Surface emitting semiconductor laser having an interference filter
    6.
    发明申请
    Surface emitting semiconductor laser having an interference filter 有权
    具有干涉滤光片的表面发射半导体激光器

    公开(公告)号:US20050226304A1

    公开(公告)日:2005-10-13

    申请号:US11048269

    申请日:2005-01-31

    摘要: A surface emitting semiconductor laser includes a semiconductor chip (1), which emits radiation (12) and contains a first resonator mirror (3). A second resonator mirror (6) is arranged outside the semiconductor chip (1). The first resonator mirror (3) and the second resonator mirror (6) form a laser resonator for the radiation (12) emitted by the semiconductor chip (1). The laser resonator contains an interference filter (9, 17), which is formed from an interference layer system comprising a plurality of dielectric layers.

    摘要翻译: 表面发射半导体激光器包括发射辐射(12)并包含第一谐振镜(3)的半导体芯片(1)。 第二谐振器反射镜(6)布置在半导体芯片(1)的外部。 第一谐振镜(3)和第二谐振镜(6)形成用于由半导体芯片(1)发射的辐射(12)的激光谐振器。 激光谐振器包含由包括多个电介质层的干涉层系统形成的干涉滤光器(9,17)。

    Compact Housing
    9.
    发明申请
    Compact Housing 有权
    紧凑型住宅

    公开(公告)号:US20110280025A1

    公开(公告)日:2011-11-17

    申请号:US12809694

    申请日:2008-11-24

    IPC分类号: F21V29/00 F21V15/01

    摘要: A compact housing comprises a one-piece mounting plate made from a metallic material, which is designed to be joined thermally conductively by a main side to an external support not belonging to the compact housing. Furthermore, the compact housing comprises a one-piece housing cover, which is joined permanently to the mounting plate and therewith encloses a volume. In addition, the compact housing contains at least one electrical feedthrough, such that at least one electrically conductive connection may be produced therewith from inside the volume to outside the volume, this connection being insulated electrically from the mounting plate. Within the volume a module is located which is designed to emit electromagnetic radiation. This module is applied directly to the mounting plate, such that the joint face between mounting plate and module is substantially parallel to the main side of the mounting plate joined to the external support.

    摘要翻译: 紧凑的壳体包括由金属材料制成的一体式安装板,其被设计成通过主侧导热地连接到不属于紧凑壳体的外部支撑件。 此外,紧凑的壳体包括一体式外壳盖,其永久地连接到安装板并且包围一个体积。 此外,紧凑的壳体包含至少一个电馈通,使得至少一个导电连接可以从体积内部到外部产生,该连接与安装板电绝缘。 在该体积内,设计用于发射电磁辐射的模块。 该模块直接应用于安装板,使得安装板和模块之间的接合面基本上平行于连接到外部支撑件的安装板的主侧。