公开(公告)号：US07936567B2

公开(公告)日：2011-05-03

申请号：US12107971

申请日：2008-04-23

申请人： Tsuneaki Takashima ,  Jun Otsuka ,  Makoto Origuchi ,  Yukinobu Nagao ,  Chy Narith ,  Kozo Yamasaki

发明人： Tsuneaki Takashima ,  Jun Otsuka ,  Makoto Origuchi ,  Yukinobu Nagao ,  Chy Narith ,  Kozo Yamasaki

IPC分类号： H05K1/18

CPC分类号： H05K1/0231 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15311 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for manufacturing a wiring board with built-in component. The method provides a secure connection between a component and interlayer insulating layers so that the wiring board with built-in component has excellent reliability. The wiring board is manufactured through a core board preparation step, a component preparation step, an accommodation step and a height alignment step. In the core board preparation step, a core board having an accommodation hole therein is prepared. In the component preparation step, a ceramic capacitor having therein a plurality of protruding conductors which protrudes from a capacitor rear surface is prepared. In the accommodation step, the ceramic capacitor is accommodated in the accommodation hole with the core rear surface facing the same side as the capacitor rear surface. In the height alignment step, a surface of a top portion of the protruding conductor and a surface of a conductor layer formed on the core rear surface are aligned to the same height.

摘要翻译： 一种内置元件制造布线板的方法。 该方法提供了组件和层间绝缘层之间的安全连接，使得具有内置部件的接线板具有优异的可靠性。 通过芯板制备步骤，组分制备步骤，调节步骤和高度对准步骤制造布线板。 在芯板制备步骤中，制备其中具有容纳孔的芯板。 在部件准备步骤中，制备了具有从电容器后表面突出的多个突出导体的陶瓷电容器。 在接合步骤中，陶瓷电容器容纳在容纳孔中，其中芯后表面与电容器后表面相同。 在高度对准步骤中，突出导体的顶部的表面和形成在芯部后表面上的导体层的表面被排列成相同的高度。

公开(公告)号：US20080277150A1

公开(公告)日：2008-11-13

申请号：US12107971

申请日：2008-04-23

申请人： Tsuneaki Takashima ,  Jun Otsuka ,  Makoto Origuchi ,  Yukinobu Nagao ,  Chy Narith ,  Kozo Yamasaki

发明人： Tsuneaki Takashima ,  Jun Otsuka ,  Makoto Origuchi ,  Yukinobu Nagao ,  Chy Narith ,  Kozo Yamasaki

IPC分类号： H05K1/16 ,  H05K3/30

CPC分类号： H05K1/0231 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15311 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for manufacturing a wiring board with built-in component. The method provides a secure connection between a component and interlayer insulating layers so that the wiring board with built-in component has excellent reliability. The wiring board is manufactured through a core board preparation step, a component preparation step, an accommodation step and a height alignment step. In the core board preparation step, a core board having an accommodation hole therein is prepared. In the component preparation step, a ceramic capacitor having therein a plurality of protruding conductors which protrudes from a capacitor rear surface is prepared. In the accommodation step, the ceramic capacitor is accommodated in the accommodation hole with the core rear surface facing the same side as the capacitor rear surface. In the height alignment step, a surface of a top portion of the protruding conductor and a surface of a conductor layer formed on the core rear surface are aligned to the same height.

摘要翻译： 一种内置元件制造布线板的方法。 该方法提供了组件和层间绝缘层之间的安全连接，使得具有内置部件的接线板具有优异的可靠性。 通过芯板制备步骤，组分制备步骤，调节步骤和高度对准步骤制造布线板。 在芯板制备步骤中，制备其中具有容纳孔的芯板。 在部件准备步骤中，制备了具有从电容器后表面突出的多个突出导体的陶瓷电容器。 在接合步骤中，陶瓷电容器容纳在容纳孔中，其中芯后表面与电容器后表面相同。 在高度对准步骤中，突出导体的顶部的表面和形成在芯部后表面上的导体层的表面被排列成相同的高度。

公开(公告)号：US08130507B2

公开(公告)日：2012-03-06

申请号：US12409143

申请日：2009-03-23

申请人： Makoto Origuchi ,  Tsuneaki Takashima

发明人： Makoto Origuchi ,  Tsuneaki Takashima

IPC分类号： H05K7/00

CPC分类号： H05K1/185 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/162 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

摘要： A component built-in wiring board is provided. The component built-in wiring board 10 includes a core substrate 11, a first component 61, a first built-up layer 31 and a capacitor 101. The core substrate 11 has a housing hole 90 and the first component 61 is housed in the housing hole 90. A component mounting region 20 capable of mounting a second component 21 is provided in a surface 39 of the first built-up layer 31. The capacitor 101 has electrode layers 102 and 103 and a dielectric layer 104. The capacitor 101 is embedded in the first built-up layer 31 such that a first front surface 105 and a second front surface 106 in the electrode layer 102 and a first front surface 107 and a second front surface 108 in the electrode layer 103 are disposed in parallel with the surface 39 of the first built-up layer 31.

摘要翻译： 提供组件内置接线板。 部件内置布线板10包括芯基板11，第一部件61，第一累积层31和电容器101.芯基板11具有容纳孔90，第一部件61容纳在壳体 在第一累积层31的表面39中设置能够安装第二部件21的部件安装区域20.电容器101具有电极层102和103以及电介质层104.电容器101被嵌入 在第一堆叠层31中使得电极层102中的第一前表面105和第二前表面106以及电极层103中的第一前表面107和第二前表面108平行于该表面 39是第一组合层31。

公开(公告)号：US20090237900A1

公开(公告)日：2009-09-24

申请号：US12409143

申请日：2009-03-23

申请人： Makoto ORIGUCHI ,  Tsuneaki Takashima

发明人： Makoto ORIGUCHI ,  Tsuneaki Takashima

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/162 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

摘要： A component built-in wiring board is provided. The component built-in wiring board 10 includes a core substrate 11, a first component 61, a first built-up layer 31 and a capacitor 101. The core substrate 11 has a housing hole 90 and the first component 61 is housed in the housing hole 90. A component mounting region 20 capable of mounting a second component 21 is provided in a surface 39 of the first built-up layer 31. The capacitor 101 has electrode layers 102 and 103 and a dielectric layer 104. The capacitor 101 is embedded in the first built-up layer 31 such that a first front surface 105 and a second front surface 106 in the electrode layer 102 and a first front surface 107 and a second front surface 108 in the electrode layer 103 are disposed in parallel with the surface 39 of the first built-up layer 31.

摘要翻译： 提供组件内置接线板。 部件内置布线板10包括芯基板11，第一部件61，第一累积层31和电容器101.芯基板11具有容纳孔90，第一部件61容纳在壳体 在第一累积层31的表面39中设置能够安装第二部件21的部件安装区域20.电容器101具有电极层102和103以及电介质层104.电容器101被嵌入 在第一堆叠层31中使得电极层102中的第一前表面105和第二前表面106以及电极层103中的第一前表面107和第二前表面108平行于该表面 39是第一组合层31。

公开(公告)号：US06506481B2

公开(公告)日：2003-01-14

申请号：US09769751

申请日：2001-01-26

申请人： Yusuke Makino ,  Tsuneaki Takashima

发明人： Yusuke Makino ,  Tsuneaki Takashima

IPC分类号： B32B300

CPC分类号： H01H33/66207 ,  B32B2311/12 ,  B32B2311/22 ,  B32B2311/30 ,  C04B37/006 ,  C04B37/026 ,  C04B41/009 ,  C04B41/5133 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C04B2235/3418 ,  C04B2235/6582 ,  C04B2235/72 ,  C04B2235/76 ,  C04B2235/96 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/403 ,  C04B2237/404 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/407 ,  H01H33/66261 ,  H01H2033/66215 ,  H01H2033/66276 ,  Y10T428/24926 ,  C04B41/4539 ,  C04B41/5144 ,  C04B41/515 ,  C04B41/4564 ,  C04B41/5127 ,  C04B35/10

摘要： A ceramic member for bonding comprises: a ceramic base which is a sintered ceramic; and a metallic layer formed on the ceramic base by metallization, wherein the metallic layer comprises 70 to 85% by weight of at least one of tungsten and molybdenum and 0.5 to 8.5% by weight of nickel.

摘要翻译： 用于粘合的陶瓷构件包括：作为烧结陶瓷的陶瓷基体; 以及通过金属化形成在所述陶瓷基体上的金属层，其中所述金属层包含70〜85重量％的钨和钼中的至少一种以及0.5〜8.5重量％的镍。