公开(公告)号：US07859108B2

公开(公告)日：2010-12-28

申请号：US11965365

申请日：2007-12-27

申请人： Woong Sun Lee ,  Il Hwan Cho ,  Myung Geun Park ,  Cheol Ho Joh ,  Eun Hye Do ,  Ki Young Kim ,  Ji Eun Kim ,  Jong Hyun Nam

发明人： Woong Sun Lee ,  Il Hwan Cho ,  Myung Geun Park ,  Cheol Ho Joh ,  Eun Hye Do ,  Ki Young Kim ,  Ji Eun Kim ,  Jong Hyun Nam

IPC分类号： H01L23/48

CPC分类号： H01L23/49811 ,  H01L21/563 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81395 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H05K3/282 ,  H05K2201/10674 ,  H05K2203/0568 ,  H05K2203/1361 ,  H05K2203/1554 ,  H01L2924/00 ,  H01L2224/05599

摘要： A flip chip package includes a substrate and a semiconductor chip. The substrate includes a substrate body, a metal wiring having a terminal part some of which is disposed in the substrate body, a solder resist pattern formed on the substrate body with an opening for exposing the terminal part, and an organic anti-oxidation layer for covering the terminal part. The semiconductor chip has a bump formed through (e.g., penetrates) the organic anti-oxidation layer and is electrically connected to the terminal part. The present invention prevents oxidation of the terminal part and allows easy coupling of a bump of a semiconductor chip and the terminal part of the substrate, since an anti-oxidation layer including an organic matter is formed over a surface of a terminal part including copper which is easily oxidized.

摘要翻译： 倒装芯片封装包括衬底和半导体芯片。 基板包括基板主体，具有端子部分的金属布线，其中一部分设置在基板主体中，形成在基板主体上的阻焊图案具有用于暴露端子部分的开口，以及有机抗氧化层， 覆盖终端部分。 半导体芯片具有穿过（例如，穿透）有机抗氧化层并且电连接到端子部分的凸块。 本发明防止了端子部分的氧化，并且容易地将半导体芯片的凸起与基板的端子部分耦合，因为包括有机物的抗氧化层在包括铜的端子部分的表面上形成 容易氧化。

公开(公告)号：US08476751B2

公开(公告)日：2013-07-02

申请号：US13096143

申请日：2011-04-28

申请人： Kyu Won Lee ,  Cheol Ho Joh ,  Eun-Hye Do ,  Ji Eun Kim ,  Hee Min Shin

发明人： Kyu Won Lee ,  Cheol Ho Joh ,  Eun-Hye Do ,  Ji Eun Kim ,  Hee Min Shin

IPC分类号： H01L23/02

CPC分类号： H01L23/481 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/1076 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads.

摘要翻译： 堆叠半导体封装包括半导体封装模块，其包括多个半导体封装，每个半导体封装具有第一表面，背离第一表面的第二表面，连接第一表面和第二表面的侧表面和形成在第一表面上的通孔 侧表面通过第一表面和第二表面并且堆叠成使得它们的通孔彼此垂直连接;以及粘合构件，其形成在半导体封装之间并将半导体封装彼此附接，主基板 支撑半导体封装模块，并在其面向半导体封装模块的第三表面上形成与通孔对准的主连接焊盘，以及形成在通孔中的导电连接构件，并将半导体封装与 主连接垫

公开(公告)号：US08564141B2

公开(公告)日：2013-10-22

申请号：US13038831

申请日：2011-03-02

申请人： Kyu Won Lee ,  Cheol Ho Joh ,  Eun Hye Do ,  Ji Eun Kim ,  Hee Min Shin

发明人： Kyu Won Lee ,  Cheol Ho Joh ,  Eun Hye Do ,  Ji Eun Kim ,  Hee Min Shin

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/3121 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and second semiconductor chips for forming the first and second bonding pads, and having redistribution lines which have one ends connected with the first and second bonding pads and the other ends projecting beyond one edges of the first and second semiconductor chips and films; an adhesive member interposed between the first connection members and the second connection members; and via patterns passing through the adhesive member and connecting projecting portions of the redistribution lines of the first and second connection members with each other.

摘要翻译： 芯片单元包括：第一半导体芯片和第二半导体芯片，其布置成使得其用于形成第一焊盘和第二焊盘的表面彼此面对; 第一和第二连接构件，设置在第一和第二半导体芯片的表面上，用于形成第一和第二接合焊盘，并且具有一端与第一和第二接合焊盘连接的再分配线，另一端突出超过 第一和第二半导体芯片和薄膜; 插入在所述第一连接构件和所述第二连接构件之间的粘合构件; 并且通过图案通过粘合构件并将第一和第二连接构件的再分配线的突出部彼此连接。

公开(公告)号：US08773772B2

公开(公告)日：2014-07-08

申请号：US13588583

申请日：2012-08-17

申请人： Chi Ho An ,  Pil Sun Jung ,  Jae Hoon Cho ,  Ji Eun Kim ,  Chan Goo Kang

发明人： Chi Ho An ,  Pil Sun Jung ,  Jae Hoon Cho ,  Ji Eun Kim ,  Chan Goo Kang

IPC分类号： G02B13/18 ,  G02B9/34 ,  G02B13/00

CPC分类号： G02B13/004 ,  G02B5/208 ,  G02B13/18

摘要： A lens optical system includes first, second, third, and fourth lenses that are arranged between an object and an image sensor, in order from an object side, wherein the first lens has positive refractive power and an incident surface that is convex toward the object, the second lens has negative refractive power and both surfaces of which are concave, the third lens has positive refractive power and a meniscus shape that is convex toward the image sensor, and the fourth lens has negative refractive power and at least one of an incident surface and an exit surface of which is an aspherical surface, wherein the system satisfies the inequality, 3.0

摘要翻译： 透镜光学系统包括从物体侧开始依次布置在物体和图像传感器之间的第一透镜，第二透镜，第三透镜​​和第四透镜，其中第一透镜具有正折光力，并且朝向物体凸出的入射表面 第二透镜具有负屈光力并且其两个表面都是凹形的，第三透镜​​具有正的折光力和朝向图像传感器凸起的弯月形状，并且第四透镜具有负折光力，并且至少一个入射 表面，其出射表面是非球面，其中系统满足不等式3.0

公开(公告)号：USRE44334E1

公开(公告)日：2013-07-02

申请号：US13050669

申请日：2011-03-17

申请人： Yong Ae Jeon ,  Ji Eun Kim ,  Sangsung Choi ,  Kwang Roh Park

发明人： Yong Ae Jeon ,  Ji Eun Kim ,  Sangsung Choi ,  Kwang Roh Park

IPC分类号： H04J3/22

CPC分类号： H04W72/1263 ,  H04L47/14 ,  H04L47/50 ,  H04W84/18

摘要： An apparatus for transmitting WPAN (Wireless Personal Area Network) MAC (Medium Access Control) frames includes a transport frame management unit for creating MAC transport frames if data is generated from an upper protocol and application layer unit, classifying the created MAC transport frames by kinds, and managing the classified MAC transport frames by queues, a transport memory control unit for transmitting the transport frames at a high speed, and a transport frame transmission unit for responsible for the transmission of the transport frames by judging the transmission time of the frames.

公开(公告)号：US20120255166A1

公开(公告)日：2012-10-11

申请号：US13440580

申请日：2012-04-05

申请人： Bae Sun KIM ,  Yong Ki ,  Ji Eun Kim ,  Sung Yong

发明人： Bae Sun KIM ,  Yong Ki ,  Ji Eun Kim ,  Sung Yong

IPC分类号： H05K3/06 ,  H05K3/22

CPC分类号： H05K1/038 ,  H05K3/20 ,  H05K3/205 ,  H05K2203/0156 ,  H05K2203/068 ,  Y10T29/49155

摘要： An embodiment of the present invention relates to a method for manufacturing a fabric type circuit board and can form a fine pattern by performing the etching process on the metal layer when a circuit pattern is formed, transfer the circuit pattern to the fabric by a thermosetting adhesive film to secure strong durability against flexibility of the fabric and sufficient electric conductivity and maintain ventilation, and apply various mounting methods such as soldering, wire bonding, or the like, when electronic parts are mounted.

摘要翻译： 本发明的一个实施例涉及一种用于制造织物型电路板的方法，并且当形成电路图案时，通过对金属层进行蚀刻处理可以形成精细图案，通过热固性粘合剂将电路图案转移到织物 薄膜，以确保对织物的柔韧性的足够的耐久性和足够的导电性并保持通风，并且当安装电子部件时应用诸如焊接，引线接合等的各种安装方法。

公开(公告)号：US07838129B2

公开(公告)日：2010-11-23

申请号：US11660761

申请日：2005-09-23

申请人： Wook Dong Cho ,  Ji Eun Kim ,  Byung Sun Jeon ,  Seok Hee Yoon ,  Jae Min Moon

发明人： Wook Dong Cho ,  Ji Eun Kim ,  Byung Sun Jeon ,  Seok Hee Yoon ,  Jae Min Moon

IPC分类号： H01L51/54 ,  C09K11/00

CPC分类号： H01L51/006 ,  C07D221/20 ,  C09K11/06 ,  C09K2211/1022 ,  C09K2211/1029 ,  C09K2211/1458 ,  C09K2211/1466 ,  H01L51/0058 ,  H01L51/0061 ,  H01L51/0072 ,  H01L51/5012 ,  H01L51/5048 ,  H01L51/5088 ,  H05B33/14 ,  Y10S428/917

摘要： Disclosed is a novel compound which is capable of significantly improving a lifespan, efficiency, and electrochemical and thermal stabilities of an organic light emitting device, the production of the compound, and an organic light emitting device in which the compound is contained in an organic compound layer.

摘要翻译： 公开了一种新型化合物，其能够显着地提高有机发光器件的寿命，效率，电化学和热稳定性，化合物的制备以及其中化合物包含在有机化合物中的有机发光器件 层。

公开(公告)号：USD605272S1

公开(公告)日：2009-12-01

申请号：US29331267

申请日：2009-01-22

申请人： Jae Hung Chun ,  Kyu Nam Lee ,  Jae Won Jeong ,  Ji Eun Kim ,  Seon Kyu Kim

设计人： Jae Hung Chun ,  Kyu Nam Lee ,  Jae Won Jeong ,  Ji Eun Kim ,  Seon Kyu Kim

公开(公告)号：US20090200542A1

公开(公告)日：2009-08-13

申请号：US11658770

申请日：2005-09-23

申请人： Wook Dong Cho ,  Ji Eun Kim ,  Byung Sun Jeon ,  Dong Seob Jeong ,  Seok Hee Yoon ,  Jae Min Moon

发明人： Wook Dong Cho ,  Ji Eun Kim ,  Byung Sun Jeon ,  Dong Seob Jeong ,  Seok Hee Yoon ,  Jae Min Moon

IPC分类号： H01L51/56 ,  C07C211/00

CPC分类号： H01L51/006 ,  C07D221/20 ,  C09K11/06 ,  C09K2211/1022 ,  C09K2211/1029 ,  C09K2211/1458 ,  C09K2211/1466 ,  H01L51/0058 ,  H01L51/0061 ,  H01L51/0072 ,  H01L51/5012 ,  H01L51/5048 ,  H01L51/5088 ,  H05B33/14 ,  Y10S428/917

摘要： Disclosed is an organic light emitting device. The organic light emitting device comprises a first electrode, organic material layer(s) comprising a light emitting layer, and a second electrode. The first electrode, the organic material layer(s), and the second electrode form layered structure and at least one layer of the organic material layer(s) include the compound of Formula 1 or the compound of Formula 1 into which a thermosetting or photo-crosslinkable functional group is introduced.

摘要翻译： 公开了一种有机发光装置。 有机发光器件包括第一电极，包括发光层的有机材料层和第二电极。 第一电极，有机材料层和第二电极形成层状结构，并且至少一层有机材料层包括式1化合物或式1化合物，其中热固性或照片 引入可交联官能团。

公开(公告)号：US20090045721A1

公开(公告)日：2009-02-19

申请号：US11658993

申请日：2005-09-23

申请人： Wook Dong Cho ,  Ji Eun Kim ,  Byung Sun Jeon ,  Sang Young Jeon ,  Seok Hee Yoon ,  Jae Min Moon

发明人： Wook Dong Cho ,  Ji Eun Kim ,  Byung Sun Jeon ,  Sang Young Jeon ,  Seok Hee Yoon ,  Jae Min Moon

IPC分类号： H01J63/04

CPC分类号： C09K11/06 ,  C07D221/20 ,  C09K2211/1011 ,  C09K2211/1029 ,  H01L51/0039 ,  H01L51/006 ,  H01L51/5048 ,  H01L51/5088 ,  H05B33/14 ,  Y10S428/917

摘要： Disclosed is an organic light emitting device. The organic light emitting device comprises a first electrode, organic material layer(s) comprising a light emitting layer, and a second electrode. The first electrode, the organic material layer(s), and the second electrode form layered structure and at least one layer of the organic material layer(s) include the compound of Formula 1 or the compound of Formula 1 into which a thermosetting or photo-crosslinkable functional group is introduced.

摘要翻译： 公开了一种有机发光装置。 有机发光器件包括第一电极，包括发光层的有机材料层和第二电极。 第一电极，有机材料层和第二电极形成层状结构，并且至少一层有机材料层包括式1化合物或式1化合物，其中热固性或照片 引入可交联官能团。