffused into the semiconductor layer to form the base region, another semiconductor layer is deposited on the base region, this semiconductor layer is cleaned to expose an active surface, another impurity source gas is applied to the exposed active surface while heating the substrate to form another impurity adsorption layer, and impurity is diffused into the semiconductor layer to from the impurity adsorption layer to form the emitter region.
摘要:
An impurity adsorption layer is selectively formed from a gas containing an impurity on a semiconductor surface. Solid-phase diffusion of the impurity is effected from the impurity adsorption layer into the semiconductor surface to form a source region and a drain region having a sufficiently small resistivity and an ultrashallow PN junction depth, thereby producing a metal-insulator semiconductor field-effect-transistor featuring fast operating speed and reduced dimensions.
摘要:
A solid phase diffusion process using boron silicide film as diffusion source to improve controllability of diffusion of boron impurity into a silicon substrate in order to achieve a shallow junction. The process includes: cleaning the surface of a Si substrate by removing the native oxide film thereof to expose an active surface; treating the active surface to form thereon a boron silicide film as an impurity source; and introducing boron impurity from the boron silicide film into the Si substrate to form a boron diffusion layer. In this manner, a boron diffusion layer having a high surface concentration and a shallow junction can be formed because the boron silicide film is formed directly on the surface of the Si substrate. Because the boron silicide film is chemically and physically stable, an improved diffusion controllability is obtained. The diffusion controllability is further improved by accurately evaluating the impurity film optically during the fabrication process. A structure composed of a boron diffusion layer and a boron silicide region provides a high speed, highly integrated, and highly reliable semiconductor device, particularly when the boron silicide region is disposed between an impurity region and an electrode metal.
摘要:
A PN junction device is formed by removing an inert film from a surface of an N type semiconductor layer to expose an active face, then applying a source gas containing an P type impurity component to the active face to form an impurity adsorption film, and thereafter carrying out a solid-phase diffusion of the impurity is carried out from a diffusion source composed of the P type impurity adsorption film into the N type semiconductor layer to form therein a P type semiconductor layer to thereby provide a PN junction. Lastly, a pair of electrodes are connected to the respective semiconductor layers to form the an PN junction device.
摘要:
The surface of a silicon wafer is cleaned to expose chemically active surface. Diborane gas is fed to the exposed active surface for adsorbing boron to the active surface. The adsorbed boron on the silicon wafer works as an impurity diffusion source. Boron is diffused from the impurity diffusion source into the silicon wafer to make an impurity diffusion layer by heat treatment. The amount of diborane gas fed to the active surface is set in an amount at which the sheet resistance of the impurity diffusion layer does not depend on variations in feed amount.
摘要:
A method of producing an MIS transistor by preparing a substrate formed with a gate electrode and a semiconductor layer which defines a source region and a drain region, removing a natural oxide film from a surface of the gate electrode and from a surface of the semiconductor layer to expose an active surface, delivering a source gas containing an impurity component to the exposed active surface to deposit thereon an impurity adsorption film, and annealing the substrate to diffuse the impurity component from the impurity adsorption film into the gate electrode and concurrently into the semiconductor layer to form the source and drain regions. The gate electrode has the same conductivity type as the source and drain regions.
摘要:
An exposed active surface is prepared on a major surface of a semiconductor substrate. A source gas containing an impurity component is applied to the exposed active surface to adsorb thereon a film of the impurity component so as to form a barrier region along the major surface of the semiconductor substrate. A semiconductor device is formed on the major surface of the semiconductor substrate and is protected by the barrier region.
摘要:
A constant-current FET functions as a constant current element by application of a constant voltage to the gate thereof. A first switch FET is disposed between the constant-current FET and a power supply without another switching element being disposed between the constant current FET and an output terminal. A second switch FET that performs an on/off operation in association with an on/off operation performed by the first switch FET is connected between the output terminal and ground.
摘要:
A photoelectric conversion semiconductor device is characterized in that a second conductivity type impurity region is formed in a first conductivity type semiconductor substrate, the second conductivity type impurity region having a depth of 0.1 .mu.m or less and a peak density of 1.times.10.sup.19 atoms/cm.sup.3 or more. A method of manufacturing a photoelectric conversion semiconductor device is characterized by a step of ion-injecting boron or boron fluoride with a dose amount of 1.times.10.sup.16 to 5.times.10.sup.16 atoms/cm.sup.2 into a semiconductor substrate as an impurity.
摘要翻译:光电转换半导体器件的特征在于,在第一导电型半导体衬底中形成第二导电类型杂质区,第二导电类型杂质区的深度为0.1μm或更小,峰密度为1×1019原子/ cm3或 更多。 制造光电转换半导体器件的方法的特征在于将作为杂质的半导体衬底中的剂量为1×10 16至5×10 16原子/ cm 2的硼或氟化硼离子注入的步骤。
摘要:
A thermal head driving IC for supplying voltage to a plurality of heating resistors each controlled by a driving MOS transistor includes a switch for making and breaking electrically between a substrate and a source of the plurality of driving MOS transistors. In a case where the plurality of heating resistors are activated, the plurality of driving MOS transistors are turned on and the switch is turned off, whereby the substrate potential is floated. As a result, the substrate potential is forward-biased against the source by a substrate current generated in a high-electric-field depletion region near the drain, and a parasitic bipolar transistor turns on, whereby both the plurality of driving MOS transistors and the parasitic bipolar transistor turn on. In a case where the plurality of heating resistors are not activated, a signal for turning off the plurality of driving NMOS transistors is given, and the switch is turned on.