Resist underlayer film composition and patterning process using the same
    1.
    发明授权
    Resist underlayer film composition and patterning process using the same 有权
    抗蚀剂下层膜组合物和使用其的图案化工艺

    公开(公告)号:US08877422B2

    公开(公告)日:2014-11-04

    申请号:US13269290

    申请日:2011-10-07

    IPC分类号: G03F7/004 G03F7/26 G03F7/09

    CPC分类号: G03F7/091 G03F7/094

    摘要: There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formula (1-1) and/or (1-2), and one or more kinds of compounds and/or equivalent bodies thereof represented by the following general formula (2). There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, namely, an underlayer film having optimum n-value and k-value, excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.

    摘要翻译: 公开了一种抗蚀剂下层膜组合物,其中组合物含有通过至少一种或多种下列通式(1-1)和/或(1-2)表示的化合物缩合得到的聚合物,以及一种或多种 更多种由下列通式(2)表示的化合物和/或其等价物。 可以提供一种特别用于三层抗蚀剂工艺的下层膜组合物,其可以形成具有降低的反射率的下层膜,即具有最佳n值和k值的底层膜,优异的填充性, 抗蚀性能,并且特别是在比60nm薄的高方位线中,特别是在蚀刻后不会引起线下落或摆动,以及使用其的图案化工艺。

    Resist underlayer film-forming composition, process for forming resist underlayer film and patterning process
    2.
    发明授权
    Resist underlayer film-forming composition, process for forming resist underlayer film and patterning process 有权
    抗蚀剂下层膜形成组合物,形成抗蚀剂下层膜的工艺和图案化工艺

    公开(公告)号:US08603732B2

    公开(公告)日:2013-12-10

    申请号:US12978978

    申请日:2010-12-27

    摘要: There is disclosed a resist underlayer film-forming composition comprising, at least: a resin (A) obtained by condensing a compound represented by the following general formula (1) with a compound represented by the following general formula (2) by the aid of an acid catalyst; a compound (B) represented by the general formula (1); a fullerene compound (C); and an organic solvent. There can be a resist underlayer film composition in a multi-layer resist film to be used in lithography, which underlayer film is excellent in property for filling up a height difference of a substrate, possesses a solvent resistance, and is not only capable of preventing occurrence of twisting during etching of a substrate, but also capable of providing an excellently decreased pattern roughness; a process for forming a resist underlayer film by using the composition; and a patterning process.

    摘要翻译: 公开了一种抗蚀剂下层膜形成组合物,其至少包括:通过以下通式(1)表示的化合物与下列通式(2)表示的化合物缩合得到的树脂(A):通过 酸催化剂; 由通式(1)表示的化合物(B); 富勒烯化合物(C); 和有机溶剂。 在光刻中使用的多层抗蚀剂膜中可以存在抗蚀剂下层膜组合物,该下层膜具有优异的填充基板的高度差的性能,具有耐溶剂性,并且不仅能够防止 在蚀刻基板期间发生扭曲,而且能够提供优异的图案粗糙度; 通过使用该组合物形成抗蚀剂下层膜的方法; 和图案化过程。

    Resist composition and patterning process
    3.
    发明授权
    Resist composition and patterning process 有权
    抗蚀剂组成和图案化工艺

    公开(公告)号:US08168367B2

    公开(公告)日:2012-05-01

    申请号:US12457192

    申请日:2009-06-03

    IPC分类号: G03F7/00 G03F7/004 G03F7/028

    摘要: The present invention relates to: a resist composition such as a chemically amplified resist composition for providing an excellent pattern profile even at a substrate-side boundary face of resist, in addition to a higher resolution in photolithography for micro-fabrication, and particularly in photolithography adopting, as an exposure source, KrF laser, ArF laser, F2 laser, ultra-short ultraviolet light, electron beam, X-rays, or the like; and a patterning process utilizing the resist composition. The present invention provides a chemically amplified resist composition comprising one or more kinds of amine compounds or amine oxide compounds (except for those having a nitrogen atom of amine or amine oxide included in a ring structure of an aromatic ring) at least having a carboxyl group and having no hydrogen atoms covalently bonded to a nitrogen atom as a basic center.

    摘要翻译: 本发明涉及:抗蚀剂组合物,例如化学放大抗蚀剂组合物,除了在微制造的光刻中具有更高分辨率之外,甚至在抗蚀剂的衬底侧边界面上也提供优异的图案图形,特别是在光刻 采用KrF激光,ArF激光,F2激光,超短紫外光,电子束,X射线等作为曝光源; 以及利用抗蚀剂组合物的图案化工艺。 本发明提供一种化学放大抗蚀剂组合物,其包含至少具有羧基的一种或多种胺化合物或氧化胺化合物(除了具有包含在芳环的环结构中的胺或胺氧化物的氮原子的那些) 并且不具有与氮原子共价键合的氢原子作为碱性中心。

    POSITIVE RESIST COMPOSITIONS AND PATTERNING PROCESS
    5.
    发明申请
    POSITIVE RESIST COMPOSITIONS AND PATTERNING PROCESS 有权
    积极的组合物和绘图过程

    公开(公告)号:US20110183262A1

    公开(公告)日:2011-07-28

    申请号:US13013143

    申请日:2011-01-25

    IPC分类号: G03F7/004 G03F7/20

    CPC分类号: G03F7/0397 G03F7/2041

    摘要: A positive resist composition is provided comprising an acid generator, a resin component which generates resin-solubilizing groups under the action of acid so that the resin component becomes soluble in an alkaline developer, at least some resin-solubilizing groups being carboxyl groups, and a compound for activating or condensing a carboxyl group. When processed by the lithography, the resist composition forms a resist pattern having a very high resolution and good mask fidelity.

    摘要翻译: 提供了一种正性抗蚀剂组合物,其包含酸产生剂,在酸的作用下产生树脂增溶基团的树脂组分,使得树脂组分变得可溶于碱性显影剂,至少一些树脂增溶基团为羧基, 用于活化或缩合羧基的化合物。 当通过光刻处理时,抗蚀剂组合物形成具有非常高的分辨率和良好的掩模保真度的抗蚀剂图案。

    RESIST-MODIFYING COMPOSITION AND PATTERN FORMING PROCESS
    7.
    发明申请
    RESIST-MODIFYING COMPOSITION AND PATTERN FORMING PROCESS 有权
    电阻修饰组合物和图案形成工艺

    公开(公告)号:US20100297563A1

    公开(公告)日:2010-11-25

    申请号:US12785930

    申请日:2010-05-24

    IPC分类号: G03F7/20

    摘要: A patterning process includes (1) coating a first positive resist composition onto a substrate, baking, exposing, post-exposure baking, and alkali developing to form a first resist pattern, (2) coating a resist-modifying composition onto the first resist pattern and heating to effect modifying treatment, and (3) coating a second positive resist composition, baking, exposing, post-exposure baking, and alkali developing to form a second resist pattern. The resist modifying composition comprises a base resin comprising recurring units having formula (1) wherein A1 is alkylene, R1 is H or methyl, R2 is alkyl or bond together to form a nitrogen-containing heterocycle, and an alcohol-based solvent.

    摘要翻译: 图案化工艺包括(1)将第一正性抗蚀剂组合物涂覆在基材上,烘烤,曝光,曝光后烘烤和碱显影以形成第一抗蚀剂图案,(2)将抗蚀剂改性组合物涂覆到第一抗蚀剂图案上 加热进行改性处理,(3)涂布第二正性抗蚀剂组合物,烘烤,曝光,曝光后烘烤和碱显影以形成第二抗蚀剂图案。 抗蚀剂改性组合物包括含有式(1)的重复单元的基础树脂,其中A1是亚烷基,R1是H或甲基,R2是烷基或键合在一起形成含氮杂环,和醇类溶剂。

    POSITIVE RESIST COMPOSITIONS AND PATTERNING PROCESS
    10.
    发明申请
    POSITIVE RESIST COMPOSITIONS AND PATTERNING PROCESS 有权
    积极的组合物和绘图过程

    公开(公告)号:US20090186296A1

    公开(公告)日:2009-07-23

    申请号:US12355072

    申请日:2009-01-16

    IPC分类号: G03F7/004 G03F7/20

    摘要: A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising specific recurring units, represented by formula (1). The acid generator (B) is a specific sulfonium salt compound. When processed by lithography, the composition is improved in resolution and forms a pattern with a satisfactory mask fidelity and a minimal LER. Herein R1 is H or methyl, m is 1 or 2, and n is 1 or 2.

    摘要翻译: 正型抗蚀剂组合物包含(A)在酸的作用下变得可溶于碱性显影剂的树脂组分和(B)酸产生剂。 树脂(A)是包含由式(1)表示的特定重复单元的聚合物。 酸产生剂(B)是特定的锍盐化合物。 当通过光刻处理时,组合物的分辨率提高,并形成具有令人满意的掩模保真度和最小LER的图案。 其中R1为H或甲基,m为1或2,n为1或2。