公开(公告)号：US5739263A

公开(公告)日：1998-04-14

申请号：US182194

申请日：1994-01-28

申请人： Tatsuhiro Yoshida ,  Yoshitaka Okugawa ,  Toshio Suzuki ,  Toshiro Takeda ,  Yushi Sakamoto ,  Takuya Tochimoto

发明人： Tatsuhiro Yoshida ,  Yoshitaka Okugawa ,  Toshio Suzuki ,  Toshiro Takeda ,  Yushi Sakamoto ,  Takuya Tochimoto

IPC分类号： C08G73/10 ,  C09J7/00 ,  C09J179/08 ,  C08G69/26

CPC分类号： C08G73/106 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1042 ,  C09J179/08 ,  C09J7/00 ,  Y10S526/935 ,  Y10T428/31681 ,  Y10T428/31721

摘要： The present invention provides a film adhesive comprising, as the main constituent, a polyimide resin having a glass transition temperature of 350.degree. C. or lower and soluble in organic solvents, which polyimide resin is obtained by reacting at least one of the following acid components (A) and (B) (A) 4,4'-oxydiphthalic acid dianhydride (B) 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and/or 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride with at least one of the following amine components (C) and (D) (C) a siloxane compound represented by the following general formula (1) and/or 2,2-bis(4-(4-amino-phenoxy)phenyl)propane ##STR1## wherein R.sub.1 and R.sub.2 are each a bivalent aliphatic (C.sub.1-4) or aromatic group; R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are each a mono-valent aliphatic or aromatic group; and k is an integer of 1-20, (D) bis(aminophenoxy)benzene and/or dimethylphenylene-diamine to give rise to ring closure of imide, as well as a process for producing said film adhesive.

摘要翻译： PCT No.PCT / JP93 / 00351 Sec。 371日期1994年1月28日 102（e）日期1994年1月28日PCT 1993年3月24日PCT公布。 公开号WO93 / 24583 日期：1993年12月9日本发明提供一种胶粘剂，其包含玻璃化转变温度为350℃以下且可溶于有机溶剂的聚酰亚胺树脂作为主要成分，该聚酰亚胺树脂通过使至少一种 的下列酸组分（A）和（B）（A）4,4'-氧联二邻苯二甲酸二酐（B）3,3'，4,4'-联苯四羧酸二酐和/或3,3'，4,4 （C）和（D）（C）中的至少一种下列通式（1）表示的硅氧烷化合物和/或2,2-双（4-（4-（4-甲基苯基） 氨基 - 苯氧基）苯基）丙烷基脂族（C 1-4）或芳基; R3，R4，R5和R6分别为1价脂肪族或芳香族基团; 并且k为1-20的整数，（D）双（氨基苯氧基）苯和/或二甲基亚苯基二胺以引起酰亚胺的闭环，以及制备所述膜粘合剂的方法。

公开(公告)号：US08592256B2

公开(公告)日：2013-11-26

申请号：US12526631

申请日：2008-02-08

申请人： Yoshitaka Okugawa ,  Keiichi Tsukurimichi ,  Hitoshi Kawaguchi

发明人： Yoshitaka Okugawa ,  Keiichi Tsukurimichi ,  Hitoshi Kawaguchi

IPC分类号： H01L23/28

CPC分类号： H05K3/0011 ,  H01L23/145 ,  H01L23/49827 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0366 ,  H05K2203/1105 ,  Y10T29/41 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a circuit board manufacturing method that makes it possible to manufacture a next-generation semiconductor device in a stable manner and improve the yield during secondary mounting processing. A circuit board 11 with a thickness of 230 μm manufactured using a cyanate-based prepreg 12 containing a resin composition with which a glass cloth is impregnated is heated at a higher temperature than a glass transition temperature of the resin composition after it is cured before reflow processing.

摘要翻译： 提供了一种电路板制造方法，其可以以稳定的方式制造下一代半导体器件并且提高二次安装处理期间的产量。 使用含有浸渍有玻璃布的树脂组合物的含氰酸酯类的预浸料12制造厚度为230μm的电路基板11，比在回流固化后的树脂组合物的玻璃化转变温度高的温度下加热 处理。

公开(公告)号：US07331502B2

公开(公告)日：2008-02-19

申请号：US10472311

申请日：2001-03-19

申请人： Ryoichi Okada ,  Hitoshi Aoki ,  Yoshitaka Okugawa ,  Kensuke Nakamura ,  Shinichiro Itoh

发明人： Ryoichi Okada ,  Hitoshi Aoki ,  Yoshitaka Okugawa ,  Kensuke Nakamura ,  Shinichiro Itoh

IPC分类号： B23K31/02

CPC分类号： H05K3/3436 ,  H01L21/486 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1579 ,  H05K3/20 ,  H05K3/305 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/4617 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/10977 ,  H05K2203/0475 ,  H05K2203/1189 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/05599

摘要： In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.

摘要翻译： 在制造电子部件的方法中，包括将具有焊料层或焊料凸块（焊料部分）的电连接用导体部分I的电子部件（A）焊接到电极部件的表面上，（B）电子部件 通过粘合剂层在加热下通过按压（A）至（B）而将具有用于电连接的导体部分II布置在与导体部分I的位置相对应的位置处，焊料部分与粘合剂层接触，焊料 通过在焊料的熔点以上的温度加热来熔融部分，通过挤压熔化的焊料部分进行焊接，并且使粘合剂层固化。 根据该过程获得电子部件。 可靠地实现电连接，并且可以以优异的生产率获得高可靠性的电子部件。

公开(公告)号：US20100038762A1

公开(公告)日：2010-02-18

申请号：US12526631

申请日：2008-02-08

申请人： Yoshitaka Okugawa ,  Keiichi Tsukurimichi ,  Hitoshi Kawaguchi

发明人： Yoshitaka Okugawa ,  Keiichi Tsukurimichi ,  Hitoshi Kawaguchi

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/67

CPC分类号： H05K3/0011 ,  H01L23/145 ,  H01L23/49827 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0366 ,  H05K2203/1105 ,  Y10T29/41 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a circuit board manufacturing method that makes it possible to manufacture a next-generation semiconductor device in a stable manner and improve the yield during secondary mounting processing. A circuit board 11 with a thickness of 230 μm manufactured using a cyanate-based prepreg 12 containing a resin composition with which a glass cloth is impregnated is heated at a higher temperature than a glass transition temperature of the resin composition after it is cured before reflow processing.

摘要翻译： 提供了一种电路板制造方法，其可以以稳定的方式制造下一代半导体器件并且提高二次安装处理期间的产量。 使用含有浸渍有玻璃布的树脂组合物的氰酸酯类预浸料12制造的厚度为230μm的电路基板11在回流固化后比在树脂组合物的玻璃化转变温度高的温度下加热 处理。