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公开(公告)号:US20190341344A1
公开(公告)日:2019-11-07
申请号:US16405406
申请日:2019-05-07
IPC分类号: H01L23/498 , H01L23/00 , H01L23/50 , H01L23/367 , H01L23/495 , H01L23/31 , H01L25/10 , H01L23/528 , H01L23/522 , H01L23/36 , H01L21/56
摘要: Various applications of interconnect substrates in power management systems are described.
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公开(公告)号:US10748845B2
公开(公告)日:2020-08-18
申请号:US16405406
申请日:2019-05-07
IPC分类号: H01L23/495 , H01L23/498 , H01L23/50 , H01L21/56 , H01L23/00 , H01L23/36 , H01L23/522 , H01L23/528 , H01L23/367 , H01L23/31 , H01L25/10
摘要: Various applications of interconnect substrates in power management systems are described.
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公开(公告)号:US09520342B2
公开(公告)日:2016-12-13
申请号:US14753305
申请日:2015-06-29
IPC分类号: H05K7/00 , H01L23/495 , H01L23/50 , H01L21/56 , H01L23/36 , H01L23/522 , H01L23/528 , H01L23/31 , H01L25/10 , H01L23/00 , H01L23/367 , H01L23/498
CPC分类号: H01L23/49838 , H01L21/563 , H01L23/3128 , H01L23/3185 , H01L23/36 , H01L23/3675 , H01L23/4952 , H01L23/49527 , H01L23/49568 , H01L23/49575 , H01L23/49827 , H01L23/50 , H01L23/5223 , H01L23/5286 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/83 , H01L25/105 , H01L2224/02311 , H01L2224/02313 , H01L2224/0233 , H01L2224/02331 , H01L2224/0239 , H01L2224/0345 , H01L2224/0346 , H01L2224/0347 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05166 , H01L2224/05548 , H01L2224/05647 , H01L2224/1146 , H01L2224/1147 , H01L2224/1191 , H01L2224/1302 , H01L2224/13024 , H01L2224/13026 , H01L2224/131 , H01L2224/13147 , H01L2224/14131 , H01L2224/14134 , H01L2224/14177 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32245 , H01L2224/73204 , H01L2224/81191 , H01L2224/81815 , H01L2224/8385 , H01L2224/92125 , H01L2225/1023 , H01L2225/1058 , H01L2924/1427 , H01L2924/15311 , H01L2924/15331 , H01L2924/16152 , H01L2924/16196 , H01L2924/181 , H01L2924/18161 , H01L2924/19105 , H01L2924/381 , H01L2924/01029 , H01L2924/00014 , H01L2924/01022 , H01L2924/014 , H01L2924/00
摘要: Various applications of interconnect substrates in power management systems are described.
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公开(公告)号:US20150303132A1
公开(公告)日:2015-10-22
申请号:US14753305
申请日:2015-06-29
IPC分类号: H01L23/495 , H01L23/31
CPC分类号: H01L23/49838 , H01L21/563 , H01L23/3128 , H01L23/3185 , H01L23/36 , H01L23/3675 , H01L23/4952 , H01L23/49527 , H01L23/49568 , H01L23/49575 , H01L23/49827 , H01L23/50 , H01L23/5223 , H01L23/5286 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/83 , H01L25/105 , H01L2224/02311 , H01L2224/02313 , H01L2224/0233 , H01L2224/02331 , H01L2224/0239 , H01L2224/0345 , H01L2224/0346 , H01L2224/0347 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05166 , H01L2224/05548 , H01L2224/05647 , H01L2224/1146 , H01L2224/1147 , H01L2224/1191 , H01L2224/1302 , H01L2224/13024 , H01L2224/13026 , H01L2224/131 , H01L2224/13147 , H01L2224/14131 , H01L2224/14134 , H01L2224/14177 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32245 , H01L2224/73204 , H01L2224/81191 , H01L2224/81815 , H01L2224/8385 , H01L2224/92125 , H01L2225/1023 , H01L2225/1058 , H01L2924/1427 , H01L2924/15311 , H01L2924/15331 , H01L2924/16152 , H01L2924/16196 , H01L2924/181 , H01L2924/18161 , H01L2924/19105 , H01L2924/381 , H01L2924/01029 , H01L2924/00014 , H01L2924/01022 , H01L2924/014 , H01L2924/00
摘要: Various applications of interconnect substrates in power management systems are described.
摘要翻译: 描述了电源管理系统中互连基板的各种应用。
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公开(公告)号:US20130087366A1
公开(公告)日:2013-04-11
申请号:US13644693
申请日:2012-10-04
CPC分类号: H01L23/49838 , H01L21/563 , H01L23/3128 , H01L23/3185 , H01L23/36 , H01L23/3675 , H01L23/4952 , H01L23/49527 , H01L23/49568 , H01L23/49575 , H01L23/49827 , H01L23/50 , H01L23/5223 , H01L23/5286 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/83 , H01L25/105 , H01L2224/02311 , H01L2224/02313 , H01L2224/0233 , H01L2224/02331 , H01L2224/0239 , H01L2224/0345 , H01L2224/0346 , H01L2224/0347 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05166 , H01L2224/05548 , H01L2224/05647 , H01L2224/1146 , H01L2224/1147 , H01L2224/1191 , H01L2224/1302 , H01L2224/13024 , H01L2224/13026 , H01L2224/131 , H01L2224/13147 , H01L2224/14131 , H01L2224/14134 , H01L2224/14177 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32245 , H01L2224/73204 , H01L2224/81191 , H01L2224/81815 , H01L2224/8385 , H01L2224/92125 , H01L2225/1023 , H01L2225/1058 , H01L2924/1427 , H01L2924/15311 , H01L2924/15331 , H01L2924/16152 , H01L2924/16196 , H01L2924/181 , H01L2924/18161 , H01L2924/19105 , H01L2924/381 , H01L2924/01029 , H01L2924/00014 , H01L2924/01022 , H01L2924/014 , H01L2924/00
摘要: Various applications of interconnect substrates in power management systems are described.
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公开(公告)号:US09099340B2
公开(公告)日:2015-08-04
申请号:US13644693
申请日:2012-10-04
IPC分类号: H05K1/11 , H01L25/10 , H01L23/50 , H01L21/56 , H01L23/36 , H01L23/522 , H01L23/528 , H01L23/31 , H01L23/00 , H01L23/367 , H01L23/498
CPC分类号: H01L23/49838 , H01L21/563 , H01L23/3128 , H01L23/3185 , H01L23/36 , H01L23/3675 , H01L23/4952 , H01L23/49527 , H01L23/49568 , H01L23/49575 , H01L23/49827 , H01L23/50 , H01L23/5223 , H01L23/5286 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/83 , H01L25/105 , H01L2224/02311 , H01L2224/02313 , H01L2224/0233 , H01L2224/02331 , H01L2224/0239 , H01L2224/0345 , H01L2224/0346 , H01L2224/0347 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05166 , H01L2224/05548 , H01L2224/05647 , H01L2224/1146 , H01L2224/1147 , H01L2224/1191 , H01L2224/1302 , H01L2224/13024 , H01L2224/13026 , H01L2224/131 , H01L2224/13147 , H01L2224/14131 , H01L2224/14134 , H01L2224/14177 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32245 , H01L2224/73204 , H01L2224/81191 , H01L2224/81815 , H01L2224/8385 , H01L2224/92125 , H01L2225/1023 , H01L2225/1058 , H01L2924/1427 , H01L2924/15311 , H01L2924/15331 , H01L2924/16152 , H01L2924/16196 , H01L2924/181 , H01L2924/18161 , H01L2924/19105 , H01L2924/381 , H01L2924/01029 , H01L2924/00014 , H01L2924/01022 , H01L2924/014 , H01L2924/00
摘要: Various applications of interconnect substrates in power management systems are described.
摘要翻译: 描述了电源管理系统中互连基板的各种应用。
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