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12 条记录 (耗时 0.032 秒)

    Making and using an ultra-thin copper foil
    1.
    发明授权
    Making and using an ultra-thin copper foil 有权
    制作和使用超薄铜箔

    公开(公告)号：US06270889B1

    公开(公告)日：2001-08-07

    申请号：US09220245

    申请日：1998-12-23

    申请人： Takashi Kataoka ,  Yutaka Hirasawa ,  Takuya Yamamoto ,  Kenichiro Iwakiri ,  Akiko Sugioka ,  Junshi Yoshioka

    发明人： Takashi Kataoka ,  Yutaka Hirasawa ,  Takuya Yamamoto ,  Kenichiro Iwakiri ,  Akiko Sugioka ,  Junshi Yoshioka

    IPC分类号： B32B712

    CPC分类号： H05K3/025 ,  C25D1/22 ,  H05K2203/0152 ,  H05K2203/0591 ,  H05K2203/0726 ,  Y10T428/12007 ,  Y10T428/12431 ,  Y10T428/12493 ,  Y10T428/265 ,  Y10T428/2839 ,  Y10T428/31681

    摘要： This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer by electrodeposition. The organic release layer preferably is a nitrogen-containing compound, a sulfur-containing compound, or a carboxylic acid, which provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.

    摘要翻译： 本发明提供了一种复合箔，其包括在金属载体层和超薄铜箔之间的有机剥离层，以及制备这种复合箔的方法，包括以下步骤：将有机剥离层沉积在金属载体层上，然后形成 通过电沉积在所述有机剥离层上的超薄铜箔层。 有机剥离层优选是含氮化合物，含硫化合物或羧酸，其提供均匀的粘合强度，其足以防止载体和超薄铜箔在处理和层压期间分离，但是 其显着低于铜/基底接合的剥离强度，使得能够在将复合箔层合到绝缘基板上之后容易地除去载体。 本发明还包括由这种复合箔制成的层压板和由这种层压板制成的印刷线路板。

    Composite foil of aluminum and copper
    4.
    发明授权
    Composite foil of aluminum and copper 失效
    复合铝箔和铜箔

    公开(公告)号：US06183880B2

    公开(公告)日：2001-02-06

    申请号：US09131160

    申请日：1998-08-07

    申请人： Junshi Yoshioka ,  Shinichi Obata ,  Makoto Dobashi ,  Takashi Kataoka

    发明人： Junshi Yoshioka ,  Shinichi Obata ,  Makoto Dobashi ,  Takashi Kataoka

    IPC分类号： B21C3702

    CPC分类号： H05K3/025 ,  C25D1/04 ,  C25D5/10 ,  Y10S428/901 ,  Y10S428/926 ,  Y10S428/935 ,  Y10T156/11 ,  Y10T428/12438 ,  Y10T428/12479 ,  Y10T428/12646 ,  Y10T428/12715 ,  Y10T428/1275 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/31678

    摘要： This invention provides a composite foil comprising an aluminum carrier layer and an ultra-thin copper foil having a protective layer disposed between them comprising a porous copper layer and an interpenetrating zinc layer. A process for producing such composite foils comprises the steps of preparing the surface of the aluminum carrier, electrodepositing a porous copper layer on the aluminum carrier layer followed by electrodepositing a zinc layer, and then electrodepositing two layers of copper to form the ultra-thin copper foil. The composite foil provides a uniform bond strength between the aluminum carrier and the protective layer which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.

    摘要翻译： 本发明提供了一种复合箔，其包括铝载体层和超薄铜箔，其具有设置在其间的保护层，包括多孔铜层和互穿锌层。 制造这种复合箔的方法包括以下步骤：制备铝载体的表面，在铝载体层上电沉积多孔铜层，然后电沉积锌层，然后电沉积两层铜以形成超薄铜 挫败。 复合箔在铝载体和保护层之间提供均匀的粘合强度，其足以防止载体和超薄铜箔在处理和层压期间分离，但是明显低于铜/基材的剥离强度 使得能够在将复合箔层压到绝缘基板上之后容易地去除载体。 本发明还包括由这种复合箔制成的层压板和由这种层压板制成的印刷线路板。

    Surface-treated electro-deposited copper foil and method for manufacturing the same
    6.
    发明授权
    Surface-treated electro-deposited copper foil and method for manufacturing the same 有权
    表面处理电沉积铜箔及其制造方法

    公开(公告)号：US08715836B2

    公开(公告)日：2014-05-06

    申请号：US12282231

    申请日：2007-03-09

    申请人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

    发明人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

    IPC分类号： H01L27/108 ,  H01L29/76 ,  H01L29/94

    CPC分类号： H05K3/384 ,  C25D1/04 ,  C25D3/38 ,  C25D5/16 ,  C25D5/18 ,  C25D5/48 ,  C25D7/06 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1476 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/24355 ,  Y10T428/24917

    摘要： It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.

    摘要翻译： 本发明的目的是提供一种表面处理的电沉积铜箔，其具有等于或优于传统上被供应到市场的低轮廓表面处理的电沉积铜箔的等级或优异的水平， 其中影响布线直线性能的波纹小，及其制造方法。 为了实现这个目的，在表面处理的电解铜箔中，与绝缘层构成材料接合的接合面的最大波纹高度（Wmax）为0.05μm〜0.7μm，最大峰值 谷值（PV）为0.05〜1.5μm，表面粗糙度（Rzjis）为0.1μm〜1.0μm。 用于制造该表面处理的电解铜箔的电沉积铜箔通过使用通过加入3-巯基-1-丙磺酸或双（3-磺丙基）二硫化物得到的硫酸基铜电解液制备 ，具有环状结构的季铵盐聚合物和氯，并且在电解条件下使用具有小表面粗糙度的阴极，在连续的第一步电解下进行两步或更多不同电流水平的n步电解 密度。

    METHOD OF PREPARING ELECTROLYTIC COPPER SOLUTION ACIDIFIED WITH SULFURIC ACID, SULFURIC-ACID-ACIDIFIED ELECTROLYTIC COPPER SOLUTION PREPARED BY THE PREPARATION METHOD, AND ELECTRODEPOSITED COPPER FILM
    7.
    发明申请
    METHOD OF PREPARING ELECTROLYTIC COPPER SOLUTION ACIDIFIED WITH SULFURIC ACID, SULFURIC-ACID-ACIDIFIED ELECTROLYTIC COPPER SOLUTION PREPARED BY THE PREPARATION METHOD, AND ELECTRODEPOSITED COPPER FILM 有权
    制备用硫酸制备的电解铜溶液的方法，由制备方法制备的硫酸 - 酸化电解铜溶液和电沉积铜膜

    公开(公告)号：US20100089758A1

    公开(公告)日：2010-04-15

    申请号：US12444020

    申请日：2007-10-02

    申请人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

    发明人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

    IPC分类号： C25D3/38 ,  C25D7/00

    CPC分类号： C25D3/38

    摘要： An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.

    摘要翻译： 本发明的目的是提供一种制备用于形成电沉积铜膜的硫酸基铜电解液的方法，该方法包括当刚制备后使用溶液形成时制备的平滑度和光泽度优异的表面，并且被制备 通过使用单硫化物。 为了实现该目的，制备硫酸基铜电解液以含有磺化活性硫化合物，推荐用于形成光滑电沉积铜膜的双（3-磺丙基）二硫化物。 通过氧化反应在3-巯基-1-丙磺酸的水溶液中将3-巯基-1-丙磺酸转化成双（3-磺丙基）二硫化物，得到所含的双（3-磺丙基）二硫化物 。 在氧化反应中，优选使用空气鼓泡法来防止3-巯基-1-丙磺酸的氧化分解。

    SURFACE-TREATED ELECTRO-DEPOSITED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME
    9.
    发明申请
    SURFACE-TREATED ELECTRO-DEPOSITED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME 有权
    表面处理电沉积铜箔及其制造方法

    公开(公告)号：US20090047539A1

    公开(公告)日：2009-02-19

    申请号：US12282231

    申请日：2007-03-09

    申请人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

    发明人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

    IPC分类号： B32B3/00 ,  B21C37/02 ,  C25D5/00

    CPC分类号： H05K3/384 ,  C25D1/04 ,  C25D3/38 ,  C25D5/16 ,  C25D5/18 ,  C25D5/48 ,  C25D7/06 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1476 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/24355 ,  Y10T428/24917

    摘要： It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.

    摘要翻译： 本发明的目的是提供一种表面处理的电沉积铜箔，其具有等于或优于传统上被供应到市场的低轮廓表面处理的电沉积铜箔的等级或优异的水平， 其中影响布线直线性能的波纹小，及其制造方法。 为了实现这个目的，在表面处理的电解铜箔中，与绝缘层构成材料接合的接合面的最大波纹高度（Wmax）为0.05μm〜0.7μm，最大峰值 谷值（PV）为0.05〜1.5μm，表面粗糙度（Rzjis）为0.1μm〜1.0μm。 用于制造该表面处理的电解铜箔的电沉积铜箔通过使用通过加入3-巯基-1-丙磺酸或双（3-磺丙基）二硫化物得到的硫酸基铜电解液制备 ，具有环状结构的季铵盐聚合物和氯，并且在电解条件下使用具有小表面粗糙度的阴极，在连续的第一步电解下进行两步或更多不同电流水平的n步电解 密度。

    Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film
    10.
    发明授权
    Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film 有权
    制备用硫酸酸化的电解铜溶液，通过制备方法制备的硫酸酸化电解铜溶液和电沉积铜膜的方法

    公开(公告)号：US08419920B2

    公开(公告)日：2013-04-16

    申请号：US12444020

    申请日：2007-10-02

    申请人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

    发明人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

    IPC分类号： C25D3/38

    CPC分类号： C25D3/38

    摘要： An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.

    摘要翻译： 本发明的目的是提供一种制备用于形成电沉积铜膜的硫酸基铜电解液的方法，该方法包括当刚制备后使用溶液形成时制备的平滑度和光泽度优异的表面，并且被制备 通过使用单硫化物。 为了实现该目的，制备硫酸基铜电解液以含有磺化活性硫化合物，推荐用于形成光滑电沉积铜膜的双（3-磺丙基）二硫化物。 通过氧化反应在3-巯基-1-丙磺酸的水溶液中将3-巯基-1-丙磺酸转化成双（3-磺丙基）二硫化物，得到所含的双（3-磺丙基）二硫化物 。 在氧化反应中，优选使用空气鼓泡法来防止3-巯基-1-丙磺酸的氧化分解。