公开(公告)号：US06538210B2

公开(公告)日：2003-03-25

申请号：US09738522

申请日：2000-12-15

申请人： Yasuhiro Sugaya ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Satoru Yuuhaku ,  Toshiyuki Asahi

发明人： Yasuhiro Sugaya ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Satoru Yuuhaku ,  Toshiyuki Asahi

IPC分类号： H05K100

CPC分类号： H01L23/295 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/28 ,  H01L25/105 ,  H01L25/165 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/185 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module 100 includes the insulating substrate 101 made of a first mixture 105 and a second mixture 106, wiring patterns 102a and 102b formed on one principal surface and another principal surface of the insulating substrate 101, a circuit component 103a electrically connected to the wiring pattern 102a and sealed with the second mixture 106 in an internal portion of the insulating substrate 101, the inner via conductor 104 electrically connecting the wiring pattern 102a and 102b.

公开(公告)号：US06931725B2

公开(公告)日：2005-08-23

申请号：US10340170

申请日：2003-01-09

申请人： Yasuhiro Sugaya ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Satoru Yuuhaku ,  Toshiyuki Asahi

发明人： Yasuhiro Sugaya ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Satoru Yuuhaku ,  Toshiyuki Asahi

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10 ,  H01L25/16 ,  H05K1/03 ,  H05K1/18 ,  H01K3/10

CPC分类号： H01L23/295 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/28 ,  H01L25/105 ,  H01L25/165 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/185 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module 100 includes the insulating substrate 101 made of a first mixture 105 and a second mixture 106, wiring patterns 102a and 102b formed on one principal surface and another principal surface of the insulating substrate 101, a circuit component 103a electrically connected to the wiring pattern 102a and sealed with the second mixture 106 in an internal portion of the insulating substrate 101, the inner via conductor 104 electrically connecting the wiring pattern 102a and 102b.

摘要翻译： 一种电路元件内置模块，能够高密度地安装电路元件，具有高散热性和高可靠性。 电路部件内置模块100包括由第一混合物105和第二混合物106制成的绝缘基板101，形成在一个主表面上的布线图案102a和102b以及绝缘基板101的另一主表面，电路部件 103a，其电连接到布线图案102a并且在绝缘基板101的内部部分中与第二混合物106密封，内部通孔导体104电连接布线图案102a和102b。

公开(公告)号：US06871396B2

公开(公告)日：2005-03-29

申请号：US09778709

申请日：2001-02-07

申请人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

发明人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

IPC分类号： H05K1/03 ,  H05K1/16 ,  H05K3/20 ,  H05K3/40 ,  H01R43/02

CPC分类号： H05K3/20 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/0102 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/205 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T428/12486 ,  H01L2924/00

摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

摘要翻译： 能够可靠且容易地将精细布线图案转印到基板的转印材料。 转印材料包括作为载体的第一金属层，作为布线图案转印到基板的第二金属层和可释放地粘附第一和第二金属层的剥离层的至少三层。 在第一金属层的表面部分上形成与布线图形对应的凹凸部分，并且在凸部的区域上形成剥离层和第二金属层。

公开(公告)号：US07888789B2

公开(公告)日：2011-02-15

申请号：US11090401

申请日：2005-03-25

申请人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

发明人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

IPC分类号： H01L23/12 ,  H01L21/4763 ,  H01R43/20

CPC分类号： H05K3/20 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/0102 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/205 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T428/12486 ,  H01L2924/00

摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

摘要翻译： 能够可靠且容易地将精细布线图案转印到基板上的转印材料。 转印材料包括作为载体的第一金属层，作为布线图案转印到基板的第二金属层和可释放地粘附第一和第二金属层的剥离层的至少三层。 在第一金属层的表面部分上形成与布线图形对应的凹凸部分，并且在凸部的区域上形成剥离层和第二金属层。

公开(公告)号：US06936774B2

公开(公告)日：2005-08-30

申请号：US10283386

申请日：2002-10-29

申请人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

发明人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

IPC分类号： H05K1/03 ,  H05K1/16 ,  H05K3/20 ,  H05K3/40 ,  H05K1/05 ,  H01R43/20

CPC分类号： H05K3/20 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/0102 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/205 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T428/12486 ,  H01L2924/00

摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

摘要翻译： 能够可靠且容易地将精细布线图案转印到基板的转印材料。 转印材料包括作为载体的第一金属层，作为布线图案转印到基板的第二金属层和可释放地粘附第一和第二金属层的剥离层的至少三层。 在第一金属层的表面部分上形成与布线图形对应的凹凸部分，并且在凸部的区域上形成剥离层和第二金属层。

公开(公告)号：US20050186768A1

公开(公告)日：2005-08-25

申请号：US11090401

申请日：2005-03-25

申请人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

发明人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

IPC分类号： H05K1/03 ,  H05K1/16 ,  H05K3/20 ,  H05K3/40 ,  H01L21/00 ,  H01L21/44 ,  H01L21/461 ,  H01L23/48 ,  H01L29/40

CPC分类号： H05K3/20 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/0102 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/205 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T428/12486 ,  H01L2924/00

摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

公开(公告)号：US07394663B2

公开(公告)日：2008-07-01

申请号：US10775656

申请日：2004-02-09

申请人： Yoshihisa Yamashita ,  Koichi Hirano ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiichi Nakatani

发明人： Yoshihisa Yamashita ,  Koichi Hirano ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiichi Nakatani

IPC分类号： H05K1/16

CPC分类号： H05K1/187 ,  H01L23/49894 ,  H01L23/5389 ,  H01L25/162 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19105 ,  H05K1/186 ,  H05K3/4614 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An electronic component built-in module according to the present invention includes a pair of opposed circuit substrates, each of which includes a wiring pattern and an insulating base material containing a resin, an insulating layer that is placed between the pair of circuit substrates and contains an inorganic filler and a resin composition containing a thermosetting resin, an electronic component that is embedded in the insulating layer, and an inner via that is provided in the insulating layer so as to make an electrical connection between wiring patterns provided on different circuit substrates. A glass transition temperature Tg1 of the resin composition contained in the insulating layer and a glass transition temperature Tg2 of the insulating base material included in each of the circuit substrates satisfy a relationship Tg1>Tg2.

摘要翻译： 根据本发明的电子部件内置模块包括一对相对的电路基板，每个电路基板包括布线图案和包含树脂的绝缘基材，绝缘层位于该对电路基板之间并且包含 无机填料和包含热固性树脂的树脂组合物，嵌入在绝缘层中的电子部件和设置在绝缘层中的内部通孔，以便在设置在不同电路基板上的布线图案之间形成电连接。 包含在绝缘层中的树脂组合物的玻璃化转变温度Tg1和包含在每个电路基板中的绝缘基材的玻璃化转变温度Tg2满足Tg1> Tg2。

公开(公告)号：US07018866B2

公开(公告)日：2006-03-28

申请号：US10753933

申请日：2004-01-07

申请人： Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Kazuo Ohtani

发明人： Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Kazuo Ohtani

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H05K1/187 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81001 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014

摘要： A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 μm and not more than 100 μm, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 μm and not more than 200 μm. With this configuration, the high-performance and compact-size circuit component built-in module in which circuit components are mounted at a high density is provided so as to be used suitably in various types of electronic information devices.

摘要翻译： 电路部件内置模块包括：由含有无机填料和热固性树脂的混合物制成的第一电绝缘基板; 至少形成在所述第一电绝缘基板的主表面上的多个布线图案; 结合在第一电绝缘基板中并与布线图形电连接的半导体芯片; 以及将所述多个布线图案彼此电连接的内部通孔，所述内部通孔穿过所述第一电绝缘基板。 在电路部件内置模块中，半导体芯片的厚度为30μm以上且100μm以下，具有非接线表面接地，电路部件内置模块的厚度为 范围不小于80μm，不大于200μm。 利用这种配置，提供了以高密度安装电路部件的高性能和紧凑型电路部件内置模块，以便适用于各种类型的电子信息装置。

公开(公告)号：US07248482B2

公开(公告)日：2007-07-24

申请号：US10844823

申请日：2004-05-12

申请人： Toshiyuki Asahi ,  Yutaka Taguchi ,  Yasuhiro Sugaya ,  Seiichi Nakatani ,  Toshio Fujii

发明人： Toshiyuki Asahi ,  Yutaka Taguchi ,  Yasuhiro Sugaya ,  Seiichi Nakatani ,  Toshio Fujii

IPC分类号： H01R12/16 ,  H05K1/14

CPC分类号： H05K1/186 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/19105 ,  H05K1/115 ,  H05K3/20 ,  H05K3/4614 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/10378 ,  H05K2203/061 ,  H01L2224/81 ,  H01L2224/83

摘要： A module with a built-in circuit component of the present invention includes an electric insulating layer, a pair of wiring layers provided on both principal planes of the electric insulating layer, a plurality of via conductors electrically connecting the pair of wiring layers and passing through the electric insulating layer in a thickness direction thereof, and a circuit component buried in the electric insulating layer, wherein the plurality of via conductors are disposed in a circumferential portion of the electric insulating layer in accordance with a predetermined rule. The plurality of via conductors are placed at an interval, for example, so as to form at least one straight line, in a cut surface of the electric insulating layer in a direction parallel to a principal plane thereof.

摘要翻译： 具有本发明的内置电路部件的模块包括电绝缘层，设置在电绝缘层的两个主平面上的一对布线层，多个通孔导体，电连接该对布线层并通过 所述电绝缘层的厚度方向以及埋设在所述电绝缘层中的电路部件，其中，所述多个通孔导体按照规定的规则配置在所述电绝缘层的周向部分。 多个通孔导体例如在与绝缘层的主平面平行的方向上在电绝缘层的切割面上形成至少一条直线的间隔。

公开(公告)号：US07294587B2

公开(公告)日：2007-11-13

申请号：US11126029

申请日：2005-05-10

申请人： Toshiyuki Asahi ,  Yasuhiro Sugaya ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani

发明人： Toshiyuki Asahi ,  Yasuhiro Sugaya ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani

IPC分类号： H01L21/31 ,  H01L21/469

CPC分类号： H01L25/50 ,  H01L21/6835 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/16 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/82047 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/10378 ,  H05K2201/10636 ,  H05K2203/061 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/29075

摘要： A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of the insulating layer. In this module, at least one of the wirings is formed on a surface of a wiring board, and the components embedded inside of the insulating layer are mounted on and integrated with the wiring board before embedding. This configuration allows the components such as a semiconductor to undergo a mounting inspection and a property inspection before embedding. As a result, the yields of the module can be improved. In addition, since the components are integrated with the wiring board and embedded, the strength thereof can be enhanced.

摘要翻译： 组件内置模块包括绝缘层，与绝缘层的两个表面一体化的布线，连接布线的通孔以及嵌入在绝缘层内部的一个或多个选自电子部件和半导体的部件。 在该模块中，布线板的表面上形成有布线中的至少一方，嵌入绝缘层内的部件安装在布线基板上并与嵌入板一体化。 这种构造允许诸如半导体的部件在嵌入之前进行安装检查和性能检查。 结果，可以提高模块的产量。 此外，由于部件与布线板集成并嵌入，因此可以提高其强度。