公开(公告)号：US4354911A

公开(公告)日：1982-10-19

申请号：US291155

申请日：1981-08-07

申请人： Thomas C. Dodd ,  John A. Emerson

发明人： Thomas C. Dodd ,  John A. Emerson

IPC分类号： C23C18/16 ,  H05K3/04 ,  H05K3/16 ,  H05K3/24 ,  C23C15/00

CPC分类号： C23C18/1605 ,  H05K3/048 ,  H05K3/24 ,  H05K2201/0347 ,  H05K2203/095 ,  H05K3/16

摘要： It has been discovered that by cleaning a substrate having a negative ink pattern of a desired circuit in a plasma comprising 60/40 oxygen/argon and then sputtering a thin (10-50 Angstroms) layer of catalytic copper thereover, the treated substrate when exposed to an electroless plating bath will selectively plate only in the areas where there is no ink.

摘要翻译： 已经发现，通过在包括60/40氧/氩的等离子体中清洁具有所需电路的负墨图案的基底，然后在其上溅射薄（10-50埃）的催化铜层，所暴露的处理的基底 化学镀浴将仅在没有油墨的区域中选择性地镀覆。

公开(公告)号：US4322451A

公开(公告)日：1982-03-30

申请号：US75454

申请日：1979-09-14

申请人： John A. Emerson ,  Wesley P. Townsend

发明人： John A. Emerson ,  Wesley P. Townsend

IPC分类号： C23C18/28 ,  C23C3/02

CPC分类号： C23C18/28

摘要： A method of forming a colloidal wetting sensitizer is disclosed. The method comprises combining a stannous species and a cupric species in an aqueous medium maintained at a pH of between 0.4 and 1.5.

摘要翻译： 公开了形成胶体润湿敏化剂的方法。 该方法包括在保持pH在0.4和1.5之间的水性介质中混合亚锡种类和铜种。

公开(公告)号：US5613557A

公开(公告)日：1997-03-25

申请号：US448108

申请日：1995-05-23

申请人： Curtis G. Blount ,  Robert A. Benham ,  Jerry L. Brock ,  John A. Emerson ,  Keith R. Ferguson ,  Donald F. Scheve ,  Joseph H. Schmidt ,  Karl W. Schuler ,  Philip L. Stanton

发明人： Curtis G. Blount ,  Robert A. Benham ,  Jerry L. Brock ,  John A. Emerson ,  Keith R. Ferguson ,  Donald F. Scheve ,  Joseph H. Schmidt ,  Karl W. Schuler ,  Philip L. Stanton

IPC分类号： E21B23/06 ,  E21B29/10 ,  E21B33/12 ,  E21B33/134

CPC分类号： E21B23/06 ,  E21B29/10 ,  E21B33/12 ,  E21B33/134

摘要： Perforations and other openings in well casings, liners and other conduits may be substantially blocked or sealed to prevent fluid flow between the casing or liner interior and an earth formation by placing a radially expansible sleeve adjacent the perforations or openings and urging the sleeve into forcible engagement with the casing or inner wall using an explosive charge. An apparatus including a radially contracted sleeve formed by a coiled plate member or a tubular member having flutes defined by external and internal folds, may be deployed into a well casing or liner through a production or injection tubing string and on the end of a flexible cable or coilable tubing. An explosive charge disposed on the apparatus and within the sleeve may be detonated to urge the sleeve into forcible engagement with the casing inner wall.

摘要翻译： 井套管，衬管和其它管道中的穿孔和其他开口可以基本上被阻挡或密封，以通过将径向可膨胀的套管放置在穿孔或开口附近并促使套管强制接合以防止流体在套管或内衬内部和地层之间流动 套管或内壁使用炸药。 包括由螺旋板构件形成的径向收缩的套筒或具有由外部和内部折叠限定的槽纹的管状构件的装置可以通过生产或注入管柱并且在柔性电缆的端部部署到井套管或衬套中 或可卷曲管。 布置在设备上和套筒内的爆炸物可以被引爆以促使套管与壳体内壁强制接合。

公开(公告)号：US06443179B1

公开(公告)日：2002-09-03

申请号：US09790423

申请日：2001-02-21

申请人： Gilbert L. Benavides ,  Paul C. Galambos ,  John A. Emerson ,  Kenneth A. Peterson ,  Rachel K. Giunta ,  Robert D. Watson

发明人： Gilbert L. Benavides ,  Paul C. Galambos ,  John A. Emerson ,  Kenneth A. Peterson ,  Rachel K. Giunta ,  Robert D. Watson

IPC分类号： F16K2700

CPC分类号： F16K99/0001 ,  B01L3/502707 ,  B01L2200/021 ,  B01L2300/0636 ,  B01L2300/0867 ,  B01L2300/0874 ,  B01L2300/0887 ,  F15C5/00 ,  F16K99/0042 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/008 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/10253 ,  Y10T137/7504 ,  Y10T137/87249 ,  H01L2924/00014 ,  H01L2924/00

摘要： A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

摘要翻译： 提出了一种用于包装表面微加工电微流体装置的新架构。 这种架构依赖于两个尺寸的包装，从宏观尺度（微升）将流体带入设备规模（皮升）。 该架构模拟和利用电子封装技术。 较大的封装由具有嵌入式流体通道的电路板和标准流体连接器（例如Fluidic Printed Wiring Board）组成。 嵌入式通道连接到较小的封装，即将微流体集成电路（MIC）引入流体的电 - 微流体双列直插封装（EMDIP）。 通过博世蚀刻的孔将流体连接制成MIC的背面，该孔将流体接收到MIC前面的表面微加工通道。 电连接到MIC前面的接合焊盘。

公开(公告)号：US06821819B1

公开(公告)日：2004-11-23

申请号：US10370543

申请日：2003-02-20

申请人： Gilbert L. Benavides ,  Paul C. Galambos ,  John A. Emerson ,  Kenneth A. Peterson ,  Rachel K. Giunta ,  David Lee Zamora ,  Robert D. Watson

发明人： Gilbert L. Benavides ,  Paul C. Galambos ,  John A. Emerson ,  Kenneth A. Peterson ,  Rachel K. Giunta ,  David Lee Zamora ,  Robert D. Watson

IPC分类号： H01L2144

CPC分类号： H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  Y10T137/87153 ,  Y10T137/87249 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

摘要翻译： 提出了一种用于包装表面微加工电微流体装置的新架构。 这种架构依赖于两个尺寸的包装，从宏观尺度（微升）将流体带入设备规模（皮升）。 该架构模拟和利用电子封装技术。 较大的封装由具有嵌入式流体通道的电路板和标准流体连接器（例如Fluidic Printed Wiring Board）组成。 嵌入式通道连接到较小的封装，即将微流体集成电路（MIC）引入流体的电 - 微流体双列直插封装（EMDIP）。 通过博世蚀刻的孔将流体连接制成MIC的背面，该孔将流体接收到MIC前面的表面微加工通道。 电连接到MIC前面的接合焊盘。

公开(公告)号：US06548895B1

公开(公告)日：2003-04-15

申请号：US09790305

申请日：2001-02-21

申请人： Gilbert L. Benavides ,  Paul C. Galambos ,  John A. Emerson ,  Kenneth A. Peterson ,  Rachel K. Giunta ,  David Lee Zamora ,  Robert D. Watson

发明人： Gilbert L. Benavides ,  Paul C. Galambos ,  John A. Emerson ,  Kenneth A. Peterson ,  Rachel K. Giunta ,  David Lee Zamora ,  Robert D. Watson

IPC分类号： H01L2348

CPC分类号： H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  Y10T137/87153 ,  Y10T137/87249 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

摘要翻译： 提出了一种用于包装表面微加工电微流体装置的新架构。 这种架构依赖于两个尺寸的包装，从宏观尺度（微升）将流体带入设备规模（皮升）。 该架构模拟和利用电子封装技术。 较大的封装由具有嵌入式流体通道的电路板和标准流体连接器（例如Fluidic Printed Wiring Board）组成。 嵌入式通道连接到较小的封装，即将微流体集成电路（MIC）引入流体的电 - 微流体双列直插封装（EMDIP）。 通过博世蚀刻的孔将流体连接制成MIC的背面，该孔将流体接收到MIC前面的表面微加工通道。 电连接到MIC前面的接合焊盘。

公开(公告)号：US4384893A

公开(公告)日：1983-05-24

申请号：US341724

申请日：1982-01-22

申请人： John A. Emerson ,  Wesley P. Townsend

发明人： John A. Emerson ,  Wesley P. Townsend

IPC分类号： C23C18/28 ,  C23C3/02

CPC分类号： C23C18/28

摘要： A method of forming a colloidal wetting sensitizer is disclosed. The method comprises combining a stannous species and a cupric species in an aqueous medium maintained at a pH of between 0.4 and 1.5.

摘要翻译： 公开了形成胶体润湿敏化剂的方法。 该方法包括在保持pH在0.4和1.5之间的水性介质中混合亚锡种类和铜种。