公开(公告)号：US20100254961A1

公开(公告)日：2010-10-07

申请号：US12676030

申请日：2008-09-04

申请人： Toshihiko Nishio ,  Hidetoshi Sugino ,  Tsutomu Okubo ,  Shoichi Ishigaki

发明人： Toshihiko Nishio ,  Hidetoshi Sugino ,  Tsutomu Okubo ,  Shoichi Ishigaki

IPC分类号： A61K38/43 ,  A61K47/00 ,  A61K47/38 ,  A61K47/42 ,  A61K47/30 ,  A61K31/715 ,  A61K35/54 ,  A61K36/82 ,  A61K36/48

CPC分类号： A61K9/7007 ,  A61K8/0208 ,  A61K8/0212 ,  A61K8/64 ,  A61K8/65 ,  A61K8/731 ,  A61K8/735 ,  A61K8/736 ,  A61K8/8129 ,  A61K8/8135 ,  A61K8/8147 ,  A61K8/8152 ,  A61K8/922 ,  A61K8/987 ,  A61L15/22 ,  A61L15/44 ,  A61L15/46 ,  A61L2300/404 ,  A61L2300/41 ,  A61L2400/12 ,  A61Q19/00 ,  D01D5/0038 ,  D01F1/10 ,  D01F2/24 ,  D01F4/00 ,  D01F6/14 ,  D01F6/16 ,  D01F9/00

摘要： A water-soluble electrospun sheet, containing a water-soluble base material made of at least one material selected from a group consisting of: high-molecular proteins and decomposition products thereof; cellulose-based polymers; plant-based polymers and decomposition products thereof; vinyl-based polymers; acrylic-based polymers; and water-soluble polysaccharides; is provided. In addition to the water-soluble base material, the sheet may further contain at least one functional component selected from among: emulsifying components; stabilizing components; antimicrobial components; humectant components; skin-whitening components; anti-ultraviolet components; astringent components; keratin-softening components; anti-inflammatory components; and coloring components.

摘要翻译： 一种水溶性电纺片，其含有由选自以下的至少一种材料制成的水溶性基材：高分​​子蛋白及其分解产物; 纤维素类聚合物; 植物基聚合物及其分解产物; 乙烯基类聚合物; 丙烯酸类聚合物; 和水溶性多糖; 被提供。 除了水溶性基材之外，片材还可以含有至少一种选自以下的功能成分：乳化成分; 稳定组件; 抗菌成分; 保湿组分; 皮肤美白组分; 抗紫外线成分; 收敛成分; 角蛋白软化成分; 抗炎成分; 和着色成分。

公开(公告)号：US09085259B2

公开(公告)日：2015-07-21

申请号：US13566496

申请日：2012-08-03

申请人： Noriyuki Ogita ,  Kazunari Sakurai ,  Ryou Maeda ,  Kazuki Kobayashi ,  Koshu Yamashita ,  Akihiko Go ,  Toshihiko Nishio ,  Yoshio Masuda

发明人： Noriyuki Ogita ,  Kazunari Sakurai ,  Ryou Maeda ,  Kazuki Kobayashi ,  Koshu Yamashita ,  Akihiko Go ,  Toshihiko Nishio ,  Yoshio Masuda

IPC分类号： B60P1/00 ,  B60P1/64

CPC分类号： B60P1/6472

摘要： There is provided a vehicle which can stably load or unload a long heavy load and lower a height of a working space necessary for loading or unloading the weight body. The loading/unloading apparatus suspends and maintains a load in a working beam installed between a pair of booms and rotates the pair of booms toward the left or right direction of a vehicle body, such that the load is unloaded from the vehicle body in a construction field or loaded from the construction field onto the vehicle body. Thus, the height of the working space necessary when the load is loaded or unloaded can be reduced as compared with a crane structure for loading and unloading the load by the fluctuation of a boom.

摘要翻译： 提供一种可以稳定地加载或卸载长重载荷并降低加载或卸载重量体所需的工作空间的高度的车辆。 装载/卸载装置在安装在一对起重臂之间的工作梁中悬挂并保持负载，并且使一对起重臂朝向车体的左右方向旋转，使得负载在车体中以构造 或从建筑领域装载到车身上。 因此，与用于通过起重臂的波动装载和卸载负载的起重机结构相比，可以减小负载被加载或卸载时所需的工作空间的高度。

公开(公告)号：US09126523B2

公开(公告)日：2015-09-08

申请号：US13566317

申请日：2012-08-03

申请人： Noriyuki Ogita ,  Kazunari Sakurai ,  Ryou Maeda ,  Kazuki Kobayashi ,  Koshu Yamashita ,  Akihiko Go ,  Toshihiko Nishio ,  Yoshio Masuda

发明人： Noriyuki Ogita ,  Kazunari Sakurai ,  Ryou Maeda ,  Kazuki Kobayashi ,  Koshu Yamashita ,  Akihiko Go ,  Toshihiko Nishio ,  Yoshio Masuda

IPC分类号： B60P1/54 ,  B60P1/64 ,  B66D3/08

CPC分类号： B60P1/6472 ,  B60P1/5428 ,  B66D3/08

摘要： Provided is a vehicle that elevates a working beam installed between a pair of booms with a working beam elevating unit and can ensure the area of a load receiving surface where a load is loaded. The working beam elevating unit is received in a working beam and one end of a chain is fixed to a boom. Therefore, the working beam is moved up/down by loosening and retracting the chain. Therefore, as the working beam elevating unit is installed at the working beam, it is not necessary to ensure a space for installing the working beam on a vehicle body. Therefore, it is correspondingly possible to enlarge the space (area of the load receiving surface) on the vehicle for loading a load.

摘要翻译： 提供一种车辆，其将安装在一对起重臂与作业梁提升单元之间的作业梁提升，并且可以确保负载接收表面的负载的面积。 工作梁提升单元被接收在工作梁中，链的一端固定在吊杆上。 因此，通过松开和缩回链条，工作梁上/下移动。 因此，由于工作梁提升单元安装在工作梁上，因此不需要确保用于将工作梁安装在车体上的空间。 因此，可以相应地扩大用于装载负载的车辆上的空间（承载面的面积）。

公开(公告)号：US20080150135A1

公开(公告)日：2008-06-26

申请号：US11850767

申请日：2007-09-06

申请人： Yukifumi Oyama ,  Hidetoshi Nishiwaki ,  Toshihiko Nishio ,  Kazushige Toriyama ,  Yasumitsu Orii

发明人： Yukifumi Oyama ,  Hidetoshi Nishiwaki ,  Toshihiko Nishio ,  Kazushige Toriyama ,  Yasumitsu Orii

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L24/13 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/4985 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/7515 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/3478 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/049 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for mounting a semiconductor part on a circuit substrate is provided, which includes preparing the semiconductor part having a surface thereof provided with a plurality of stud-bumps, preparing a solder substrate having a surface thereof on which solid-solders corresponding to respective ones of the plurality of stud-bumps are arranged, preparing the circuit substrate having a surface thereof provided with connecting pads corresponding to respective ones of the plurality of stud-bumps, attaching the corresponding solid-solders on the solder substrate to respective tip ends of the plurality of stud bumps, separating the solid-solders attached to the tip ends of the stud-bumps from the solder substrate, contacting the solid-solder attached to respective ones of the tip ends of the stud-bumps with the corresponding connecting pads, and heating the solid-solders contacted with the corresponding connecting pads thereby establishing solder connection between respective ones of the stud-bumps and the corresponding connecting pads.

摘要翻译： 提供了一种在电路基板上安装半导体部件的方法，其包括制备其表面设置有多个凸起凸块的半导体部件，制备其表面上的固体焊料对应于其的表面的焊料基板 布置多个柱状突起的准备电路基板，其表面设置有与多个突起凸块中的各个凸起对应的连接焊盘，将相应的固体焊料附着在焊料基板上， 多个柱形凸块，将附接到凸起凸点的末端的固体焊料与焊料基板分离，使与柱连接凸块的相应顶端的固体焊料与相应的连接焊盘接触，以及 加热与相应的连接焊盘接触的固体焊料，从而在各自的焊料之间建立焊接连接 凹凸和相应的连接垫。

公开(公告)号：US06282089B1

公开(公告)日：2001-08-28

申请号：US09504944

申请日：2000-02-16

申请人： Tohru Nakanishi ,  Toshihiko Nishio

发明人： Tohru Nakanishi ,  Toshihiko Nishio

IPC分类号： H05K500

CPC分类号： G06F1/203 ,  G06F1/163 ,  G06F1/1632

摘要： A method (and structure) for cooling a portable computer includes attaching a portable computer to a holder, transferring heat of a heat-generating component disposed within the portable computer to the holder, and releasing the transferred heat to the atmosphere. The portable computer includes a fixture for detachably fixing the portable computer to the holder, a heat release device for releasing heat of a heat-generating component disposed within the portable computer to the outside, and a supporter which supports the fixture and the heat release device.

摘要翻译： 用于冷却便携式计算机的方法（和结构）包括将便携式计算机附接到保持器，将设置在便携式计算机内的发热部件的热量传递到保持器，并将传递的热量释放到大气中。 便携式计算机包括用于将便携式计算机可拆卸地固定到保持器的固定装置，用于将布置在便携式计算机内的发热部件的热量释放到外部的放热装置，以及支撑固定装置和放热装置 。

公开(公告)号：US07682936B2

公开(公告)日：2010-03-23

申请号：US11856769

申请日：2007-09-18

申请人： Toshihiko Nishio ,  Yasumitsu Orii ,  Yukifumi Oyama

发明人： Toshihiko Nishio ,  Yasumitsu Orii ,  Yukifumi Oyama

IPC分类号： H01L21/30

CPC分类号： H01L21/6835 ,  H01L24/16 ,  H01L24/48 ,  H01L25/16 ,  H01L2221/68359 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01065 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： It is an object to reduce a thickness of a semiconductor component (chip) on a substrate to a predetermined thickness regardless of a variation in thickness of a substrate in a semiconductor product. In a semiconductor product mounted on a base plate, a surface of a semiconductor component on a substrate is set to be located at a predetermined height h from a surface of a base plate. Thereafter, through machining the surface of the semiconductor component which is adjusted to be located at the predetermined height, it is possible to make the thickness of the semiconductor component on the substrate equal to a predetermined thickness.

摘要翻译： 不管半导体产品中的基板的厚度的变化如何，将基板上的半导体部件（芯片）的厚度减小到规定的厚度。 在安装在基板上的半导体产品中，将基板上的半导体部件的表面设定为与基板的表面相隔规定的高度h。 此后，通过加工调整为位于预定高度的半导体部件的表面，可以使衬底上的半导体部件的厚度等于预定厚度。

公开(公告)号：US20080067653A1

公开(公告)日：2008-03-20

申请号：US11856769

申请日：2007-09-18

申请人： Toshihiko Nishio ,  Yasumitsu Orii ,  Yukifumi Oyama

发明人： Toshihiko Nishio ,  Yasumitsu Orii ,  Yukifumi Oyama

IPC分类号： H01L21/30 ,  H01L23/02

CPC分类号： H01L21/6835 ,  H01L24/16 ,  H01L24/48 ,  H01L25/16 ,  H01L2221/68359 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01065 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： It is an object to reduce a thickness of a semiconductor component (chip) on a substrate to a predetermined thickness regardless of a variation in thickness of a substrate in a semiconductor product. In a semiconductor product mounted on a base plate, a surface of a semiconductor component on a substrate is set to be located at a predetermined height h from a surface of a base plate. Thereafter, through machining the surface of the semiconductor component which is adjusted to be located at the predetermined height, it is possible to make the thickness of the semiconductor component on the substrate equal to a predetermined thickness.

摘要翻译： 不管半导体产品中的基板的厚度的变化如何，将基板上的半导体部件（芯片）的厚度减小到规定的厚度。 在安装在基板上的半导体产品中，将基板上的半导体部件的表面设定为与基板的表面相隔规定的高度h。 此后，通过加工调整为位于预定高度的半导体部件的表面，可以使衬底上的半导体部件的厚度等于预定厚度。

公开(公告)号：US07080343B2

公开(公告)日：2006-07-18

申请号：US10431725

申请日：2003-05-08

申请人： Junko Asai ,  Toshio Mukai ,  Toshihiko Nishio

发明人： Junko Asai ,  Toshio Mukai ,  Toshihiko Nishio

IPC分类号： G06F17/50 ,  H01L27/10

CPC分类号： G06F17/50 ,  G06F2217/78 ,  H05K3/0005

摘要： An apparatus and method for selecting an optimum printed circuit board in terms of its intended use before placement of components on the printed circuit board, information about components to be mounted on the printed circuit board, and an outer size of the printed circuit board is provided. The apparatus includes an input section for inputting information, a storing section for storing information, an arithmetic section for performing an arithmetic calculation using the information stored in the storing section, a display section, and a control section. By deriving an index in the arithmetic section, selection of the optimum printed circuit board can be accomplished.

公开(公告)号：US07674651B2

公开(公告)日：2010-03-09

申请号：US11850767

申请日：2007-09-06

申请人： Yukifumi Oyama ,  Hidetoshi Nishiwaki ,  Toshihiko Nishio ,  Kazushige Toriyama ,  Yasumitsu Orii

发明人： Yukifumi Oyama ,  Hidetoshi Nishiwaki ,  Toshihiko Nishio ,  Kazushige Toriyama ,  Yasumitsu Orii

IPC分类号： H01L21/06 ,  B23K31/02

CPC分类号： H01L24/13 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/4985 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/7515 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/3478 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/049 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for mounting a semiconductor part on a circuit substrate is provided, which includes preparing the semiconductor part having a surface thereof provided with a plurality of stud-bumps, preparing a solder substrate having a surface thereof on which solid-solders corresponding to respective ones of the plurality of stud-bumps are arranged, preparing the circuit substrate having a surface thereof provided with connecting pads corresponding to respective ones of the plurality of stud-bumps, attaching the corresponding solid-solders on the solder substrate to respective tip ends of the plurality of stud bumps, separating the solid-solders attached to the tip ends of the stud-bumps from the solder substrate, contacting the solid-solder attached to respective ones of the tip ends of the stud-bumps with the corresponding connecting pads, and heating the solid-solders contacted with the corresponding connecting pads thereby establishing solder connection between respective ones of the stud-bumps and the corresponding connecting pads.

摘要翻译： 提供了一种在电路基板上安装半导体部件的方法，其包括制备其表面设置有多个凸起凸块的半导体部件，制备其表面上的固体焊料对应于其的表面的焊料基板 布置多个柱状突起的准备电路基板，其表面设置有与多个突起凸块中的各个凸起对应的连接焊盘，将相应的固体焊料附着在焊料基板上， 多个柱形凸块，将附接到凸起凸点的末端的固体焊料与焊料基板分离，使与柱连接凸块的相应顶端的固体焊料与相应的连接焊盘接触，以及 加热与相应的连接焊盘接触的固体焊料，从而在各自的焊料之间建立焊接连接 凹凸和相应的连接垫。

公开(公告)号：US06643839B1

公开(公告)日：2003-11-04

申请号：US09605616

申请日：2000-06-28

申请人： Toshihiko Nishio ,  Shinji Nakamura

发明人： Toshihiko Nishio ,  Shinji Nakamura

IPC分类号： G06F1750

CPC分类号： G06F17/5068

摘要： An apparatus for designing a printed wiring board comprises an input section for receiving information necessary to design the board, information on components to be mounted on the board, and information on connection between the components; a storage section for storing the information such as the board information, the component information, the connection information, and the information obtained form printed wiring boards designed in the past; a display section for displaying the input information and various information on designing; and a calculation/control section for performing predetermined calculations by the use of various information stored in the storage section and controlling the input section, the display section, and the storage section, wherein the ratio of a total wirable length to a total wiring length necessary to connect components is determined on the basis of various information stored in the section 38, and a PWB grade of the board is selected based on this ratio. A method of performing these calculations to obtain such results is also provided.

摘要翻译： 一种用于设计印刷线路板的装置，包括用于接收设计电路板所需的信息的输入部分，关于要安装在电路板上的组件的信息以及关于组件之间的连接的信息; 存储部件，用于存储过去设计的诸如板信息，组件信息，连接信息和从印刷线路板获得的信息的信息; 用于显示输入信息和关于设计的各种信息的显示部分; 以及计算/控制部分，用于通过使用存储在存储部分中的各种信息来执行预定的计算，并控制输入部分，显示部分和存储部分，其中总的可吸引长度与总布线长度的比例是必需的 基于存储在部分38中的各种信息确定连接部件，并且基于该比率来选择板的PWB等级。 还提供了执行这些计算以获得这样的结果的方法。