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    High force metal plated spring structure
    3.
    发明申请
    High force metal plated spring structure 有权
    高强度金属电镀弹簧结构

    公开(公告)号：US20050006829A1

    公开(公告)日：2005-01-13

    申请号：US10615653

    申请日：2003-07-08

    申请人： Eugene Chow ,  David Fork ,  Thomas Hantschel ,  Koenraad Van Schuylenbergh ,  Christopher Chua

    发明人： Eugene Chow ,  David Fork ,  Thomas Hantschel ,  Koenraad Van Schuylenbergh ,  Christopher Chua

    IPC分类号： F16F1/02 ,  H01L27/148 ,  F16F1/00 ,  F16F9/00 ,  H01L29/768

    CPC分类号： F16F1/027

    摘要： Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure

    摘要翻译： 通过各种方法制造光刻定义和蚀刻的弹簧结构，使得它们在释放之后避免在弹簧结构的下侧上形成电镀金属楔。 使用柱子将弹簧从下面的衬底偏移大于电镀金属的厚度的距离。 在弹簧下方的衬底中蚀刻沟槽，以在弹簧偏转期间提供间隙。 另一个弹簧包括在偏转期间提供必要的间隙的膝盖（弯头）。 电镀工艺限于另一弹簧的上侧。 释放的弹簧用作用于图案化抗蚀剂的荫罩，其防止电镀期间的楔形成。 公开了可以与每个弹簧结构一起使用的各种尖端装置

    Printing system employing deformable polymer printing plates
    5.
    发明授权
    Printing system employing deformable polymer printing plates 有权
    使用可变形聚合物印版的印刷系统

    公开(公告)号：US08468939B2

    公开(公告)日：2013-06-25

    申请号：US13185188

    申请日：2011-07-18

    申请人： Jurgen H. Daniel ,  Dirk De Bruyker ,  David K. Fork ,  Christopher Chua

    发明人： Jurgen H. Daniel ,  Dirk De Bruyker ,  David K. Fork ,  Christopher Chua

    IPC分类号： B41N6/00

    CPC分类号： B41C1/00 ,  B41C1/1041 ,  B41C1/186 ,  B41N1/12 ,  B41N1/22 ,  B41N3/00 ,  B41N3/003 ,  B41N3/006

    摘要： A printing plate has a substrate, an array of cells on the substrate, wherein each cell corresponds to an element of a print image, a deformable polymer material localized into the cells such that each cell is at least partially formed from the deformable polymer material, a reservoir corresponding to each cell to collect the deformable polymer material as needed when the deformable polymer material is one of either melted or softened, and a heater to cause the deformable polymer material to either melt or soften. A method of forming a printing plate provides an array of cells, first heats the array of cells such that the deformable polymer material does one of either melts or softens, actuates the cells in the array to assume a deformed state, cools the array of cells to solidify the cells in the deformed state, second heats the cells such that the deformable polymer material in selected ones of the cells does one of either soften or melt and return to a less deformed state to form a printing pattern, and cools the surface to solidify the deformable polymer material in the printing pattern. A method of forming a printing plate provides an array of cells, heats the array of cells such that the deformable polymer material softens, actuates selected ones of the cells to deform surfaces of the selected ones to form a printing pattern, and cools the array of cells to solidify the printing pattern into a printing plate.

    摘要翻译： 印版具有衬底，衬底上的单元阵列，其中每个单元对应于印刷图像的元素，位于单元中的可变形聚合物材料，使得每个单元至少部分地由可变形聚合物材料形成， 当可变形聚合物材料是熔化或软化之一时，根据需要收集可变形聚合物材料的储存器，以及使可变形聚合物材料熔融或软化的加热器。 形成印版的方法提供了一个单元阵列，首先加热单元阵列，使得可变形的聚合物材料进行融化或软化之一，致动阵列中的单元以呈现变形状态，冷却单元阵列 使细胞在变形状态下固化，第二加热细胞，使得选定细胞中的可变形聚合物材料进行软化或熔化，并恢复到较小的变形状态以形成印刷图案，并将表面冷却至 使印刷图案中的可变形聚合物材料固化。 形成印版的方法提供了一个单元阵列，加热单元阵列使得可变形的聚合物材料软化，致动所选择的单元格以使选定的单元的表面变形以形成印刷图案，并且冷却 细胞将印刷图案固化成印版。

    Stressed metal contact with enhanced lateral compliance
    7.
    发明申请
    Stressed metal contact with enhanced lateral compliance 有权
    强化金属接触，增强侧向顺应性

    公开(公告)号：US20050130462A1

    公开(公告)日：2005-06-16

    申请号：US10737272

    申请日：2003-12-15

    申请人： Koenraad Van Schuylenbergh ,  Christopher Chua ,  David Fork

    发明人： Koenraad Van Schuylenbergh ,  Christopher Chua ,  David Fork

    IPC分类号： H01R12/00

    CPC分类号： H01R13/2407

    摘要： An electrical interconnect structure that includes a spring portion that extends out of a plane. The electrical interconnect including curved regions to improve the lateral compliance of the interconnect. The curved region may be incorporated into a release region of the spring. The release region may include either or both an uplifted region and a planar region. The curves in the release region are arranged to improve the spring contact with a mating surface and also improve lateral compliance compared to prior art spring designs.

    摘要翻译： 一种电互连结构，其包括从平面延伸的弹簧部分。 电互连包括弯曲区域，以改善互连的横向顺应性。 弯曲区域可以结合到弹簧的释放区域中。 释放区域可以包括隆起区域和平坦区域中的一个或两个。 释放区域中的曲线布置成改进与配合表面的弹簧接触，并且与现有技术的弹簧设计相比，还改善了侧向顺从性。

    Structure and method for releasing stressy metal films
    8.
    发明申请
    Structure and method for releasing stressy metal films 有权
    用于释放应力金属膜的结构和方法

    公开(公告)号：US20070141742A1

    公开(公告)日：2007-06-21

    申请号：US11300872

    申请日：2005-12-15

    申请人： Christopher Chua ,  David Fork ,  Koenraed Van Schuylenbergh

    发明人： Christopher Chua ,  David Fork ,  Koenraed Van Schuylenbergh

    IPC分类号： H01L21/00

    CPC分类号： B81C1/0015 ,  Y10T428/24942

    摘要： A method and structure for forming a spring structure that avoids undesirable kinks in the spring is described. The method converts a portion of a release layer such that the converted portion resists etching. The converted portion then serves as an anchor region for a spring structure deposited over the release layer. When the non-converted portions of the release layer are etched, the spring curls out of the plane of a plane.

    摘要翻译： 描述了形成弹簧结构的方法和结构，其避免了弹簧中不希望的扭结。 该方法将释放层的一部分转换成转换部分抵抗蚀刻。 转换的部分然后用作沉积在释放层上的弹簧结构的锚定区域。 当剥离层的未转化部分被蚀刻时，弹簧卷曲在平面的平面之外。

    STRUCTURE AND METHOD FOR RELEASING STRESSY METAL FILMS
    9.
    发明申请
    STRUCTURE AND METHOD FOR RELEASING STRESSY METAL FILMS 审中-公开
    用于释放应力金属膜的结构和方法

    公开(公告)号：US20080095996A1

    公开(公告)日：2008-04-24

    申请号：US11959813

    申请日：2007-12-19

    申请人： Christopher Chua ,  David Fork ,  Koenraad Van Schuylenbergh

    发明人： Christopher Chua ,  David Fork ,  Koenraad Van Schuylenbergh

    IPC分类号： B32B7/02

    CPC分类号： B81C1/0015 ,  Y10T428/24942

    摘要： A method and structure for forming a spring structure that avoids undesirable kinks in the spring is described. The method converts a portion of a release layer such that the converted portion resists etching. The converted portion then serves as an anchor region for a spring structure deposited over the release layer. When the non-converted portions of the release layer are etched, the spring curls out of the plane of a plane.

    摘要翻译： 描述了形成弹簧结构的方法和结构，其避免了弹簧中不希望的扭结。 该方法将释放层的一部分转换成转换部分抵抗蚀刻。 转换的部分然后用作沉积在释放层上的弹簧结构的锚定区域。 当剥离层的未转化部分被蚀刻时，弹簧卷曲在平面的平面之外。