公开(公告)号：US08578774B2

公开(公告)日：2013-11-12

申请号：US13004295

申请日：2011-01-11

申请人： Tameharu Ohta ,  Takeshi Shinoda ,  Itaru Ishii ,  Keisuke Nakano

发明人： Tameharu Ohta ,  Takeshi Shinoda ,  Itaru Ishii ,  Keisuke Nakano

IPC分类号： G01P1/02 ,  G01P15/125 ,  G01C19/56

CPC分类号： G01C19/5769 ,  B81B7/0058 ,  B81B2201/0242 ,  G01P1/023 ,  G01P15/125 ,  H01L2224/48465

摘要： A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20×d≦h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.

摘要翻译： 物理量传感器包括感测部分，壳体，隔振部件，导电部分，焊盘和接合线。 壳体将感测部分包围在其中。 防振构件设置在感测部分和壳体之间以减小感测部分和壳体之间的相对振动。 接合线将设置在壳体上的导电部分和设置在感测部分的表面上的焊盘电连接。 接合线从焊盘延伸到导电部分并且包括弯曲部。 接合线被配置为满足20×d @ h的关系，其中d是接合线的外径，h是接合线相对于垂直于感测部分的表面的方向的尺寸 。

公开(公告)号：US20120018611A1

公开(公告)日：2012-01-26

申请号：US13186506

申请日：2011-07-20

申请人： Itaru Ishii ,  Tameharu Ohta ,  Takeshi Shinoda ,  Keisuke Nakano

发明人： Itaru Ishii ,  Tameharu Ohta ,  Takeshi Shinoda ,  Keisuke Nakano

IPC分类号： F16F15/02 ,  B29C65/54

CPC分类号： H01L23/057 ,  B81B7/0058 ,  B81B2201/0235 ,  G01C19/5769 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A bonding structure of a vibration isolation target is disclosed. The structure includes: a base; a vibration isolation target mounted to the base; and a vibration isolator bonds together the base and the vibration isolation target. A lift-up portion is formed on one of the base and the vibration isolation target, and is lift-upped from the one toward the other of the base and the vibration isolation target. The lift-up portion has an apex surface located at an apex of the lift-up portion. The vibration isolator is on the apex surface.

摘要翻译： 公开了一种防振目标物的接合结构。 该结构包括：基座; 安装在基座上的防振目标; 并且隔振器将基座和隔振目标件连接在一起。 升降部分形成在基座和隔振目标之一上，并从基座和隔振目标的一个向另一个提升。 提升部具有位于提升部的顶点的顶点表面。 隔振器位于顶点表面。

公开(公告)号：US07385296B2

公开(公告)日：2008-06-10

申请号：US11224280

申请日：2005-09-13

申请人： Tameharu Ohta

发明人： Tameharu Ohta

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/83 ,  G01C19/5719 ,  H01L24/32 ,  H01L24/45 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/8385 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06593 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A sensor includes: a first chip; a second chip disposed on the first chip through an adhesive member; and a stopper. The second chip is connected to the first chip through a bonding wire. The stopper limits a displacement of the second chip when the adhesive member is deformed. The stopper is disposed around the second chip. Since the displacement of the second chip is restricted, deformation of the bonding wire between the first and the second chips is also restricted.

摘要翻译： 传感器包括：第一芯片; 通过粘合构件设置在第一芯片上的第二芯片; 和塞子。 第二芯片通过接合线连接到第一芯片。 当粘合构件变形时，止动器限制第二芯片的位移。 止动件设置在第二芯片周围。 由于第二芯片的位移受到限制，所以第一和第二芯片之间的接合线的变形也受到限制。

公开(公告)号：US06935176B2

公开(公告)日：2005-08-30

申请号：US10834166

申请日：2004-04-29

申请人： Keisuke Goto ,  Tameharu Ohta

发明人： Keisuke Goto ,  Tameharu Ohta

IPC分类号： G01P15/08 ,  G01P15/125 ,  H01L29/84 ,  H01G7/00

CPC分类号： G01P15/125 ,  G01P2015/0814

摘要： A sensor chip (100) includes comb-toothed movable electrodes (24) displaceable in a Y-direction, and comb-toothed stationary electrodes (30, 31, 40, 41) arranged to confront those movable electrodes (24), on one face side of a semiconductor substrate (10). The sensor chip (100) detects acceleration on the basis of a capacity change accompanying an acceleration application in the Y-direction between the movable electrodes (24) and the stationary electrodes (30, 31, 41, 42). The stationary electrodes (30, 31, 41, 42) are individually disposed to confront each other on one and other sides of the direction taken along the Y-direction in the individual movable electrodes (24). The individual electrode pads (25a, 30a, 31a, 40a, 41a) and the circuit chip (200) are electrically connected by bump electrodes (300) so that one face of the substrate (10) confronts the circuit chip (200).

摘要翻译： 传感器芯片（100）包括可沿Y方向移位的梳齿可动电极（24），以及梳齿固定电极（30,31,40,41），其布置成在一个面上与所述可动电极（24）相对 一侧的半导体衬底（10）。 传感器芯片（100）基于伴随着可动电极（24）和固定电极（30,31,41,42）之间的Y方向上的加速度施加的容量变化来检测加速度。 固定电极（30,31,41,42）分别设置成在各个可动电极（24）中沿着Y方向取向的方向的一侧和另外侧彼此面对。 单独的电极焊盘（25 a，30 a，31 a，40 a，41 a）和电路芯片（200）通过凸块电极（300）电连接，使得衬底（10）的一个面与电路芯片 （200）。

公开(公告)号：US6035712A

公开(公告)日：2000-03-14

申请号：US38906

申请日：1998-03-12

申请人： Tameharu Ohta ,  Hiromi Ariyoshi

发明人： Tameharu Ohta ,  Hiromi Ariyoshi

IPC分类号： G01P15/12 ,  G01P1/02 ,  G01P15/08 ,  H05K1/18

CPC分类号： G01P1/023 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/1815 ,  H05K1/181

摘要： An acceleration sensor device includes a molded package mounted on a circuit board and first and second leads protruding from the molded package and joined to the circuit board. The molded package retains an island portion of a lead frame in a state where a chip mounting surface of the island portion is perpendicular to the circuit board. An acceleration sensor is mounted on the chip mounting surface of the island portion. After attaching the acceleration sensor chip to the island portion, the island portion is bent up in the lead frame. Then, the island portion, the acceleration sensor chip, and the first and second leads are integrally molded to make the molded package. Accordingly, a detection axis of the acceleration sensor device can be arbitrary set, and the molded package is stably mounted on the circuit board.

摘要翻译： 加速度传感器装置包括安装在电路板上的模制封装件和从模制封装突出并连接到电路板的第一和第二引线。 模制包装在岛部的芯片安装表面垂直于电路板的状态下保持引线框架的岛部。 加速度传感器安装在岛部的芯片安装面上。 在将加速度传感器芯片附接到岛部之后，岛部在引线框架中向上弯曲。 然后，将岛部，加速度传感器芯片以及第一和第二引线一体地模制成模制封装。 因此，可以任意设定加速度传感器装置的检测轴，并且将模制包装稳定地安装在电路板上。

公开(公告)号：US08359923B2

公开(公告)日：2013-01-29

申请号：US12926970

申请日：2010-12-21

申请人： Tameharu Ohta ,  Tetsuo Fujii ,  Masanobu Azukawa ,  Takeshi Ito ,  Itaru Ishii

发明人： Tameharu Ohta ,  Tetsuo Fujii ,  Masanobu Azukawa ,  Takeshi Ito ,  Itaru Ishii

IPC分类号： G01P15/125

CPC分类号： G01C19/56 ,  B81B7/0058 ,  B81B2201/0235 ,  B81B2201/0285 ,  G01D18/00 ,  G01P15/08 ,  H01L2224/48247 ,  H05K13/00 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49826

摘要： A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

摘要翻译： 物理量传感器包括传感器部分，壳体和隔振器。 壳体包括具有支撑表面的支撑部分，支撑表面位于传感器部分的端表面上。 隔振器位于传感器部分的端面和壳体的支撑表面之间，以将传感器部分接合到壳体。 隔振器减小传感器部分和壳体之间的相对振动。

公开(公告)号：US07268435B2

公开(公告)日：2007-09-11

申请号：US10792734

申请日：2004-03-05

申请人： Tameharu Ohta

发明人： Tameharu Ohta

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/057 ,  B81B2201/0235 ,  B81C1/00238 ,  G01P1/023 ,  G01P15/125 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a capacitive semiconductor sensor, a sensor chip and a circuit chip are contained in a package. First bump members are mounted on second electrodes disposed on a second surface of the circuit chip, respectively. The sensor chip is mounted at its first surface on the second surface of the circuit chip so that first electrodes disposed on the first surface of the sensor chip are electrically mechanically connected to the second electrodes through the first bump members, respectively. Second bump members are mounted on third electrodes disposed on the second surface of the circuit chip, respectively. The third electrodes are electrically mechanically connected to lead electrodes disposed to the package through the second bump members, respectively.

摘要翻译： 在电容半导体传感器中，传感器芯片和电路芯片被包含在封装中。 第一凸起构件分别安装在设置在电路芯片的第二表面上的第二电极上。 传感器芯片安装在电路芯片的第二表面上的第一表面上，使得设置在传感器芯片的第一表面上的第一电极分别通过第一凸块部件电连接到第二电极。 第二凸起部件分别安装在设置在电路芯片的第二表面上的第三电极上。 第三电极分别通过第二凸起构件电学机械地连接到设置在封装件上的引线电极。

公开(公告)号：US20060000294A1

公开(公告)日：2006-01-05

申请号：US11159261

申请日：2005-06-23

申请人： Tameharu Ohta

发明人： Tameharu Ohta

IPC分类号： G01L3/00

CPC分类号： G01C19/5719 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0314 ,  H05K2201/10727 ,  H05K2201/10977 ,  H01L2924/00014

摘要： An angular rate sensor includes: a circuit board; a package including an angular rate sensor chip and a connection terminal; and a conductive member. The angular rate sensor chip is accommodated in the package. The package is disposed on the circuit board through the conductive member. The package further includes a first electrode disposed on a bottom of the package, the first electrode connecting to the connection terminal. The circuit board includes a second electrode disposed on a top of the circuit board. The angular rate sensor chip in the package is electrically connected to the circuit board through the connection terminal, the first and the second electrodes and the conductive member. The circuit board and the package are electrically and elastically connected by the conductive member.

摘要翻译： 角速率传感器包括：电路板; 包括角速率传感器芯片和连接端子的封装; 和导电构件。 角速率传感器芯片容纳在包装中。 封装通过导电部件设置在电路板上。 该封装还包括设置在封装的底部的第一电极，第一电极连接到连接端子。 电路板包括设置在电路板顶部的第二电极。 封装中的角速度传感器芯片通过连接端子，第一和第二电极和导电部件电连接到电路板。 电路板和封装通过导电构件电气弹性连接。

公开(公告)号：US20050257615A1

公开(公告)日：2005-11-24

申请号：US11119695

申请日：2005-05-03

申请人： Tameharu Ohta

发明人： Tameharu Ohta

IPC分类号： G01C19/56 ,  G01C19/5769 ,  G01P15/08

CPC分类号： G01C19/5719 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00 ,  H01L2924/00012

摘要： An angular rate sensor includes a sensor chip having an oscillator vibrating at a predetermined frequency and detecting an angular velocity applied to this oscillator around a predetermined rotation axis. A circuit chip, laminated with the sensor chip, has a circuit formed on a surface thereof to detect the angular velocity based on a signal obtained from the sensor chip. The sensor chip and the circuit chip are bonded with an adhesive film. A resonance frequency of the sensor chip is smaller than (½)1/2 times a driving frequency of the oscillator in a condition that adjustment is applied to at least one of configuration or elastic coefficient of the adhesive film.

摘要翻译： 角速率传感器包括具有以预定频率振动的振荡器的传感器芯片，并且围绕预定的旋转轴检测施加到该振荡器的角速度。 与传感器芯片层压的电路芯片具有形成在其表面上的电路，以基于从传感器芯片获得的信号来检测角速度。 传感器芯片和电路芯片用粘合膜结合。 传感器芯片的共振频率在对粘合膜的配置或弹性系数中的至少一个进行调节的条件下小于振荡器的驱动频率的（1/2）<1/2> 。

公开(公告)号：US5901046A

公开(公告)日：1999-05-04

申请号：US988402

申请日：1997-12-10

申请人： Tameharu Ohta ,  Takashi Yamasaki ,  Kenichi Gohara

发明人： Tameharu Ohta ,  Takashi Yamasaki ,  Kenichi Gohara

IPC分类号： H01L23/04 ,  H05K1/11 ,  H05K3/34 ,  H05K7/02

CPC分类号： H05K3/3442 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/16195 ,  H01L2924/351 ,  H05K1/111 ,  H05K2201/09154 ,  H05K2201/09781 ,  H05K2201/10727 ,  H05K2203/306 ,  Y02P70/613

摘要： A package body holding an acceleration sensor circuit therein has signal electrodes and four dummy electrodes insulated from the signal electrode on a mounted surface thereof. The signal electrodes are electrically connected to the sensor circuit element. The mounted surface of the package body has chamfered portions on verge portions thereof, and auxiliary electrodes are formed on the chamfered portions to be integrally connected to the signal electrodes. The thus constructed package body is mounted on a circuit board by a reflow method using a solder paste so that the signal, dummy, and auxiliary electrodes are connected to a wiring pattern on the circuit board through solder portions. In this process, the solder paste on the dummy electrodes in a fused state generate an internal pressure to retain a clearance between the package body and the circuit board. As a result, the thickness of the solder portions between the package body and the circuit board can be secured, and reliability at a mounted state is improved.

摘要翻译： 保持加速度传感器电路的封装体在其安装表面上具有信号电极和与信号电极绝缘的四个虚拟电极。 信号电极电连接到传感器电路元件。 封装体的安装表面在其边缘部分上具有倒角部分，并且辅助电极形成在倒角部分上以与信号电极一体地连接。 这样构成的封装体通过使用焊膏的回流法安装在电路板上，使得信号，虚拟和辅助电极通过焊料部分连接到电路板上的布线图案。 在这个过程中，处于融合状态的虚拟电极上的焊膏产生内部压力以保持封装主体和电路板之间的间隙。 结果，可以确保封装主体和电路板之间的焊料部分的厚度，并且提高安装状态下的可靠性。