ROUGHED CURED MATERIAL AND LAMINATED
    1.
    发明申请
    ROUGHED CURED MATERIAL AND LAMINATED 审中-公开
    粗糙的固化材料和层压材料

    公开(公告)号:US20130337229A1

    公开(公告)日:2013-12-19

    申请号:US13982909

    申请日:2012-01-27

    IPC分类号: H05K1/03

    摘要: A roughened cured material allows reduction of surface roughness and increase in adhesive strength between a cured object and a metal layer. A roughened cured material is obtained by advancing curing of an epoxy resin material to obtain a preliminary-cured material and conducting roughening treatment on a surface of the preliminary-cured material. The epoxy resin material contains an epoxy resin, a curing agent, and a silica whose mean particle diameter is not smaller than 0.2 μm but not larger than 1.2 μm. When a roughening-treated surface of the roughened cured material is photographed with a scanning electron microscope, in a 5 μm×5 μm sized area of the roughening-treated surface in a photographed image, the number of particles of the silica that are exposed from the roughening-treated surface and whose exposed portions have a maximum length of 0.3 μM or longer in the image is not greater than 15.

    摘要翻译: 粗化固化材料可以降低表面粗糙度,增加固化物和金属层之间的粘合强度。 通过使环氧树脂材料的固化前进来获得预固化材料并在预固化材料的表面上进行粗糙化处理,获得粗糙化的固化材料。 环氧树脂材料包含环氧树脂,固化剂和平均粒径不小于0.2μm,但不大于1.2μm的二氧化硅。 当用扫描电子显微镜对经粗化处理的粗化材料进行粗糙化处理的表面时,在经拍摄的图像中的经粗糙处理的表面的5mum×5mum大小的区域中,暴露于二氧化硅的颗粒数 粗糙化处理的表面和其曝光部分在图像中具有0.3μm或更大的最大长度不大于15。

    THERMOSETTING RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE
    2.
    发明申请
    THERMOSETTING RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE 审中-公开
    热固性树脂组合物,基材材料和基材薄膜

    公开(公告)号:US20090267263A1

    公开(公告)日:2009-10-29

    申请号:US12501462

    申请日:2009-07-12

    IPC分类号: B29C71/00

    摘要: Disclosed is a thermosetting resin composition which enables to obtain a molded article that is excellent in mechanical properties, dimensional stability and heat resistance and is further capable of maintaining the shape of the article molded before curing even after the resin composition is cured. The thermosetting resin composition contains 100 parts by weight of a thermosetting resin and 1-100 parts by weight of an inorganic compound dispersed in the thermosetting resin, and the dispersion particle diameter of the inorganic compound is not more than 2 μm. Not less than 75% of the shape of an article molded before curing is maintained after the resin composition is cured. Also disclosed are a material for substrates and a film for substrates respectively composed by using such a thermosetting resin composition.

    摘要翻译: 公开了一种热固性树脂组合物,其能够获得机械性能,尺寸稳定性和耐热性优异的成型体,并且即使在树脂组合物固化后,还能够保持固化前的制品的形状。 热固性树脂组合物含有100重量份热固性树脂和1-100重量份分散在热固性树脂中的无机化合物,并且无机化合物的分散体粒径不大于2μm。 在树脂组合物固化后,保持固化前模制的制品形状的75%以上。 还公开了通过使用这种热固性树脂组合物分别构成的基板材料和基板用薄膜。

    Thermoplastic resin composition, material for substrate and film for substrate
    3.
    发明申请
    Thermoplastic resin composition, material for substrate and film for substrate 审中-公开
    热塑性树脂组合物,基材用材料和基材用膜

    公开(公告)号:US20070072963A1

    公开(公告)日:2007-03-29

    申请号:US10582883

    申请日:2004-12-14

    IPC分类号: C08K3/02

    摘要: Disclosed is a thermoplastic resin composition which enables to obtain a molded article that is capable of maintaining the molded shape even when the article is heated after molding and is excellent in dimensional stability and heat resistance. The thermoplastic resin composition contains 100 parts by weight of a thermoplastic resin and 0.1-100 parts by weight of an inorganic compound dispersed in the thermoplastic resin. Not less than 75% of the molded shape of an article can be maintained even after the article is heated to a temperature not less than the glass transition temperature or melting point of the thermoplastic resin. Also disclosed are a material and a film for substrates composed by using such a thermoplastic resin composition.

    摘要翻译: 公开了一种热塑性树脂组合物,其能够获得即使在制品在成型后被加热并且尺寸稳定性和耐热性优异的情况下也能够保持模塑形状的模塑制品。 热塑性树脂组合物含有100重量份热塑性树脂和0.1-100重量份分散在热塑性树脂中的无机化合物。 即使制品被加热到不低于热塑性树脂的玻璃化转变温度或熔点的温度,也可以保持制品的模制形状的75%以上。 还公开了使用这种热塑性树脂组合物构成的基材的材料和薄膜。

    THERMOPLASTIC RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE
    4.
    发明申请
    THERMOPLASTIC RESIN COMPOSITION, MATERIAL FOR SUBSTRATE AND FILM FOR SUBSTRATE 审中-公开
    热塑性树脂组合物,基材材料和基材薄膜

    公开(公告)号:US20090256283A1

    公开(公告)日:2009-10-15

    申请号:US12488560

    申请日:2009-06-20

    IPC分类号: B29C70/60

    摘要: Disclosed is a thermoplastic cresin composition which enables to obtain a molded article that is capable of maintaining the molded shape even when the article is heated after molding and is excellent in dimensional stability and heat resistence. The thermoplastic resin composition contains 100 parts by weight of a thermoplastic resin and 0.1-100 parts by weight of an inorganic compound dispersed in the thermoplastic resin. Not less than 75% of the molded shape of an article can be maintained even after the article is heated to a temperature not less than the glass transition temperature or melting point of the thermoplastic resin. Also disclosed are a material and a film for substrates composed by using such a thermoplastic resin composition.

    摘要翻译: 公开了一种热塑性树脂组合物,其能够获得即使在成型后加热制品并且尺寸稳定性和耐热性优异的情况下也能够保持成型体的成型体。 热塑性树脂组合物含有100重量份热塑性树脂和0.1-100重量份分散在热塑性树脂中的无机化合物。 即使制品被加热到不低于热塑性树脂的玻璃化转变温度或熔点的温度,也可以保持制品的模制形状的75%以上。 还公开了使用这种热塑性树脂组合物构成的基材的材料和薄膜。

    Thermosetting Resin Composition, Resin Sheet and Resin Sheet for Insulated Substrate
    5.
    发明申请
    Thermosetting Resin Composition, Resin Sheet and Resin Sheet for Insulated Substrate 失效
    热固性树脂组合物,树脂片和绝缘基材树脂片

    公开(公告)号:US20080233386A1

    公开(公告)日:2008-09-25

    申请号:US10581928

    申请日:2004-12-07

    摘要: A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.

    摘要翻译: 能够提供诸如树脂片的成型体的热固性树脂组合物,不仅具有介电特性,而且在高温下甚至在暴露于高温热历史之后都具有优异的尺寸稳定性,其热历史几乎没有尺寸变化,即 ,显示出低的线性膨胀系数。 此外,还提供了由热固性树脂组合物制成的用于绝缘基板的树脂片和树脂片。 特别地,提供一种热固性树脂组合物,其包含环氧树脂为100至2000环氧当量的环氧树脂,由酚化合物和层状硅酸盐组成的环氧树脂硬化剂,并且还提供由热固性树脂组合物 以及由树脂片构成的绝缘基板用树脂片。

    Thermoplastic foam and method for production thereof
    6.
    发明授权
    Thermoplastic foam and method for production thereof 失效
    热塑性泡沫及其制造方法

    公开(公告)号:US07173068B2

    公开(公告)日:2007-02-06

    申请号:US10918552

    申请日:2004-08-16

    IPC分类号: C08J9/32

    摘要: A thermoplastic foam is provided which contains a thermoplastic resin and a layered silicate and in which foam cells and the layered silicate are evenly and finely dispersed.A volume-expansible gas or heat decomposable blowing agent is incorporated into interlayer spaces of a layered silicate in a composite material containing 100 parts by weight of a thermoplastic resin and 0.1–50 parts by weight of the layered silicate, and the gas or blowing agent is allowed to expand in volume or thermally decompose to form foam cells 6, so that a thermoplastic foam is obtained in which the layered silicate has an average interlayer spacing of over 60 Å when determined by an X-ray diffractometry.

    摘要翻译: 提供了一种热塑性泡沫,其包含热塑性树脂和层状硅酸盐,其中泡沫体和层状硅酸盐均匀且细分散。 在100重量份热塑性树脂和0.1-50重量份层状硅酸盐的复合材料中,将体积膨胀气体或热分解发泡剂并入层状硅酸盐的层间空间中,气体或发泡剂 允许体积膨胀或热分解以形成泡沫体6,从而获得热塑性泡沫,其中当通过X射线衍射法测定时,层状硅酸盐具有超过60的平均层间距。

    Resin composition
    9.
    发明申请
    Resin composition 失效
    树脂组成

    公开(公告)号:US20050165151A1

    公开(公告)日:2005-07-28

    申请号:US10503491

    申请日:2003-02-04

    摘要: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of 1.0×10−3 [° C.−1] or below over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

    摘要翻译: 提供了具有改进的物理性能,尺寸稳定性,耐热性和阻燃性的树脂组合物,基材,片,层压板,含树脂铜箔,覆铜层压板,TAB带,印刷电路板,预浸料和粘合片 ,特别是高温物理性能。 含有100重量份热塑性树脂和0.1-65重量份无机化合物的树脂组合物,该树脂组合物的平均线膨胀系数(α2)为1.0×10 -3 [° 在低于玻璃化转变温度的温度10℃以上的温度范围内,在高于玻璃化转变温度50℃的温度范围内, 树脂组合物。

    Thermoplastic foam and method for production thereof
    10.
    发明授权
    Thermoplastic foam and method for production thereof 失效
    热塑性泡沫及其制造方法

    公开(公告)号:US06906119B1

    公开(公告)日:2005-06-14

    申请号:US10048457

    申请日:2000-08-07

    摘要: A thermoplastic foam is provided which contains a thermoplastic resin and a layered silicate and in which foam cells and the layered silicate are evenly and finely dispersed.A volume-expansible gas or heat decomposable blowing agent is incorporated into interlayer spaces of a layered silicate in a composite material containing 100 parts by weight of a thermoplastic resin and 0.1-50 parts by weight of the layered silicate, and the gas or blowing agent is allowed to expand in volume or thermally decompose to form foam cells 6, so that a thermoplastic foam is obtained in which the layered silicate has an average interlayer spacing of over 60 Å when determined by an X-ray diffractometry.

    摘要翻译: 提供了一种热塑性泡沫,其包含热塑性树脂和层状硅酸盐,其中泡沫体和层状硅酸盐均匀且细分散。 在100重量份热塑性树脂和0.1-50重量份层状硅酸盐的复合材料中,将体积膨胀气体或热分解发泡剂并入层状硅酸盐的层间空间中,气体或发泡剂 允许体积膨胀或热分解以形成泡沫体6,从而获得热塑性泡沫,其中当通过X射线衍射法测定时,层状硅酸盐具有超过60的平均层间距。