摘要:
A controlled plasma deposition system and method are provided including a vacuum vessel. An electron adding mass spectrometer is connected to a vacuum vessel for carrying out a gas treatment for a semi-conductor wafer. In the mass spectrometer, a gas in the vacuum vessel is incorporated, and electrons are added to the particles in the gas. Then the value of negative ions obtained by ionizing the particles, for example specific radicals, is measured. Once measured, the information is forwarded to a controller that may optimize the plasma deposition method.
摘要:
An electron density at an ECR point, which is spaced from a substrate to be treated and which faces the substrate, is set to be higher than or equal to 0.46 nc (nc: an upper limit side cut-off density of an X wave) and lower than nc. Thus, a high chevron distribution of electron density is formed in end portions of a magnetic field forming region, and a distribution of electron density having a lower peak value than those in the end portions is formed in a central portion of the magnetic field forming region. In this case, the periphery of a magnetic field crosses the inner wall of a vacuum chamber once between the ECR point and the substrate, and a space of one fourth or more of the wavelength of the X wave is formed between the periphery of the magnetic field and the inner wall of the vacuum chamber as the magnetic field runs downstream. Thus, it is possible to achieve an inplane uniform treatment when carrying out a treatment, such as a thin film deposition or etching, with ECR plasmas for a wafer.
摘要:
A probe (6) is brought into contact with a plasma produced by ionizing Ar gas, a saturation current (Ies2) at which current flowing through the probe is saturated when the potential of the probe is changed in a potential region where the potential of the probe is higher than a ground potential, and a saturation current (Iis2) at which current flowing through the probe is saturated when the potential of the probe is changed in a potential region where the potential of the probe is lower than the ground potential. Similarly, saturation currents (Ies2, Iis2) are measured by bringing the probe (6) into contact with a plasma produced by ionizing a mixed gas containing Ar gas and a process gas, such as C4F8 gas, and changing the potential of the probe (6). The negative ion density of the plasma produced by ionizing C4F8 gas is determined by using saturation current ratios (Iis1/Iis2, Ies1/Ies2).
摘要:
The present invention aims to decrease reflected waves in a vacuum chamber to suppress standing waves, thereby easily controlling a plasma density so that uniform treatment can be performed. An electromagnetic wave absorber 6 composed of a resistor such as carbon, a dielectric having a large dielectric loss, such as water, or a magnetic material such as ferrite-based ceramic, or a combination of these, is provided on an inner wall surface of a first vacuum chamber 21. Microwaves introduced from a waveguide 25 into the first vacuum chamber 21 via a transmissive window 23 are absorbed to the electromagnetic wave absorber 6 to suppress reflected waves, whereby a plasma density distribution with a nearly planned pattern is easily formed at an ECR point.
摘要:
A first high frequency processing unit detects a first broadcasting wave transmitted using a first frequency band, and extracts a first high frequency signal. Further, a second high frequency processing unit detects a second broadcasting wave transmitted using a second frequency band different from the first frequency band, and extracts a second high frequency signal. Furthermore, at least one local oscillator generates a local oscillation signal used in the first high frequency processing unit and the second high frequency processing unit.
摘要:
An object is to provide a vacuum processing apparatus that is capable of suppressing the costs and making control easy. Provided is a vacuum processing apparatus that includes a vacuum section (2) of which inside is held in vacuum, a placing section (3) that is disposed inside the vacuum section (2) and is capable of placing a workpiece thereon, a linear motor 4) that includes coils (415) and makes the placing section (3) travel within the vacuum section, wherein air is placed inside the placing section (3) while being isolated from the vacuum section (2), and the coils (415) of the linear motor (4) are disposed inside the placing section (3).
摘要:
The present invention provides a receiver that includes a plurality of tuners for receiving broadcasts such as satellite broadcast. A tuner circuit (1) includes an input terminal (11) for inputting a broadcast wave in which a video signal and/or an audio signal are modulated in a predetermined format, and a mount layer (13) on which a main circuit (12) for selecting, from the broadcast wave, a video signal and/or an audio signal included in a predetermined frequency band is mounted. In the tuner circuit (1), a first ground layer (15) is disposed, through a first dielectric layer (14), on the surface opposite to that on which the main circuit (12) of the mount layer (13) is arranged, and a second ground layer (17) is disposed through a second dielectric layer, thereby suppressing mutual interference between tuners.
摘要:
The present invention provides a receiver that includes a plurality of tuners for receiving broadcasts such as satellite broadcast. A tuner circuit (1) includes an input terminal (11) for inputting a broadcast wave in which a video signal and/or an audio signal are modulated in a predetermined format, and a mount layer (13) on which a main circuit (12) for selecting, from the broadcast wave, a video signal and/or an audio signal included in a predetermined frequency band is mounted. In the tuner circuit (1), a first ground layer (15) is disposed, through a first dielectric layer (14), on the surface opposite to that on which the main circuit (12) of the mount layer (13) is arranged, and a second ground layer (17) is disposed through a second dielectric layer, thereby suppressing mutual interference between tuners.
摘要:
A plasma process system for producing gas plasma in an air-tight chamber by high frequency power to process a substrate with the gas plasma comprising a lower electrode on which the substrate to be plasma-processed is mounted, an upper electrode arranged above the lower electrode, a plasma generator circuit for generating plasma between the upper and the lower electrode, a power source for supplying high frequency power to the plasma generator circuit, and bias generator for generating negative voltage in the upper or lower electrode when high frequency power is supplied from the power source to the upper or lower electrode, wherein the plasma generator circuit includes transformer for supplying a part of high frequency power, which is supplied from the power source, to the bias generator.
摘要:
In a plasma processing apparatus, a temperature control of a substrate to be processed is improved. A ceramic made support member having a substantially cylindrical shape is provided in a process chamber. An upper end of the support member is airtightly connected to a back surface of a placement table by solid state bonding. A lower end of the support member is airtightly connected to a bottom of the process chamber via a lower cooling jacket and O-rings. A cooling jacket made of a disc-like aluminum block is provided in an atmosphere chamber formed inside the support member. The cooling jacket is mounted to the back surface of the placement table via a heat conductive sheet member.