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公开(公告)号：US6134042A
公开(公告)日：2000-10-17
申请号：US283030
申请日：1999-04-01
CPC分类号： G02B26/0841 , B81B3/0051 , G02B26/101 , B81B2201/042 , B81B2203/058 , Y10S359/90 , Y10T428/24273 , Y10T428/24322 , Y10T428/24355 , Y10T428/24479
摘要： An electromechanical device includes a first frame having a first aperture therein, a second frame suspended in the first frame wherein the second frame has a second aperture therein, and a plate suspended in the second aperture. A first pair of beams support the second frame along a first axis relative to the first frame so that the second frame rotates about the first axis. A second pair of beams supports the plate along a second axis relative to the second frame so that the plate rotates about the second axis relative to the frame. The first and second axes preferably intersect at a 90.degree. angle. A first actuator provides mechanical force for rotating the second frame relative to the first frame about the first axis. A second actuator provides mechanical force for rotating the plate relative to the second frame about the second axis. Accordingly, the plate can be independently rotated relative to the first axis and the second axis. Related methods are also disclosed.
摘要翻译： 机电装置包括其中具有第一孔的第一框架，悬挂在第一框架中的第二框架，其中第二框架在其中具有第二孔，以及悬挂在第二孔中的板。 第一对梁相对于第一框架沿着第一轴线支撑第二框架，使得第二框架围绕第一轴线旋转。 第二对梁相对于第二框架沿着第二轴支撑板，使得板相对于框架围绕第二轴线旋转。 第一和第二轴优选地以90°角相交。 第一致动器提供用于使第二框架围绕第一轴线相对于第一框架旋转的机械力。 第二致动器提供用于相对于第二框架围绕第二轴线旋转板的机械力。 因此，板可以相对于第一轴线和第二轴线独立地旋转。 还公开了相关方法。
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2.发明授权
公开(公告)号：US5914801A
公开(公告)日：1999-06-22
申请号：US719711
申请日：1996-09-27
CPC分类号： G02B26/0841 , B81B3/0051 , G02B26/101 , B81B2201/042 , B81B2203/058 , Y10S359/90 , Y10T428/24273 , Y10T428/24322 , Y10T428/24355 , Y10T428/24479
摘要： An electromechanical device includes a first frame having a first aperture therein, a second frame suspended in the first frame wherein the second frame has a second aperture therein, and a plate suspended in the second aperture. A first pair of beams support the second frame along a first axis relative to the first frame so that the second frame rotates about the first axis. A second pair of beams supports the plate along a second axis relative to the second frame so that the plate rotates about the second axis relative to the frame. The first and second axes preferably intersect at a 90.degree. angle. A first actuator provides mechanical force for rotating the second frame relative to the first frame about the first axis. A second actuator provides mechanical force for rotating the plate relative to the second frame about the second axis. Accordingly, the plate can be independently rotated relative to the first axis and the second axis. Related methods are also disclosed.
摘要翻译： 机电装置包括其中具有第一孔的第一框架，悬挂在第一框架中的第二框架，其中第二框架在其中具有第二孔，以及悬挂在第二孔中的板。 第一对梁相对于第一框架沿着第一轴线支撑第二框架，使得第二框架围绕第一轴线旋转。 第二对梁相对于第二框架沿着第二轴支撑板，使得板相对于框架围绕第二轴线旋转。 第一和第二轴优选地以90°角相交。 第一致动器提供用于使第二框架围绕第一轴线相对于第一框架旋转的机械力。 第二致动器提供用于相对于第二框架围绕第二轴线旋转板的机械力。 因此，板可以相对于第一轴线和第二轴线独立地旋转。 还公开了相关方法。
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公开(公告)号：US06555201B1
公开(公告)日：2003-04-29
申请号：US09570628
申请日：2000-05-15
IPC分类号： B32B310
CPC分类号： G02B26/0841 , B81B3/0051 , B81B2201/042 , B81B2203/058 , G02B26/101 , Y10S359/90 , Y10T428/24273 , Y10T428/24322 , Y10T428/24355 , Y10T428/24479
摘要： An electromechanical device includes a first frame having a first aperture therein, a second frame suspended in the first frame wherein the second frame has a second aperture therein, and a plate suspended in the second aperture. A first pair of beams support the second frame along a first axis relative to the first frame so that the second frame rotates about the first axis. A second pair of beams supports the plate along a second axis relative to the second frame so that the plate rotates about the second axis relative to the frame. The first and second axes preferably intersect at a 90° angle. A first actuator provides mechanical force for rotating the second frame relative to the first frame about the first axis. A second actuator provides mechanical force for rotating the plate relative to the second frame about the second axis. Accordingly, the plate can be independently rotated relative to the first axis and the second axis. Related methods are also disclosed.
摘要翻译： 机电装置包括其中具有第一孔的第一框架，悬挂在第一框架中的第二框架，其中第二框架在其中具有第二孔，以及悬挂在第二孔中的板。 第一对梁相对于第一框架沿着第一轴线支撑第二框架，使得第二框架围绕第一轴线旋转。 第二对梁相对于第二框架沿着第二轴支撑板，使得板相对于框架围绕第二轴线旋转。 第一和第二轴优选地以90°的角度相交。 第一致动器提供用于使第二框架围绕第一轴线相对于第一框架旋转的机械力。 第二致动器提供用于相对于第二框架围绕第二轴线旋转板的机械力。 因此，板可以相对于第一轴线和第二轴线独立地旋转。 还公开了相关方法。
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4.发明授权公开(公告)号：US06256134B1
公开(公告)日：2001-07-03
申请号：US09628054
申请日：2000-07-28
IPC分类号： G02B2608
CPC分类号： G02B26/0841 , B81B3/0051 , B81B2201/042 , B81B2203/058 , G02B26/101 , Y10S359/90 , Y10T428/24273 , Y10T428/24322 , Y10T428/24355 , Y10T428/24479
摘要： An electromechanical device includes a first frame having a first aperture therein, a second frame suspended in the first frame wherein the second frame has a second aperture therein, and a plate suspended in the second aperture. A first pair of beams support the second frame along a first axis relative to the first frame so that the second frame rotates about the first axis. A second pair of beams supports the plate along a second axis relative to the second frame so that the plate rotates about the second axis relative to the frame. The first and second axes preferably intersect at a 90° angle. A first actuator provides mechanical force for rotating the second frame relative to the first frame about the first axis. A second actuator provides mechanical force for rotating the plate relative to the second frame about the second axis. Accordingly, the plate can be independently rotated relative to the first axis and the second axis. Related methods are also disclosed.
摘要翻译： 机电装置包括其中具有第一孔的第一框架，悬挂在第一框架中的第二框架，其中第二框架在其中具有第二孔，以及悬挂在第二孔中的板。 第一对梁相对于第一框架沿着第一轴线支撑第二框架，使得第二框架围绕第一轴线旋转。 第二对梁相对于第二框架沿着第二轴支撑板，使得板相对于框架围绕第二轴线旋转。 第一和第二轴优选地以90°的角度相交。 第一致动器提供用于使第二框架围绕第一轴线相对于第一框架旋转的机械力。 第二致动器提供用于相对于第二框架围绕第二轴线旋转板的机械力。 因此，板可以相对于第一轴线和第二轴线独立地旋转。 还公开了相关方法。
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5.发明授权
公开(公告)号：US6087747A
公开(公告)日：2000-07-11
申请号：US285206
申请日：1999-04-01
CPC分类号： G02B26/0841 , B81B3/0051 , G02B26/101 , B81B2201/042 , B81B2203/058 , Y10S359/90 , Y10T428/24273 , Y10T428/24322 , Y10T428/24355 , Y10T428/24479
摘要： An electromechanical device includes a first frame having a first aperture therein, a second frame suspended in the first frame wherein the second frame has a second aperture therein, and a plate suspended in the second aperture. A first pair of beams support the second frame along a first axis relative to the first frame so that the second frame rotates about the first axis. A second pair of beams supports the plate along a second axis relative to the second frame so that the plate rotates about the second axis relative to the frame. The first and second axes preferably intersect at a 90.degree. angle. A first actuator provides mechanical force for rotating the second frame relative to the first frame about the first axis. A second actuator provides mechanical force for rotating the plate relative to the second frame about the second axis. Accordingly, the plate can be independently rotated relative to the first axis and the second axis. Related methods are also disclosed.
摘要翻译： 机电装置包括其中具有第一孔的第一框架，悬挂在第一框架中的第二框架，其中第二框架在其中具有第二孔，以及悬挂在第二孔中的板。 第一对梁相对于第一框架沿着第一轴线支撑第二框架，使得第二框架围绕第一轴线旋转。 第二对梁相对于第二框架沿着第二轴支撑板，使得板相对于框架绕第二轴线旋转。 第一和第二轴优选地以90°角相交。 第一致动器提供用于使第二框架围绕第一轴线相对于第一框架旋转的机械力。 第二致动器提供用于相对于第二框架围绕第二轴线旋转板的机械力。 因此，板可以相对于第一轴线和第二轴线独立地旋转。 还公开了相关方法。
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6.发明授权Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields 有权形成具有相邻导热场的嵌入式热电冷却器的方法公开(公告)号：US08063298B2
公开(公告)日：2011-11-22
申请号：US11563443
申请日：2006-11-27
申请人： David A. Koester , Randall G. Alley
发明人： David A. Koester , Randall G. Alley
CPC分类号： H01L35/34
摘要： A method of forming a thermoelectric device may include providing a substrate having a surface, and thermally coupling a thermoelectric p-n couple to a first portion of the surface of a substrate. Moreover, the thermoelectric p-n couple may include a p-type thermoelectric element and an n-type thermoelectric element. In addition, a thermally conductive field layer may be formed on a second portion of the surface of the substrate adjacent the first portion of the surface of the substrate. Related structures are also discussed.
摘要翻译： 形成热电装置的方法可以包括提供具有表面的基板，并将热电p-n耦合热耦合到基板的表面的第一部分。 此外，热电p-n耦合可以包括p型热电元件和n型热电元件。 此外，导热场层可以形成在衬底表面的与衬底表面的第一部分相邻的第二部分上。 还讨论了相关结构。
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公开(公告)号：US07855397B2
公开(公告)日：2010-12-21
申请号：US12016720
申请日：2008-01-18
申请人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko von Windheim
发明人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko von Windheim
CPC分类号： H01L23/38 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L27/16 , H01L2224/0401 , H01L2224/05111 , H01L2224/05144 , H01L2224/05147 , H01L2224/05568 , H01L2224/05611 , H01L2224/05644 , H01L2224/06102 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2224/16235 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/0106 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/00014 , H01L2924/014 , H01L2224/13099 , H01L2924/00 , H01L2224/05552 , H01L2924/0105
摘要： An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate. Related methods and structures are also discussed.
摘要翻译： 电子组件可以包括封装衬底，集成电路（IC）半导体芯片，多个金属互连结构和热电热泵。 集成电路（IC）半导体芯片可以具有包括其上的输入/输出焊盘和与有源侧相反的背面的有源侧，并且IC半导体芯片可以布置成有效侧面向封装基板的第一表面。 多个金属互连结构可以在IC半导体芯片的有源侧和封装基板的第一表面之间，并且多个金属互连结构可以在IC半导体芯片的有源侧和第一表面之间提供机械连接 的包装基板。 热电热泵可以耦合到封装衬底，热电热泵构造成主动地泵送IC半导体芯片和封装衬底之间的热量。 还讨论了相关的方法和结构。
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8.发明授权Methods of forming thermoelectric devices including electrically insulating matrices between conductive traces 有权在导电迹线之间形成包括电绝缘矩阵的热电装置的方法公开(公告)号：US07838759B2
公开(公告)日：2010-11-23
申请号：US11472913
申请日：2006-06-22
申请人： Randall G. Alley , David A. Koester
发明人： Randall G. Alley , David A. Koester
CPC分类号： H01L35/10 , H01L35/08 , H01L35/32 , H01L35/34 , Y10T29/4913
摘要： A method of forming a thermoelectric device may include forming a pattern of conductive traces, and forming an electrically insulating matrix between the conductive traces of the pattern of conductive traces. In addition, a plurality of thermoelectric elements may be electrically and mechanically coupled to the pattern of conductive traces so that each conductive trace of the pattern of conductive traces has one of the plurality of thermoelectric elements thereon. In addition, the plurality of thermoelectric elements may be free of the electrically insulating matrix. Related methods and structures are also discussed.
摘要翻译： 形成热电装置的方法可以包括形成导电迹线图案，以及在导电迹线图案的导电迹线之间形成电绝缘矩阵。 此外，多个热电元件可以电连接和机械耦合到导电迹线图案，使得导电迹线图案的每个导电迹线都具有多个热电元件之一。 另外，多个热电元件可以没有电绝缘基体。 还讨论了相关的方法和结构。
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9.发明授权公开(公告)号：US07679203B2
公开(公告)日：2010-03-16
申请号：US11681303
申请日：2007-03-02
申请人： Jayesh Bharathan , David A. Koester , Randall G. Alley , Rama Venkatasubramanian , Pratima Addepalli , Bing Shen , Cynthia Watkins
发明人： Jayesh Bharathan , David A. Koester , Randall G. Alley , Rama Venkatasubramanian , Pratima Addepalli , Bing Shen , Cynthia Watkins
IPC分类号： H01L37/00
CPC分类号： H01L35/34 , H01L35/32 , Y10S257/93
摘要： A method of forming a thermoelectric device may include forming a plurality of islands of thermoelectric material on a deposition substrate. The plurality of islands of thermoelectric material may be bonded to a header substrate so that the plurality of islands are between the deposition substrate and the header substrate. More particularly, the islands of thermoelectric material may be epitaxial islands of thermoelectric material having crystal structures aligned with a crystal structure of the deposition substrate. Related structures are also discussed.
摘要翻译： 形成热电装置的方法可以包括在沉积基板上形成多个热电材料岛。 多个热电材料岛可以结合到集管基板，使得多个岛在沉积基板和集管基板之间。 更具体地，热电材料岛可以是具有与沉积基板的晶体结构对准的晶体结构的热电材料的外延岛。 还讨论了相关结构。
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10.发明申请Electronic Assemblies Providing Active Side Heat Pumping and Related Methods and Structures 有权提供有源侧热泵的电子组件及相关方法和结构公开(公告)号：US20090072385A1
公开(公告)日：2009-03-19
申请号：US12016720
申请日：2008-01-18
申请人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko Von Windheim
发明人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko Von Windheim
CPC分类号： H01L23/38 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L27/16 , H01L2224/0401 , H01L2224/05111 , H01L2224/05144 , H01L2224/05147 , H01L2224/05568 , H01L2224/05611 , H01L2224/05644 , H01L2224/06102 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2224/16235 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/0106 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/00014 , H01L2924/014 , H01L2224/13099 , H01L2924/00 , H01L2224/05552 , H01L2924/0105
摘要： An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate. Related methods and structures are also discussed.
摘要翻译： 电子组件可以包括封装衬底，集成电路（IC）半导体芯片，多个金属互连结构和热电热泵。 集成电路（IC）半导体芯片可以具有包括其上的输入/输出焊盘和与有源侧相反的背面的有源侧，并且IC半导体芯片可以布置成有效侧面向封装基板的第一表面。 多个金属互连结构可以在IC半导体芯片的有源侧和封装基板的第一表面之间，并且多个金属互连结构可以在IC半导体芯片的有源侧和第一表面之间提供机械连接 的包装基板。 热电热泵可以耦合到封装衬底，热电热泵构造成主动地泵送IC半导体芯片和封装衬底之间的热量。 还讨论了相关的方法和结构。
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