公开(公告)号：US20070114672A1

公开(公告)日：2007-05-24

申请号：US11583850

申请日：2006-10-20

申请人： Tomoko Higashino ,  Hirotaka Nishizawa ,  Tamaki Wada ,  Chuichi Miyazaki

发明人： Tomoko Higashino ,  Hirotaka Nishizawa ,  Tamaki Wada ,  Chuichi Miyazaki

IPC分类号： H01L23/52

CPC分类号： H01L25/0657 ,  H01L24/27 ,  H01L24/45 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/50 ,  H01L2221/68336 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： The miniaturization of the system in package which laminates a plurality of semiconductor chips on a wiring substrate via a die attach film is promoted. In the system in package (SiP) which laminates memory chips and microcomputer chip via die attach film on wiring substrate, by forming metal plate in the chip mounting region of wiring substrate, and mounting memory chip of an undermost layer on this metal plate, the flatness of the chip mounting region of wiring substrate is secured, and die attach film which intervenes between metal plate and memory chip of an undermost layer is made the same quality as die attach film which intervenes between chips (between memory chips and between memory chip and microcomputer chips), and the same thickness.

摘要翻译： 促进了通过管芯附着膜在布线基板上层叠多个半导体芯片的封装体系的小型化。 在通过在布线基板上通过芯片安装膜层叠存储芯片和微型计算机芯片的系统（SiP）中，通过在布线基板的芯片安装区域中形成金属板，并在该金属板上安装最底层的存储芯片， 确保布线基板的芯片安装区域的平坦度，并且插入介于金属板和最下层的存储芯片之间的管芯附着膜与插入芯片之间的芯片附近的芯片（存储芯片之间以及存储芯片与 微型计算机芯片），厚度相同。

公开(公告)号：US07669773B2

公开(公告)日：2010-03-02

申请号：US11907911

申请日：2007-10-18

申请人： Hirotaka Nishizawa ,  Takashi Totsuka ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Takashi Totsuka ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

IPC分类号： G06K19/06 ,  G06K7/06 ,  G06K5/00

CPC分类号： G06K19/07743 ,  G06K19/072 ,  G06K19/077 ,  G06K19/07732 ,  G06K19/07739 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/284 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.

摘要翻译： 实现与SIM卡的兼容性和适应具有微型计算机和存储卡控制器的IC卡模块中的高速存储器访问。 IC卡模块包括多个第一外部连接端子和暴露于卡片基板的一个表面的多个第二外部连接端子，连接到第一外部连接端子的微型计算机，连接到第二外部连接端子的存储器控​​制器 以及连接到存储器控制器的易失性存储器。 卡基板的形状和第一外部连接端子的布局基于ETSI TS 102 221 V4.4.0（2001-10）的插件UICC的标准或具有兼容性。 第二外部连接端子基于第一外部连接端子的标准设置在端子布局的最小范围之外。 第一和第二外部连接端子分别包括彼此电分离的信号端子。

公开(公告)号：US20100025480A1

公开(公告)日：2010-02-04

申请号：US12442968

申请日：2007-03-30

申请人： Hirotaka Nishizawa ,  Junichiro Osako ,  Hironori Iwasaki ,  Hideo Koike ,  Tamaki Wada ,  Takashi Totsuka

发明人： Hirotaka Nishizawa ,  Junichiro Osako ,  Hironori Iwasaki ,  Hideo Koike ,  Tamaki Wada ,  Takashi Totsuka

IPC分类号： G06K19/067 ,  H01R13/62

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07739 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06562 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00014

摘要： A technique for an IC capable of achieving the large expandability of the memory capacity, a memory capacity and cost burden in accordance with the requirements of users is provided. The IC card of the present invention is a flash memory card 306 mounted with a flash memory, characterized in that the flash memory card 306 can be inserted into a Plug-in SIM adaptor 305a and/or a mini UICC adaptor 305b each mounted with a secure IC, the flash memory card 306 is inserted into the Plug-in SIM adaptor 305a or the mini UICC adaptor 305b, thereby operating as a SIM attached with an expansion memory or a mini UICC attached with an expansion memory, and the flash memory card 306 can be physically removed from the Plug-in SIM adaptor 305a or the mini UICC adaptor 305b.

摘要翻译： 提供了一种能够根据用户要求实现存储容量的大的可扩展性，存储容量和成本负担的IC技术。 本发明的IC卡是安装有闪存的闪存卡306，其特征在于，闪存卡306可以被插入到插入式SIM适配器305a和/或迷你UICC适配器305b中， 安全IC，将闪存卡306插入到插入式SIM适配器305a或迷你UICC适配器305b中，从而作为附接有扩展存储器的SIM卡或附带有扩展存储器的迷你UICC操作闪存卡 306可以从插件SIM适配器305a或迷你UICC适配器305b物理地移除。

公开(公告)号：US07341198B2

公开(公告)日：2008-03-11

申请号：US10588301

申请日：2004-02-20

申请人： Hirotaka Nishizawa ,  Junichiro Osako ,  Kenji Osawa ,  Tamaki Wada ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Junichiro Osako ,  Kenji Osawa ,  Tamaki Wada ,  Michiaki Sugiyama

IPC分类号： G06K19/06

CPC分类号： G06K19/07745 ,  G06K19/07 ,  G06K19/07718 ,  G06K19/07732 ,  G06K19/07739 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00

摘要： An IC card 1CD includes a frame member portion 1CB1, and an IC card main body 15 held in a state of being hung by a connecting portion 1CB2 in a frame thereof. The IC card main body 15 is made to constitute a card type information medium having a high functional performance having both of a function as a so-to-speak IC card and a function as a so-to-speak memory card having a capacity larger than that of the IC card and a function higher than that of the IC card capable of executing a security processing. An outer shape of the IC card main body 15 is formed in compliance with RS-MMC outer shape standard. A surface of a cap portion 1CB3 of the IC card main body 15 is printed with a desired character, pattern, diagram and photograph or the like by a printing method used in steps of fabricating a general IC card, and the IC card 15 is provided with higher acknowledgement performance, security performance and outlook.

摘要翻译： IC卡1CD包括框架部件CB1和IC卡主体15，该IC卡主体15以其框架中的连接部分CB 2挂起的状态保持。 IC卡主体15构成具有高功能性的卡式信息介质，具有作为即插即用IC卡的功能，以及作为具有容量较大的说话存储卡的功能 并且具有比能够执行安全处理的IC卡的功能更高的功能。 IC卡主体15的外形形状符合RS-MMC外形标准。 IC卡主体15的盖部分1 CB 3的表面通过用于制造通用IC卡的步骤中使用的打印方法打印所需的字符，图案，图表和照片等，并且IC卡15 具有更高的确认性能，安全性能和前景。

公开(公告)号：US07233058B2

公开(公告)日：2007-06-19

申请号：US11203969

申请日：2005-08-16

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Masachika Masuda ,  Kenji Osawa ,  Junichiro Osako ,  Satoshi Hatakeyama ,  Haruji Ishihara ,  Kazuo Yoshizaki ,  Kazunori Furusawa

IPC分类号： H01L23/02 ,  H05K1/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07737 ,  G06K19/07739 ,  G06K19/07743 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H05K5/026 ,  H05K5/0282 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

摘要翻译： 在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上，适配器2侧的凹部装配成两个部分作为整体单元形成在 可更换的方式。 因此，小型存储卡1可以保持与现有存储卡的尺寸兼容性，由此小尺寸存储卡1也可以用于被设计为处理现有存储卡的设备中。

公开(公告)号：US07120029B2

公开(公告)日：2006-10-10

申请号：US10668187

申请日：2003-09-24

申请人： Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi ,  Junichiro Osako ,  Tamaki Wada

发明人： Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi ,  Junichiro Osako ,  Tamaki Wada

IPC分类号： H05K1/14

CPC分类号： G06K19/07743 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/14 ,  Y10S439/945 ,  Y10S439/946 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

摘要： The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.

摘要翻译： 提高IC卡的生产率。 在其中具有布线基板的存储体和安装在布线基板的主表面上的半导体芯片被夹持在第一壳体和第二壳体之间的类型的存储卡中，平面轮廓 存储器体小于存储卡的平面轮廓的一半。 存储体被布置成相对于位于第一端侧和第二端侧之间的中线的位置，更靠近作为存储卡的一个短边的第一端侧，作为位于存储卡的相对的短边 与第一端侧相对的一侧。 将第一和第二种情况下的存储体配置区域以外的区域用作另一功能区域。

公开(公告)号：US07012321B2

公开(公告)日：2006-03-14

申请号：US10377713

申请日：2003-03-04

申请人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

发明人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

IPC分类号： H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01R43/00

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3011 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

公开(公告)号：US20050253239A1

公开(公告)日：2005-11-17

申请号：US11113188

申请日：2005-04-25

申请人： Hirotaka Nishizawa ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama ,  Takashi Totsuka

发明人： Hirotaka Nishizawa ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama ,  Takashi Totsuka

IPC分类号： B42D15/10 ,  G06K7/00 ,  G06K13/06 ,  G06K17/00 ,  G06K19/07 ,  G06K19/077 ,  H01L23/02

CPC分类号： G06K19/077 ,  G06K7/0021 ,  G06K13/06 ,  G06K19/07732 ,  G06K19/07741 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  Y10S439/948 ,  H01L2224/48227 ,  H01L2924/00012

摘要： This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. A multi-function memory card is composed of a card body and a cap for housing the card body. The card body is made of mold resin that encapsulates plural semiconductor chips mounted on a main surface of a wiring substrate. The card body is housed into the cap with the back face of the wiring substrate facing outward. Guide channels are provided at both side faces of the cap for preventing that the card is inserted upside down. Further, a convex section is provided at the trailing edge of the cap for preventing that the card is inserted in the wrong direction.

摘要翻译： 本发明提供了一种超小型化的小型存储卡，其具有用于防止错误插入到存储卡插槽的机构。 多功能存储卡由卡体和用于容纳卡体的盖组成。 卡体由密封安装在布线基板主表面上的多个半导体芯片的模塑树脂制成。 将卡体容纳在盖中，使布线基板的背面朝外。 引导通道设置在盖的两个侧面，以防止卡被倒置插入。 此外，在盖的后缘设置凸部，以防止卡以错误的方向插入。

公开(公告)号：US20050252978A1

公开(公告)日：2005-11-17

申请号：US11125197

申请日：2005-05-10

申请人： Hirotaka Nishizawa ,  Takashi Totsuka ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Takashi Totsuka ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

IPC分类号： G06K19/077 ,  H04Q7/38 ,  H05K1/11 ,  H05K3/28 ,  G06K19/06

CPC分类号： G06K19/07743 ,  G06K19/072 ,  G06K19/077 ,  G06K19/07732 ,  G06K19/07739 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/284 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.

摘要翻译： 实现与SIM卡的兼容性和适应具有微型计算机和存储卡控制器的IC卡模块中的高速存储器访问。 IC卡模块包括多个第一外部连接端子和暴露于卡片基板的一个表面的多个第二外部连接端子，连接到第一外部连接端子的微型计算机，连接到第二外部连接端子的存储器控​​制器 以及连接到存储器控制器的易失性存储器。 卡基板的形状和第一外部连接端子的布局基于ETSI TS 102 221 V4.4.0（2001-10）的插件UICC的标准或具有兼容性。 第二外部连接端子基于第一外部连接端子的标准设置在端子布局的最小范围之外。 第一和第二外部连接端子分别包括彼此电分离的信号端子。

公开(公告)号：US20050184380A1

公开(公告)日：2005-08-25

申请号：US11114175

申请日：2005-04-26

申请人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

发明人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

IPC分类号： G11C8/00 ,  H01L23/02 ,  H01L23/495

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individually input. On the occasion of making access to one semiconductor chip, the other semiconductor chip is set to the low power consumption mode by setting the clock enable signal and chip select signal to the non-active condition.