公开(公告)号：US07936567B2

公开(公告)日：2011-05-03

申请号：US12107971

申请日：2008-04-23

申请人： Tsuneaki Takashima ,  Jun Otsuka ,  Makoto Origuchi ,  Yukinobu Nagao ,  Chy Narith ,  Kozo Yamasaki

发明人： Tsuneaki Takashima ,  Jun Otsuka ,  Makoto Origuchi ,  Yukinobu Nagao ,  Chy Narith ,  Kozo Yamasaki

IPC分类号： H05K1/18

CPC分类号： H05K1/0231 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15311 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for manufacturing a wiring board with built-in component. The method provides a secure connection between a component and interlayer insulating layers so that the wiring board with built-in component has excellent reliability. The wiring board is manufactured through a core board preparation step, a component preparation step, an accommodation step and a height alignment step. In the core board preparation step, a core board having an accommodation hole therein is prepared. In the component preparation step, a ceramic capacitor having therein a plurality of protruding conductors which protrudes from a capacitor rear surface is prepared. In the accommodation step, the ceramic capacitor is accommodated in the accommodation hole with the core rear surface facing the same side as the capacitor rear surface. In the height alignment step, a surface of a top portion of the protruding conductor and a surface of a conductor layer formed on the core rear surface are aligned to the same height.

摘要翻译： 一种内置元件制造布线板的方法。 该方法提供了组件和层间绝缘层之间的安全连接，使得具有内置部件的接线板具有优异的可靠性。 通过芯板制备步骤，组分制备步骤，调节步骤和高度对准步骤制造布线板。 在芯板制备步骤中，制备其中具有容纳孔的芯板。 在部件准备步骤中，制备了具有从电容器后表面突出的多个突出导体的陶瓷电容器。 在接合步骤中，陶瓷电容器容纳在容纳孔中，其中芯后表面与电容器后表面相同。 在高度对准步骤中，突出导体的顶部的表面和形成在芯部后表面上的导体层的表面被排列成相同的高度。

公开(公告)号：US20080277150A1

公开(公告)日：2008-11-13

申请号：US12107971

申请日：2008-04-23

申请人： Tsuneaki Takashima ,  Jun Otsuka ,  Makoto Origuchi ,  Yukinobu Nagao ,  Chy Narith ,  Kozo Yamasaki

发明人： Tsuneaki Takashima ,  Jun Otsuka ,  Makoto Origuchi ,  Yukinobu Nagao ,  Chy Narith ,  Kozo Yamasaki

IPC分类号： H05K1/16 ,  H05K3/30

CPC分类号： H05K1/0231 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15311 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for manufacturing a wiring board with built-in component. The method provides a secure connection between a component and interlayer insulating layers so that the wiring board with built-in component has excellent reliability. The wiring board is manufactured through a core board preparation step, a component preparation step, an accommodation step and a height alignment step. In the core board preparation step, a core board having an accommodation hole therein is prepared. In the component preparation step, a ceramic capacitor having therein a plurality of protruding conductors which protrudes from a capacitor rear surface is prepared. In the accommodation step, the ceramic capacitor is accommodated in the accommodation hole with the core rear surface facing the same side as the capacitor rear surface. In the height alignment step, a surface of a top portion of the protruding conductor and a surface of a conductor layer formed on the core rear surface are aligned to the same height.

摘要翻译： 一种内置元件制造布线板的方法。 该方法提供了组件和层间绝缘层之间的安全连接，使得具有内置部件的接线板具有优异的可靠性。 通过芯板制备步骤，组分制备步骤，调节步骤和高度对准步骤制造布线板。 在芯板制备步骤中，制备其中具有容纳孔的芯板。 在部件准备步骤中，制备了具有从电容器后表面突出的多个突出导体的陶瓷电容器。 在接合步骤中，陶瓷电容器容纳在容纳孔中，其中芯后表面与电容器后表面相同。 在高度对准步骤中，突出导体的顶部的表面和形成在芯部后表面上的导体层的表面被排列成相同的高度。

公开(公告)号：US06224703B1

公开(公告)日：2001-05-01

申请号：US09226119

申请日：1999-01-07

申请人： Kozo Yamasaki ,  Hideshi Matsubara ,  Kazuo Kimura ,  Motohiko Itai

发明人： Kozo Yamasaki ,  Hideshi Matsubara ,  Kazuo Kimura ,  Motohiko Itai

IPC分类号： B32B3112

CPC分类号： H05K1/113 ,  H01L21/4853 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1358 ,  H01L2924/00014 ,  H01L2924/15174 ,  H05K1/0306 ,  H05K3/246 ,  H05K3/3436 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2203/0156 ,  H05K2203/0191 ,  H01L2224/05599

摘要： A method of making a laminate ceramic substrate with domed pads is provided. In the method, a ceramic green sheet is prepared which has a pair of first and second opposite main surfaces and a plurality of through holes extending between the first and second main surfaces. The ceramic green sheet is placed upon a flat elastic sheet in such a manner that the first main surface of the ceramic green sheet is in contact with the flat elastic sheet. Metallizing ink is filled into the through hole so that a portion of the ink protrudes beyond the first main surface to form domed protruded portions by elastic deformation of the elastic sheet. The green sheet (optionally placed upon at least one other green sheet in such a manner that the second main surface is in contact with the other green sheet) is then sintered, thereby forming the domed, protruded portions of the metallizing ink into domed pads.

摘要翻译： 提供一种制造具有圆顶垫的层压陶瓷基板的方法。 在该方法中，制备具有一对第一和第二相对主表面的陶瓷生片和在第一和第二主表面之间延伸的多个通孔。 将陶瓷生片放置在平坦的弹性片上，使得陶瓷生片的第一主表面与平的弹性片接触。 金属化油墨被填充到通孔中，使得一部分油墨突出超过第一主表面，以通过弹性片材的弹性变形形成圆顶突出部分。 然后将生片（任选地以至少一个其他生片，以使第二主表面与另一个生片接触）的方式烧结，从而将金属化油墨的圆顶突出部分形成为圆顶形垫。

公开(公告)号：US5822851A

公开(公告)日：1998-10-20

申请号：US775305

申请日：1996-12-31

申请人： Kozo Yamasaki ,  Naomiki Kato

发明人： Kozo Yamasaki ,  Naomiki Kato

IPC分类号： H05K3/46 ,  H01L21/48 ,  H01L21/66 ,  H01L23/12 ,  H01L23/13 ,  H01L23/498 ,  H01L23/64 ,  H05K3/00 ,  H05K3/02

CPC分类号： H01L22/20 ,  H01L21/485 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85444 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49144 ,  Y10T29/49155

摘要： In a ceramic package main body having a circuit wiring provided to a ceramic substrate and including first and second independent circuit wires, first and second conductive layers are formed on the ceramic substrate. A first connection wire is provided to connect between the first circuit wire and the first conductive layer. A second connection wire is provided to connect between the second circuit wire and the second conductive layer. The first and second conductive layers are electrically insulated from each other for enabling to examine an electrical connection between the first and second conductive layers and determine, from the result of the examination, whether a short circuit is developed between the first and second circuit wires.

公开(公告)号：US20050155789A1

公开(公告)日：2005-07-21

申请号：US11078063

申请日：2005-03-11

申请人： Tomoe Suzuki ,  Shinji Yuri ,  Kazuhisa Sato ,  Kozo Yamasaki

发明人： Tomoe Suzuki ,  Shinji Yuri ,  Kazuhisa Sato ,  Kozo Yamasaki

IPC分类号： B32B15/08 ,  B32B27/38 ,  H05K1/05 ,  H05K3/00 ,  H05K3/44 ,  H05K1/03 ,  H05K1/11

CPC分类号： H05K1/056 ,  B32B15/08 ,  B32B27/38 ,  H05K3/0052 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0909 ,  H05K2201/09709 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49165 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0581 ,  Y10T428/12 ,  Y10T428/12361 ,  Y10T428/15 ,  Y10T428/24298 ,  Y10T428/24314 ,  Y10T428/24917

摘要： The invention provides a method for manufacturing printed wiring substrates which can manufacture printed wiring substrates each having resin dielectric layers of uniform thickness and excellent surface flatness while maintaining favorable cutting performance in a dicing step. A multi-printed wiring-substrate panel is manufactured which includes a metal plate having a first main surface and a second main surface, and resin dielectric layers disposed on the first and second main surfaces. The metal plate has first depression portions and second depression portions. The first depression portions are opened at the first main surface and arranged discontinuously along predetermined cutting lines. The second depression portions are opened at the second main surface and arranged discontinuously along the predetermined cutting lines. The multi-printed wiring-substrate panel is cut along the predetermined cutting lines into a plurality of printed wiring substrates.

公开(公告)号：US06872436B2

公开(公告)日：2005-03-29

申请号：US10340031

申请日：2003-01-10

申请人： Tomoe Suzuki ,  Shinji Yuri ,  Kazuhisa Sato ,  Kozo Yamasaki

发明人： Tomoe Suzuki ,  Shinji Yuri ,  Kazuhisa Sato ,  Kozo Yamasaki

IPC分类号： B32B15/08 ,  B32B27/38 ,  H05K1/05 ,  H05K3/00 ,  H05K3/44 ,  B23B3/10

CPC分类号： H05K1/056 ,  B32B15/08 ,  B32B27/38 ,  H05K3/0052 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0909 ,  H05K2201/09709 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49165 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0581 ,  Y10T428/12 ,  Y10T428/12361 ,  Y10T428/15 ,  Y10T428/24298 ,  Y10T428/24314 ,  Y10T428/24917

摘要： The invention provides a method for manufacturing printed wiring substrates which can manufacture printed wiring substrates each having resin dielectric layers of uniform thickness and excellent surface flatness while maintaining favorable cutting performance in a dicing step. A multi-printed wiring-substrate panel is manufactured which includes a metal plate having a first main surface and a second main surface, and resin dielectric layers disposed on the first and second main surfaces. The metal plate has first depression portions and second depression portions. The first depression portions are opened at the first main surface and arranged discontinuously along predetermined cutting lines. The second depression portions are opened at the second main surface and arranged discontinuously along the predetermined cutting lines. The multi-printed wiring-substrate panel is cut along the predetermined cutting lines into a plurality of printed wiring substrates.

公开(公告)号：US6139904A

公开(公告)日：2000-10-31

申请号：US422119

申请日：1999-10-20

申请人： Kozo Yamasaki ,  Osamu Hisada ,  Katsuhiko Hasegawa ,  Naoki Kito ,  Satoshi Hirano ,  Yutaro Kameyama

发明人： Kozo Yamasaki ,  Osamu Hisada ,  Katsuhiko Hasegawa ,  Naoki Kito ,  Satoshi Hirano ,  Yutaro Kameyama

IPC分类号： H05K3/00 ,  H05K3/12 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B05D5/12

CPC分类号： H05K3/4069 ,  H05K3/0094 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/09909 ,  H05K2203/0191 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K3/1216 ,  H05K3/1225 ,  H05K3/429

摘要： A method of making a printed board is provided. The printed board has a base provided with a plurality of through via conductors having through holes extending completely between upper and lower surfaces of the base and closed by resin fillings and a plurality of blind via conductors having depressions closed by resin fillings. The method comprises the steps of preparing the base provided with the through via conductors having the through holes and the blind via conductors having the depressions, filling the through holes of the through via conductors and the depressions of the blind via conductors with resin paste by printing, while at the same time forming, on an upper surface of the base and at locations around the through holes of the through via conductors and the depressions of the blind via conductors, a plurality of projections made of the above described resin paste by printing, and curing the resin paste, thereby forming the resin fillings in the through holes of the through via conductors and the depressions of the blind via conductors. By this method, the upper surfaces of the resin fillings in the through holes and the depressions are not caused to recede or sink and become lower in level than the upper surface of the base but can be maintained higher in level than the upper surface of the base, thus making it possible to dispense with a manufacturing step for closing receding spaces and manufacture the printed board at lower cost.

摘要翻译： 提供制造印刷电路板的方法。 印刷电路板具有设置有多个通孔导体的底座，其具有完全在基底的上表面和下表面之间延伸并且被树脂填充物封闭的通孔，以及多个通过树脂填充物封闭的凹陷的盲孔通孔导体。 该方法包括以下步骤：制备具有通孔的通孔的底座和具有凹陷的盲通孔导体，通过印刷填充通孔导体的通孔和盲孔通孔的凹陷 同时在基底的上表面和贯通通孔导体的通孔周围的位置和盲通孔导体的凹陷处形成多个由上述树脂浆料制成的突起， 并固化树脂膏，从而在通孔导体的通孔和盲通孔导体的凹陷中形成树脂填充物。 通过这种方法，通孔中的树脂填充物的上表面和凹部不会比底座的上表面下降或下降而变低，而是可以保持比上表面的水平高 从而可以省略用于关闭后退空间的制造步骤，并以较低的成本制造印刷电路板。

公开(公告)号：US06976415B2

公开(公告)日：2005-12-20

申请号：US11078063

申请日：2005-03-11

申请人： Tomoe Suzuki ,  Shinji Yuri ,  Kazuhisa Sato ,  Kozo Yamasaki

发明人： Tomoe Suzuki ,  Shinji Yuri ,  Kazuhisa Sato ,  Kozo Yamasaki

IPC分类号： B32B15/08 ,  B32B27/38 ,  H05K1/05 ,  H05K3/00 ,  H05K3/44 ,  B26D3/00

CPC分类号： H05K1/056 ,  B32B15/08 ,  B32B27/38 ,  H05K3/0052 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0909 ,  H05K2201/09709 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49165 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0581 ,  Y10T428/12 ,  Y10T428/12361 ,  Y10T428/15 ,  Y10T428/24298 ,  Y10T428/24314 ,  Y10T428/24917

摘要： The invention provides a method for manufacturing printed wiring substrates which can manufacture printed wiring substrates each having resin dielectric layers of uniform thickness and excellent surface flatness while maintaining favorable cutting performance in a dicing step. A multi-printed wiring-substrate panel is manufactured which includes a metal plate having a first main surface and a second main surface, and resin dielectric layers disposed on the first and second main surfaces. The metal plate has first depression portions and second depression portions. The first depression portions are opened at the first main surface and arranged discontinuously along predetermined cutting lines. The second depression portions are opened at the second main surface and arranged discontinuously along the predetermined cutting lines. The multi-printed wiring-substrate panel is cut along the predetermined cutting lines into a plurality of printed wiring substrates.

摘要翻译： 本发明提供一种制造印刷布线基板的方法，其可以制造印刷布线基板，每个印刷布线基板具有均匀厚度的树脂电介质层和优异的表面平坦度，同时在切割步骤中保持良好的切割性能。 制造了包括具有第一主表面和第二主表面的金属板以及设置在第一和第二主表面上的树脂电介质层的多印刷布线基板。 金属板具有第一凹部和第二凹部。 第一凹陷部分在第一主表面处被打开，并且沿着预定的切割线不连续地布置。 第二凹陷部分在第二主表面处被打开，并且沿着预定切割线不连续地布置。 多个印刷线路基板被沿着预定的切割线切割成多个印刷布线基板。

公开(公告)号：USD423532S

公开(公告)日：2000-04-25

申请号：US95362

申请日：1998-10-21

申请人： Kozo Yamasaki ,  Hajime Saiki

设计人： Kozo Yamasaki ,  Hajime Saiki

公开(公告)号：US5060049A

公开(公告)日：1991-10-22

申请号：US553804

申请日：1990-07-18

申请人： Kozo Yamasaki ,  Kouichi Mouri ,  Naomiki Kato ,  Mitsuru Hirano ,  Michael A. Schmitt ,  Bidyut Bhattacharyya

发明人： Kozo Yamasaki ,  Kouichi Mouri ,  Naomiki Kato ,  Mitsuru Hirano ,  Michael A. Schmitt ,  Bidyut Bhattacharyya

IPC分类号： H05K3/46 ,  H01L23/12 ,  H01L23/15 ,  H01L23/498 ,  H01L23/64 ,  H05K1/16

CPC分类号： H01L23/15 ,  H01L23/49866 ,  H01L23/647 ,  H01L2924/0002 ,  H01L2924/3011

摘要： A ceramic multilayer wiring substrate is provided on which the metallized wirings are partially altered to provide multiple resistivities without changing the other electrical properties associated with a particular physical wiring geometry. Sequentially positioning conductive materials of different resistivities along the length of each individual wiring produces a final wiring pattern where each individual wiring can have a different resistance from the other wirings. A multiple resistivity wiring pattern can maximize the operation of a semiconductor chip attached thereto, for example, by reducing the effect of electronic noise on the semiconductor.

摘要翻译： 提供陶瓷多层布线基板，金属化布线部分地改变以提供多个电阻率，而不改变与特定物理布线几何形状相关联的其它电特性。 沿着每个单独布线的长度顺序地定位不同电阻率的导电材料产生最终布线图案，其中每个单独布线可以具有与其它布线不同的电阻。 多电阻率布线图案可以通过减少电子噪声对半导体的影响来使附着于其上的半导体芯片的操作最大化。