公开(公告)号：US5343366A

公开(公告)日：1994-08-30

申请号：US903838

申请日：1992-06-24

申请人： Thomas M. Cipolla ,  Paul W. Coteus ,  Ioannis Damianakis ,  Glen W. Johnson ,  Peter G. Ledermann ,  Linda C. Matthew ,  Lawrence S. Mok

发明人： Thomas M. Cipolla ,  Paul W. Coteus ,  Ioannis Damianakis ,  Glen W. Johnson ,  Peter G. Ledermann ,  Linda C. Matthew ,  Lawrence S. Mok

IPC分类号： H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01R23/68

CPC分类号： H05K3/363 ,  H01L24/01 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2225/06551 ,  H01L2225/06596 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2201/10484 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2201/10984 ,  H05K3/326 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/366 ,  H05K3/4007 ,  H05K3/4092

摘要： This invention relates to three dimensional packaging of integrated circuit chips into stacks to form cuboid structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate having a plurality of conductors one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate and within which corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contain solder and form solder loaded pin-like structures. The pin-like structures can be directly solder bonded to conductors on a second substrate surface or the pin-like structures can be adapted for insertion into apertures in a second substrate. The second substrate provides a means for electrically inter-connecting a plurality of these cuboids. Preferably, the first and second substrates are circuitized flexible polymeric films. The second substrate is disposed on a third substrate, such as a PC board, with a resilient material therebetween which permits a heat sink to be pressed into intimate contact with an opposite side of the cuboid structures.

摘要翻译： 本发明涉及将集成电路芯片三维封装成堆栈以形成立方体结构。 在堆叠中的相邻芯片之间，设置有电互连装置，其是具有多个导体的第一基板，其多个导体电连接到芯片接触位置，并且其另一端延伸到芯片堆叠的一侧， 形成多个针状电互连组件。 销状结构可以由在其至少一侧上具有电导体的第一基板的凸起从该侧延伸形成。 或者，销状结构可以由从第一基板的边缘的两侧悬臂的导体形成，并且其中来自两侧的相应导体对准并且间隔开第一基板厚度。 这些空间包含焊料并形成焊料加载的针状结构。 销状结构可以直接焊接到第二衬底表面上的导体上，或者针状结构可以适于插入到第二衬底中的孔中。 第二基板提供用于电连接多个这些长方体的装置。 优选地，第一和第二基底是电路化柔性聚合物膜。 第二基板设置在诸如PC板的第三基板上，其间具有弹性材料，其允许将散热器压紧成与长方体结构的相对侧紧密接触。

公开(公告)号：US5208729A

公开(公告)日：1993-05-04

申请号：US836672

申请日：1992-02-14

申请人： Thomas M. Cipolla ,  Paul W. Coteus ,  Glen W. Johnson ,  Lawrence S. Mok

发明人： Thomas M. Cipolla ,  Paul W. Coteus ,  Glen W. Johnson ,  Lawrence S. Mok

IPC分类号： H05K5/00 ,  H01L23/467 ,  H01L25/10 ,  H05K7/14 ,  H05K7/20

CPC分类号： H05K7/1429 ,  H01L23/467 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2924/0002

摘要： A high density package for a plurality of integrated circuit chips is described, the package including a number of planar subunits. A subunit includes first and second planar metal plates and a spacer metal plate sandwiched therebetween. Each spacer metal plate is provided with a plurality of circuit-receiving apertures. A planar circuit carrier is provided for each aperture in the spacer metal plate. One face of each circuit carrier includes a plurality of bonded chips. Each circuit carrier is positioned in a circuit-receiving aperture so that rear aspects of the bonded chips bear upon the second planar metal plate. Each circuit carrier has a connector region which extends out from between the first planar metal plate and the metal spacer plate at one extremity of each circuit-receiving aperture. A circuit card is positioned at that extremity and has a plurality of interconnection areas, one for each extended connector region. The circuit card has its major surface oriented parallel to the metal plates so that the entire package presents an overall planar configuration.

公开(公告)号：US5113565A

公开(公告)日：1992-05-19

申请号：US549577

申请日：1990-07-06

申请人： Thomas M. Cipolla ,  Paul W. Coteus ,  Glen W. Johnson ,  Philip Murphy ,  Christopher W. Oden

发明人： Thomas M. Cipolla ,  Paul W. Coteus ,  Glen W. Johnson ,  Philip Murphy ,  Christopher W. Oden

IPC分类号： H01L21/60 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68

CPC分类号： H01L21/67144 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T29/41 ,  Y10T29/49121 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53178

摘要： A method is described for aligning a contact pattern on an electronic device held by a first movable support, with a bond site pattern on a lead frame held by a second movable support. The method includes the steps of: (a) creating and storing models of a chip's contact pattern and a lead frame's bond site pattern; (b) imaging the electronic device and lead frame; (c) determining the position of contacts on said electronic device and reorienting the contact pattern model to a best fit with the imaged contact position; (d) determining the position of each bond site on the imaged lead frame and reorienting the bond site model to a best fit with the imaged bond site position; (e) determining positional differences between the reoriented lead frame and contact pattern models; and (f) generating signals to reorient the first and second movable supports to minimize the positional differences when they are moved into a bonding positon. A machine is described for performing the above method wherein each of three main movable elements of the machine is assigned a dimensional axis in which its travel is non-adjustable, so that other movable elements can be calibrated thereagainst.

公开(公告)号：US06712527B1

公开(公告)日：2004-03-30

申请号：US09481903

申请日：2000-01-12

申请人： Benson Chan ,  Mitchell S. Cohen ,  Paul F. Fortier ,  Ladd W. Freitag ,  Richard R. Hall ,  Glen W. Johnson ,  How Tzu Lin ,  John H. Sherman

发明人： Benson Chan ,  Mitchell S. Cohen ,  Paul F. Fortier ,  Ladd W. Freitag ,  Richard R. Hall ,  Glen W. Johnson ,  How Tzu Lin ,  John H. Sherman

IPC分类号： G02B636

CPC分类号： G02B6/4201 ,  G02B6/3885 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4261 ,  G02B6/4268 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H05K1/189

摘要： A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

摘要翻译： 描述了将十二通道宽光纤电缆耦合到十二通道垂直腔面发射激光器（VCSEL）发射器和多通道垂直对准集成管芯（PAID）接收器的封装。 该封装允许通过垂直定向平行于光纤电缆的某些管芯并水平地定向某些其他管芯来降低组件封装的高度。 组件允许垂直定向的光电管芯通过柔性电路垂直地附接到水平取向的层压板。

公开(公告)号：US07062121B2

公开(公告)日：2006-06-13

申请号：US10295255

申请日：2002-11-15

申请人： Blake G. Fitch ,  Robert S. Germain ,  Glen W. Johnson ,  Daniel M. Kuchta ,  Jeannine M. Trewhella

发明人： Blake G. Fitch ,  Robert S. Germain ,  Glen W. Johnson ,  Daniel M. Kuchta ,  Jeannine M. Trewhella

IPC分类号： G02B6/28

CPC分类号： G06E1/00

摘要： An information processing system, includes several processors, each having at least one optical fiber input and at least one optical fiber output; a controller having an optical fiber input and at least one fiber output; fibers, bundled for transmitting information; and a fiber bundle redriver, coupled to the controller, having an input channel and an output channel, for simultaneously redriving an optical signal received from any selected one of the plurality of input fibers onto substantially all of the plurality of output fibers. The fiber output of each of the plurality of processors and the at least one fiber output of the controller are respectively is coupled to the input channel of the fiber bundle redriver, and the at least one fiber input of each of said plurality of processors and the fiber input of the controller are respectively coupled to the output channel of the fiber bundle redriver.

摘要翻译： 信息处理系统包括几个处理器，每个处理器具有至少一个光纤输入和至少一个光纤输出; 具有光纤输入和至少一个光纤输出的控制器; 捆绑的光纤，用于传输信息; 以及耦合到所述控制器的具有输入通道和输出通道的光纤束驱动器，用于同时将从所述多个输入光纤中的任何选定的输入光纤接收的光信号重新分配到基本上所有多个输出光纤上。 多个处理器中的每一个的光纤输出和控制器的至少一个光纤输出分别耦合到光纤束转接器的输入通道，并且所述多个处理器中的每一个的至少一个光纤输入和 控制器的光纤输入分别耦合到光纤束转接器的输出通道。

公开(公告)号：US5631991A

公开(公告)日：1997-05-20

申请号：US592279

申请日：1996-01-26

申请人： Mitchell S. Cohen ,  Glen W. Johnson ,  Jeannine M. Trewhella

发明人： Mitchell S. Cohen ,  Glen W. Johnson ,  Jeannine M. Trewhella

IPC分类号： G02B6/42 ,  G02B6/00 ,  G02B6/255

CPC分类号： G02B6/4234 ,  G02B6/4204 ,  G02B6/4225 ,  G02B6/4207

摘要： A method for providing X,Y and Z alignment during fabrication of an optical subassembly (OSA) by active alignment and fixing with epoxy through the agency of radio frequency (RF) heating in order to provide acceptable feedback-induced noise level along with acceptable coupling efficiency.

摘要翻译： 一种在通过射频（RF）加热来主动对准和固定环氧树脂来制造光学子组件（OSA）期间提供X，Y和Z对准的方法，以便提供可接受的反馈感应噪声水平以及可接受的耦合 效率。

公开(公告)号：US06798953B1

公开(公告)日：2004-09-28

申请号：US09479109

申请日：2000-01-07

申请人： Mitchell S. Cohen ,  Michael J. Cordes ,  Steven A. Cordes ,  William K. Hogan ,  Glen W. Johnson ,  Daniel M. Kuchta ,  Dianne L. Lacey ,  James L. Speidell ,  Jeannine M. Trewhella ,  Joseph P. Zinter

发明人： Mitchell S. Cohen ,  Michael J. Cordes ,  Steven A. Cordes ,  William K. Hogan ,  Glen W. Johnson ,  Daniel M. Kuchta ,  Dianne L. Lacey ,  James L. Speidell ,  Jeannine M. Trewhella ,  Joseph P. Zinter

IPC分类号： G02B630

CPC分类号： G02B6/4246 ,  G02B6/3652 ,  G02B6/423 ,  G02B6/4239

摘要： A structure that includes a substrate, typically a semiconductor chip such as a VCSEL or photodetector chip, and a guide for aligning a signal conveying device, typically an optical fiber, to a transducer such as an optoelectronic device on the semiconductor chip. The guide is formed, in a preferred embodiment, by lithographically exposing and developing a thick layer of photoresist. The structure is assembled by placing and securing the signal conveying device into a cavity-like region of the guide.

摘要翻译： 包括基板，通常为诸如VCSEL或光电检测器芯片的半导体芯片的结构，以及用于将信号传送装置（通常为光纤）对准到诸如半导体芯片上的光电子装置的换能器的引导件。 在优选实施例中，通过光刻曝光和显影厚的光致抗蚀剂层来形成引导件。 通过将信号传送装置放置并固定到引导件的腔状区域来组装结构。

公开(公告)号：US5093879A

公开(公告)日：1992-03-03

申请号：US542275

申请日：1990-06-22

申请人： Mark F. Bregman ,  William D. Brewer ,  Mitchell S. Cohen ,  Glen W. Johnson ,  Ismail C. Noyan ,  Modest M. Oprysko ,  Mark B. Ritter ,  Dennis L. Rogers ,  Jeanine M. Trewhella

发明人： Mark F. Bregman ,  William D. Brewer ,  Mitchell S. Cohen ,  Glen W. Johnson ,  Ismail C. Noyan ,  Modest M. Oprysko ,  Mark B. Ritter ,  Dennis L. Rogers ,  Jeanine M. Trewhella

IPC分类号： G02B6/42 ,  G02B6/43 ,  H01L31/12 ,  H01L31/167 ,  H04B10/00

CPC分类号： G02B6/4249 ,  G02B6/43 ,  H01L31/167 ,  H04B10/803

摘要： A direct optical connector (DOC) comprised of first and second members, each including a plurality of light emitting and light detecting locations, operative in combination with energy transfer media to form direct optical connections between the light emitting locations and the light detecting locations, wherein said first and second members are adapted for reclosable connection to each other whereupon the light emitting locations on one member are aligned with the light detecting locations on the other member. The first and second members of the preferred DOC are modular. Alternative forms of energy transfer media are used in various embodiments of the invention including lenslet arrays, imaging fiber plates (IFPs), and energy transfer fiber plates (ETFPs). These media have differing alignment criteria, differing degrees of immunity from crosstalk, differing degrees of transfer efficiency, different manufacturing costs, etc., thereby permitting the fabrication and/or use of a connector most suited to meet the requirements of a particular application.A modular half of a DOC can be used in conjunction with a remote optical connector (ROC) to channel light over relatively long distances. The invention also encompasses processes for fabricating ROCs.

公开(公告)号：US06547452B1

公开(公告)日：2003-04-15

申请号：US09568978

申请日：2000-05-11

申请人： Benson Chan ,  Paul F. Fortier ,  Francois M. Guindon ,  Glen W. Johnson ,  Martial A. Letourneau ,  John H. Sherman ,  Real Tetreault

发明人： Benson Chan ,  Paul F. Fortier ,  Francois M. Guindon ,  Glen W. Johnson ,  Martial A. Letourneau ,  John H. Sherman ,  Real Tetreault

IPC分类号： G02B636

CPC分类号： B29C45/14655 ,  B29C45/14065 ,  G02B6/4201 ,  G02B6/421 ,  G02B6/423 ,  G02B6/4231 ,  G02B6/4239 ,  G02B6/4255 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

摘要： Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.

摘要翻译： 用于具有包覆成型芯片载体的光电子模块的对准系统包括用于接合定位销的钻孔或铣削基板拐角，以将基板精确地对准模具中用于模制基板上的二次模制框架。 包覆模制框架包括用于接收保持器柱的狭槽和三叶孔，以将保持器组件精确对准在包覆模制框架上。 包覆模制框架和保持器组件上的合作支座稳定了这些组件的组装，并提供了一个精确的间隙，用于接收粘合剂以永久地附接这两个部件。 保持器组件携载包括柔性电路的光电子部件，并且该柔性电路的远端部分和包覆模制框架中的接收腔的壁具有用于将柔性电路的远端电引线与电极焊盘阵列精确对准的配合特征 在基板上。 柔性电路的近端部分上的永久性护罩保护并有助于使邻近的电引线与光学管芯及其载体上的电焊盘对准。

公开(公告)号：US5537504A

公开(公告)日：1996-07-16

申请号：US551072

申请日：1995-10-31

申请人： Michael F. Cina ,  Mitchell S. Cohen ,  Glen W. Johnson ,  Modest M. Oprysko ,  Jeannine M. Trewhella

发明人： Michael F. Cina ,  Mitchell S. Cohen ,  Glen W. Johnson ,  Modest M. Oprysko ,  Jeannine M. Trewhella

IPC分类号： G02B6/42 ,  G02B6/00 ,  G02B6/36

CPC分类号： G02B6/4206 ,  G02B6/4204 ,  G02B6/4234

摘要： An optical subassembly for transferring light between an optoelectronic converter and an optical fiber where the housing and the lens are of plastic in which the housing is made to dimensions within the precision of molded plastic and the lens imparts focusing properties that compensate for the limitations of the plastic technology. Alignment in the X-Y plane only is employed. The lens has a first surface focused on the optoelectronic converter which substantially collimates the light through the lens and a second surface that introduces deliberate longitudinal spherical aberration that compensates for component position. Attachment or fixing of the optoelectronic converter to the housing is accomplished by RF heating a TO can to quickly cure an epoxylayer.