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    Physical quantity sensor including bonding wire with vibration isolation performance characteristics
    5.
    发明授权
    Physical quantity sensor including bonding wire with vibration isolation performance characteristics 有权
    物理量传感器，包括具有隔振性能特征的接合线

    公开(公告)号：US08578774B2

    公开(公告)日：2013-11-12

    申请号：US13004295

    申请日：2011-01-11

    申请人： Tameharu Ohta ,  Takeshi Shinoda ,  Itaru Ishii ,  Keisuke Nakano

    发明人： Tameharu Ohta ,  Takeshi Shinoda ,  Itaru Ishii ,  Keisuke Nakano

    IPC分类号： G01P1/02 ,  G01P15/125 ,  G01C19/56

    CPC分类号： G01C19/5769 ,  B81B7/0058 ,  B81B2201/0242 ,  G01P1/023 ,  G01P15/125 ,  H01L2224/48465

    摘要： A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20×d≦h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.

    摘要翻译： 物理量传感器包括感测部分，壳体，隔振部件，导电部分，焊盘和接合线。 壳体将感测部分包围在其中。 防振构件设置在感测部分和壳体之间以减小感测部分和壳体之间的相对振动。 接合线将设置在壳体上的导电部分和设置在感测部分的表面上的焊盘电连接。 接合线从焊盘延伸到导电部分并且包括弯曲部。 接合线被配置为满足20×d @ h的关系，其中d是接合线的外径，h是接合线相对于垂直于感测部分的表面的方向的尺寸 。

    Capacitive dynamic quantity sensor device
    8.
    发明授权
    Capacitive dynamic quantity sensor device 失效
    电容式动态传感器装置

    公开(公告)号：US06935176B2

    公开(公告)日：2005-08-30

    申请号：US10834166

    申请日：2004-04-29

    申请人： Keisuke Goto ,  Tameharu Ohta

    发明人： Keisuke Goto ,  Tameharu Ohta

    IPC分类号： G01P15/08 ,  G01P15/125 ,  H01L29/84 ,  H01G7/00

    CPC分类号： G01P15/125 ,  G01P2015/0814

    摘要： A sensor chip (100) includes comb-toothed movable electrodes (24) displaceable in a Y-direction, and comb-toothed stationary electrodes (30, 31, 40, 41) arranged to confront those movable electrodes (24), on one face side of a semiconductor substrate (10). The sensor chip (100) detects acceleration on the basis of a capacity change accompanying an acceleration application in the Y-direction between the movable electrodes (24) and the stationary electrodes (30, 31, 41, 42). The stationary electrodes (30, 31, 41, 42) are individually disposed to confront each other on one and other sides of the direction taken along the Y-direction in the individual movable electrodes (24). The individual electrode pads (25a, 30a, 31a, 40a, 41a) and the circuit chip (200) are electrically connected by bump electrodes (300) so that one face of the substrate (10) confronts the circuit chip (200).

    摘要翻译： 传感器芯片（100）包括可沿Y方向移位的梳齿可动电极（24），以及梳齿固定电极（30,31,40,41），其布置成在一个面上与所述可动电极（24）相对 一侧的半导体衬底（10）。 传感器芯片（100）基于伴随着可动电极（24）和固定电极（30,31,41,42）之间的Y方向上的加速度施加的容量变化来检测加速度。 固定电极（30,31,41,42）分别设置成在各个可动电极（24）中沿着Y方向取向的方向的一侧和另外侧彼此面对。 单独的电极焊盘（25 a，30 a，31 a，40 a，41 a）和电路芯片（200）通过凸块电极（300）电连接，使得衬底（10）的一个面与电路芯片 （200）。

    Sensor device and method of producing the same using lead frame
    9.
    发明授权
    Sensor device and method of producing the same using lead frame 失效
    传感器装置及其使用引线框的方法

    公开(公告)号：US6035712A

    公开(公告)日：2000-03-14

    申请号：US38906

    申请日：1998-03-12

    申请人： Tameharu Ohta ,  Hiromi Ariyoshi

    发明人： Tameharu Ohta ,  Hiromi Ariyoshi

    IPC分类号： G01P15/12 ,  G01P1/02 ,  G01P15/08 ,  H05K1/18

    CPC分类号： G01P1/023 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/1815 ,  H05K1/181

    摘要： An acceleration sensor device includes a molded package mounted on a circuit board and first and second leads protruding from the molded package and joined to the circuit board. The molded package retains an island portion of a lead frame in a state where a chip mounting surface of the island portion is perpendicular to the circuit board. An acceleration sensor is mounted on the chip mounting surface of the island portion. After attaching the acceleration sensor chip to the island portion, the island portion is bent up in the lead frame. Then, the island portion, the acceleration sensor chip, and the first and second leads are integrally molded to make the molded package. Accordingly, a detection axis of the acceleration sensor device can be arbitrary set, and the molded package is stably mounted on the circuit board.

    摘要翻译： 加速度传感器装置包括安装在电路板上的模制封装件和从模制封装突出并连接到电路板的第一和第二引线。 模制包装在岛部的芯片安装表面垂直于电路板的状态下保持引线框架的岛部。 加速度传感器安装在岛部的芯片安装面上。 在将加速度传感器芯片附接到岛部之后，岛部在引线框架中向上弯曲。 然后，将岛部，加速度传感器芯片以及第一和第二引线一体地模制成模制封装。 因此，可以任意设定加速度传感器装置的检测轴，并且将模制包装稳定地安装在电路板上。