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公开(公告)号：US06270889B1
公开(公告)日：2001-08-07
申请号：US09220245
申请日：1998-12-23
申请人： Takashi Kataoka , Yutaka Hirasawa , Takuya Yamamoto , Kenichiro Iwakiri , Akiko Sugioka , Junshi Yoshioka
发明人： Takashi Kataoka , Yutaka Hirasawa , Takuya Yamamoto , Kenichiro Iwakiri , Akiko Sugioka , Junshi Yoshioka
IPC分类号： B32B712
CPC分类号： H05K3/025 , C25D1/22 , H05K2203/0152 , H05K2203/0591 , H05K2203/0726 , Y10T428/12007 , Y10T428/12431 , Y10T428/12493 , Y10T428/265 , Y10T428/2839 , Y10T428/31681
摘要： This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer by electrodeposition. The organic release layer preferably is a nitrogen-containing compound, a sulfur-containing compound, or a carboxylic acid, which provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.
摘要翻译： 本发明提供了一种复合箔，其包括在金属载体层和超薄铜箔之间的有机剥离层，以及制备这种复合箔的方法，包括以下步骤：将有机剥离层沉积在金属载体层上，然后形成 通过电沉积在所述有机剥离层上的超薄铜箔层。 有机剥离层优选是含氮化合物，含硫化合物或羧酸，其提供均匀的粘合强度，其足以防止载体和超薄铜箔在处理和层压期间分离，但是 其显着低于铜/基底接合的剥离强度，使得能够在将复合箔层合到绝缘基板上之后容易地除去载体。 本发明还包括由这种复合箔制成的层压板和由这种层压板制成的印刷线路板。
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公开(公告)号：US06548153B2
公开(公告)日：2003-04-15
申请号：US10046478
申请日：2002-01-14
IPC分类号： B32B300
CPC分类号： H05K3/38 , H05K3/025 , H05K3/102 , Y10T428/24917 , Y10T428/31681
摘要： A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. Printed wiring is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces.
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公开(公告)号：US06319620B1
公开(公告)日：2001-11-20
申请号：US09039960
申请日：1998-03-16
IPC分类号： B32B1508
CPC分类号： C25D1/22 , H05K3/025 , H05K2203/0152 , H05K2203/0591 , H05K2203/0726 , Y10S428/901 , Y10T428/12438 , Y10T428/12472 , Y10T428/12556 , Y10T428/12569 , Y10T428/1476 , Y10T428/265 , Y10T428/2852
摘要： This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer, preferably by electrodeposition. The organic release layer preferably is a heterocyclic compound selected from triazoles, thiazoles, imidazoles, or their derivatives, and provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.
摘要翻译： 本发明提供了一种复合箔，其包括在金属载体层和超薄铜箔之间的有机剥离层，以及制备这种复合箔的方法，包括以下步骤：将有机剥离层沉积在金属载体层上，然后形成 优选通过电沉积在所述有机剥离层上的超薄铜箔层。 有机剥离层优选为选自三唑，噻唑，咪唑或其衍生物的杂环化合物，并且提供均匀的粘合强度，其足以防止载体和超薄铜箔在处理和层压期间分离，但是它是 显着低于铜/基材接合的剥离强度，使得在复合箔层压到绝缘基板上之后可以容易地去除载体。 本发明还包括由这种复合箔制成的层压板和由这种层压板制成的印刷线路板。
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4.发明授权Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same 失效用于印刷线路板的铜箔和带有载体箔的金属箔，以及用于制造使用其的印刷线路板的半添加工艺公开(公告)号：US06902824B2
公开(公告)日：2005-06-07
申请号：US10059222
申请日：2002-01-31
IPC分类号： H05K1/09 , C23F1/00 , C23F1/28 , C25D3/12 , C25D3/30 , C25D3/38 , C25D5/02 , C25D5/34 , C25D7/00 , C25D7/06 , H05K3/02 , H05K3/10 , H05K3/18 , H05K3/24 , H05K3/38 , B32B7/12
CPC分类号： H05K3/025 , H05K3/108 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T428/12028 , Y10T428/12438 , Y10T428/12493 , Y10T428/12646 , Y10T428/12715 , Y10T428/1291 , Y10T428/12944 , Y10T428/265 , Y10T428/2839
摘要： This invention provides a metal foil and an etching process which overcomes the problem of etching of the copper foil layer and the plating copper layer formed on a metal clad laminate during the conventional semi-additive process for producing printed wire boards. In the present invention, the metal foil and the metal foil with carrier foil include a nickel or tin layer 0.5 to 3 μm thick formed on the external surface of a metal clad laminate which protects the surface of the plated layer during the final flash etching of the copper foil layer.
摘要翻译： 本发明提供一种金属箔和蚀刻工艺，其克服了在用于生产印刷线路板的常规半添加工艺中铜箔层和形成在覆金属层压板上的电镀铜层的蚀刻问题。 在本发明中，金属箔和具有载体箔的金属箔包括形成在金属覆层层叠体的外表面上的0.5至3μm厚的镍或锡层，其在最终闪光蚀刻期间保护镀层的表面 铜箔层。
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公开(公告)号：US06716572B2
公开(公告)日：2004-04-06
申请号：US10082154
申请日：2002-02-26
IPC分类号： G03F700
CPC分类号： H05K3/0038 , H05K3/0035 , H05K3/4652 , H05K2201/0112 , H05K2201/0347 , H05K2203/0361 , H05K2203/1388 , Y10S430/146 , Y10T29/49165
摘要： It is an object to provide a manufacturing process for a printed wiring board in which a copper foil and resin as a substrate material of a copper clad laminate are irradiated with carbon dioxide gas laser light to drill in both of them simultaneously. In forming a through hole or a hole such as IVH, BVH or the like in the copper clad laminate using carbon dioxide gas laser light, one of a nickel layer of 0.08 to 2 &mgr;m in thickness, a cobalt layer of 0.05 to 3 &mgr;m in thickness and a zinc layer of 0.03 to 2 &mgr;m in thickness is formed as an additional metal layer on a surface of the copper foil residing in an external layer of the copper clad laminate and thereafter, by performing laser drilling, the copper foil layer and the resin layer as a substrate material of the copper clad laminate are enabled to drill simultaneously.
摘要翻译： 本发明的目的是提供一种印刷线路板的制造方法，其中铜箔和作为覆铜层压板的基板材料的树脂被二氧化碳气体激光照射以同时钻孔。 在使用二氧化碳气体激光的覆铜层压板中形成IVH，BVH等通孔或孔，在0.08〜2μm厚的镍层中，将0.05〜3μm的钴层 在覆铜层压板的外层的铜箔的表面上形成厚度为0.03〜2μm的锌层作为附加金属层，然后通过进行激光打孔，将铜箔层和 作为覆铜层压板的基材的树脂层能够同时钻孔。
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公开(公告)号：US06827867B2
公开(公告)日：2004-12-07
申请号：US09855382
申请日：2001-05-15
IPC分类号： H01B1300
CPC分类号： H05K3/025 , H05K3/0035 , H05K3/0038 , H05K3/384 , H05K3/4652 , H05K2201/0382
摘要： A printed wiring board manufacturing method is provided which is so consitituted that when a carbon dioxide leaser is used to form holes such as via holes in a copper clad laminate, copper foils and resin layers may be processed at the same time, without having to perform an etching treatment on the cooper foil. Namely, a carbon dioxide laser is used to form recess portions such as via holes in a copper clad laminate, followed by plating to form interlayer electrical connections, forming etching resist layers, and exposing and developing the etching resist layers, thereby effecting a circuit etching treatment. In particular, the copper clad laminate is a laminate formed by using waved copper foils to form external copper foils.
摘要翻译： 提供一种印刷电路板的制造方法，其特征在于，当使用二氧化碳激光器在铜包覆层压板中形成诸如通孔的孔时，铜箔和树脂层可以同时被处理，而不必执行 对铜箔进行蚀刻处理。 即，使用二氧化碳激光器在覆铜层压板中形成诸如通孔的凹部，然后进行电镀以形成层间电连接，形成抗蚀剂层，以及曝光和显影抗蚀剂层，从而进行电路蚀刻 治疗。 特别地，覆铜层压板是通过使用波形铜箔形成外部铜箔形成的层压体。
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公开(公告)号：US06183880B2
公开(公告)日：2001-02-06
申请号：US09131160
申请日：1998-08-07
IPC分类号： B21C3702
CPC分类号： H05K3/025 , C25D1/04 , C25D5/10 , Y10S428/901 , Y10S428/926 , Y10S428/935 , Y10T156/11 , Y10T428/12438 , Y10T428/12479 , Y10T428/12646 , Y10T428/12715 , Y10T428/1275 , Y10T428/12792 , Y10T428/12847 , Y10T428/12903 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , Y10T428/31678
摘要： This invention provides a composite foil comprising an aluminum carrier layer and an ultra-thin copper foil having a protective layer disposed between them comprising a porous copper layer and an interpenetrating zinc layer. A process for producing such composite foils comprises the steps of preparing the surface of the aluminum carrier, electrodepositing a porous copper layer on the aluminum carrier layer followed by electrodepositing a zinc layer, and then electrodepositing two layers of copper to form the ultra-thin copper foil. The composite foil provides a uniform bond strength between the aluminum carrier and the protective layer which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.
摘要翻译： 本发明提供了一种复合箔，其包括铝载体层和超薄铜箔，其具有设置在其间的保护层，包括多孔铜层和互穿锌层。 制造这种复合箔的方法包括以下步骤：制备铝载体的表面，在铝载体层上电沉积多孔铜层，然后电沉积锌层，然后电沉积两层铜以形成超薄铜 挫败。 复合箔在铝载体和保护层之间提供均匀的粘合强度，其足以防止载体和超薄铜箔在处理和层压期间分离，但是明显低于铜/基材的剥离强度 使得能够在将复合箔层压到绝缘基板上之后容易地去除载体。 本发明还包括由这种复合箔制成的层压板和由这种层压板制成的印刷线路板。
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公开(公告)号：US06660406B2
公开(公告)日：2003-12-09
申请号：US09885552
申请日：2001-06-20
IPC分类号： B21C3700
CPC分类号： H05K3/20 , H05K1/167 , H05K3/025 , H05K3/384 , H05K2203/0152 , H05K2203/0307 , H05K2203/1572 , Y10T428/12438 , Y10T428/12493 , Y10T428/1291 , Y10T428/24917
摘要： There are provided an electrodeposited copper foil with carrier that can be used for manufacturing a printed wiring board that excels in the finished accuracy of the resistor circuit in comparison with a conventional printed wiring board with resistor circuits, and a method for manufacturing such a printed wiring board with resistor circuits. The method for manufacturing a printed wiring board with resistor circuits comprises the steps of previously forming copper foil circuits using a copper foil for a printed wiring board with resistor circuits comprising a nickel layer for forming a resistor circuit between a copper carrier and a copper foil layer for forming the circuit, whose surface layer is subjected to a nodular treatment, using a copper etching solution that does not etch the nickel layer; fabricating a copper clad laminate using the copper foil after forming the copper circuits, and a prepreg composing a resin base material; removing the copper carrier to expose the nickel layer for forming the resistor circuit, and etching the resistor circuits to form the nickel resistor-circuits.
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9.发明授权公开(公告)号：US09954416B2
公开(公告)日：2018-04-24
申请号：US14377364
申请日：2012-06-12
申请人： Takashi Kataoka , Yusuke Ota , Toshifumi Taguchi , Hayao Watanabe
发明人： Takashi Kataoka , Yusuke Ota , Toshifumi Taguchi , Hayao Watanabe
CPC分类号： H02K7/06 , H02K1/165 , H02K16/02 , H02K19/103 , H02K21/12 , H02K2201/18
摘要： An actuator, a stator, a motor, a rotational-to-linear motion conversion mechanism, and a linear actuator are provided. The motor, the actuator, and the linear actuator at least include a screw shaft and a nut. The screw shaft is a rod-like member, and at least a part of the surface of the screw shaft has a thread. The nut is screwed onto the thread on the screw shaft, and moves the screw shaft in a linear motion direction that is a direction in parallel with a rotational center. The stator, the motor, the actuator, and the linear actuator can at least convert a rotational motion into a linear motion.
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公开(公告)号：US08674384B2
公开(公告)日：2014-03-18
申请号：US13048046
申请日：2011-03-15
IPC分类号： H01L33/00
摘要： According to one embodiment, a light emitting element includes a light emitting layer, a cladding layer, a current spreading layer, a second layer, and an electrode. The light emitting layer is capable of emitting emission light. The current spreading layer includes a surface processed layer and a first layer. The surface processed layer has a surface including convex portions and bottom portions provided adjacent to the convex portions. The first layer is provided between the surface processed layer and the cladding layer. The second layer is provided between the surface processed layer and the cladding layer and includes a region having an impurity concentration higher than an impurity concentration of the current spreading layer. The electrode is provided in a region of the surface of the surface processed layer where the convex portions and the bottom portions are not provided.
摘要翻译： 根据一个实施例，发光元件包括发光层，包覆层，电流扩散层，第二层和电极。 发光层能够发射发光。 电流扩散层包括表面处理层和第一层。 表面处理层具有包括与凸部相邻设置的凸部和底部的表面。 第一层设置在表面处理层和包覆层之间。 第二层设置在表面处理层和包覆层之间，并且包括杂质浓度高于电流扩散层的杂质浓度的区域。 电极设置在表面处理层的没有设置凸部和底部的表面的区域中。
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