公开(公告)号：US20100112761A1

公开(公告)日：2010-05-06

申请号：US12685403

申请日：2010-01-11

申请人： YASUMI TSUTSUMI ,  Takashi Miwa

发明人： YASUMI TSUTSUMI ,  Takashi Miwa

IPC分类号： H01L21/60 ,  H01L21/56

CPC分类号： H01L24/49 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0652 ,  H01L2223/54486 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48233 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is disclosed wherein first wiring lines in a first row extend respectively from first connecting portions toward one side of a semiconductor chip, while second wiring lines extend respectively from second connecting portions toward the side opposite to the one side of the semiconductor chip. The reduction in size of the semiconductor device can be attained.

摘要翻译： 公开了一种半导体器件，其中第一行中的第一布线分别从第一连接部分向​​半导体芯片的一侧延伸，而第二布线分别从第二连接部分延伸到与半导体芯片的一侧相对的一侧。 可以实现半导体器件的尺寸减小。

公开(公告)号：US07286386B2

公开(公告)日：2007-10-23

申请号：US11401284

申请日：2006-04-11

申请人： Takashi Miwa ,  Yasumi Tsutsumi ,  Masahiro Ichitani ,  Takanori Hashizume ,  Masamichi Sato ,  Naozumi Morino ,  Atsushi Nakamura ,  Saneaki Tamaki ,  Ikuo Kudo

发明人： Takashi Miwa ,  Yasumi Tsutsumi ,  Masahiro Ichitani ,  Takanori Hashizume ,  Masamichi Sato ,  Naozumi Morino ,  Atsushi Nakamura ,  Saneaki Tamaki ,  Ikuo Kudo

IPC分类号： G11C5/06 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/5386 ,  H01L25/18 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads. The semiconductor device further includes an address output circuit and a data input/output circuit which also serves for memory access and a signal processing circuit having a data processing function. A semiconductor chip having bonding pads connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads connected to the bonding leads corresponding to the data terminals of the package substrate and distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure. Bonding leads arranged along at least one side of the substrate may include bonding leads of rectangular configuration having longer sides disposed at acute angles with respect to the side of the substrate.

摘要翻译： 半导体器件使用分别对应于分配到存储器芯片的相对的第一和第二侧的地址和数据的接合焊盘以及连接到接合引线的地址端子和数据端子分别形成有接合引线的封装基板。 半导体器件还包括地址输出电路和用于存储器访问的数据输入/输出电路和具有数据处理功能的信号处理电路。 一种半导体芯片，其具有连接到与封装基板的地址端子对应的接合引线的接合焊盘以及连接到与封装基板的数据端子相对应的接合引线的接合焊盘，并且分布在四边的两侧， 上述存储芯片以堆叠结构安装在封装基板上。 沿着衬底的至少一侧布置的接合引线可以包括具有相对于衬底的侧面以锐角设置的长边的矩形构造的接合引线。

公开(公告)号：US20070075414A1

公开(公告)日：2007-04-05

申请号：US11520816

申请日：2006-09-14

申请人： Yasumi Tsutsumi ,  Takashi Miwa

发明人： Yasumi Tsutsumi ,  Takashi Miwa

IPC分类号： H01L23/52

CPC分类号： H01L24/49 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0652 ,  H01L2223/54486 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48233 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is disclosed wherein first wiring lines in a first row extend respectively from first connecting portions toward one side of a semiconductor chip, while second wiring lines extend respectively from second connecting portions toward the side opposite to the one side of the semiconductor chip. The reduction in size of the semiconductor device can be attained.

摘要翻译： 公开了一种半导体器件，其中第一行中的第一布线分别从第一连接部分向​​半导体芯片的一侧延伸，而第二布线分别从第二连接部分延伸到与半导体芯片的一侧相对的一侧。 可以实现半导体器件的尺寸减小。

公开(公告)号：US07656019B2

公开(公告)日：2010-02-02

申请号：US11520816

申请日：2006-09-14

申请人： Yasumi Tsutsumi ,  Takashi Miwa

发明人： Yasumi Tsutsumi ,  Takashi Miwa

IPC分类号： H01L23/495

CPC分类号： H01L24/49 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0652 ,  H01L2223/54486 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48233 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is disclosed wherein first wiring lines in a first row extend respectively from first connecting portions toward one side of a semiconductor chip, while second wiring lines extend respectively from second connecting portions toward the side opposite to the one side of the semiconductor chip. The reduction in size of the semiconductor device can be attained.

摘要翻译： 公开了一种半导体器件，其中第一行中的第一布线分别从第一连接部分向​​半导体芯片的一侧延伸，而第二布线分别从第二连接部分延伸到与半导体芯片的一侧相对的一侧。 可以实现半导体器件的尺寸减小。

公开(公告)号：US20060180943A1

公开(公告)日：2006-08-17

申请号：US11401284

申请日：2006-04-11

申请人： Takashi Miwa ,  Yasumi Tsutsumi ,  Masahiro Ichitani ,  Takanori Hashizume ,  Masamichi Sato ,  Naozumi Morino ,  Atsushi Nakamura ,  Saneaki Tamaki ,  Ikuo Kudo

发明人： Takashi Miwa ,  Yasumi Tsutsumi ,  Masahiro Ichitani ,  Takanori Hashizume ,  Masamichi Sato ,  Naozumi Morino ,  Atsushi Nakamura ,  Saneaki Tamaki ,  Ikuo Kudo

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/5386 ,  H01L25/18 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention provides a semiconductor device having a stacked structure which realizes the miniaturization of a contour size and the reduction of thickness. The present invention also provides a semiconductor device which realizes high performance and high reliability in addition to the miniaturization of the contour size. The semiconductor device uses a package substrate on which bonding leads which are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads are formed. The semiconductor device further includes an address output circuit and a data input/output circuit which are also served for memory access and a signal processing circuit having a data processing function. A semiconductor chip in which bonding pads which are connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads which are connected to the bonding leads corresponding to the data terminals of the package substrate are distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure.

摘要翻译： 本发明提供一种具有层叠结构的半导体器件，其实现了轮廓尺寸的小型化和厚度的减小。 本发明还提供了除了轮廓尺寸的小型化之外还实现高性能和高可靠性的半导体器件。 半导体装置使用封装基板，在该封装基板上分别对应于分配给存储芯片的相对的第一和第二侧的地址和数据的接合焊盘形成的接合引线以及连接到接合引线的地址端子和数据端子 形成。 半导体器件还包括还用于存储器访问的地址输出电路和数据输入/输出电路以及具有数据处理功能的信号处理电路。 一种半导体芯片，其中连接到与封装基板的地址端子相对应的接合引线的接合焊盘和连接到与封装基板的数据端子对应的接合引线的接合焊盘分配到四个 侧面和上述存储芯片以堆叠结构安装在封装基板上。

公开(公告)号：US07061785B2

公开(公告)日：2006-06-13

申请号：US10606891

申请日：2003-06-27

申请人： Takashi Miwa ,  Yasumi Tsutsumi ,  Masahiro Ichitani ,  Takanori Hashizume ,  Masamichi Sato ,  Naozumi Morino ,  Atsushi Nakamura ,  Saneaki Tamaki ,  Ikuo Kudo

发明人： Takashi Miwa ,  Yasumi Tsutsumi ,  Masahiro Ichitani ,  Takanori Hashizume ,  Masamichi Sato ,  Naozumi Morino ,  Atsushi Nakamura ,  Saneaki Tamaki ,  Ikuo Kudo

IPC分类号： G11C5/06

CPC分类号： H01L25/0657 ,  H01L23/5386 ,  H01L25/18 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads. The semiconductor device further includes an address output circuit and a data input/output circuit which also serves for memory access and a signal processing circuit having a data processing function. A semiconductor chip having bonding pads connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads connected to the bonding leads corresponding to the data terminals of the package substrate and distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure.

摘要翻译： 半导体器件使用分别对应于分配到存储器芯片的相对的第一和第二侧的地址和数据的接合焊盘以及连接到接合引线的地址端子和数据端子分别形成有接合引线的封装基板。 半导体器件还包括地址输出电路和用于存储器访问的数据输入/输出电路和具有数据处理功能的信号处理电路。 一种半导体芯片，其具有连接到与封装基板的地址端子对应的接合引线的接合焊盘以及连接到与封装基板的数据端子相对应的接合引线的接合焊盘，并且分布在四边的两侧， 上述存储芯片以堆叠结构安装在封装基板上。

公开(公告)号：US07879655B2

公开(公告)日：2011-02-01

申请号：US12685403

申请日：2010-01-11

申请人： Yasumi Tsutsumi ,  Takashi Miwa

发明人： Yasumi Tsutsumi ,  Takashi Miwa

IPC分类号： H01L23/48

CPC分类号： H01L24/49 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0652 ,  H01L2223/54486 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48233 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is disclosed wherein first wiring lines in a first row extend respectively from first connecting portions toward one side of a semiconductor chip, while second wiring lines extend respectively from second connecting portions toward the side opposite to the one side of the semiconductor chip. The reduction in size of the semiconductor device can be attained.

摘要翻译： 公开了一种半导体器件，其中第一行中的第一布线分别从第一连接部分向​​半导体芯片的一侧延伸，而第二布线分别从第二连接部分延伸到与半导体芯片的一侧相对的一侧。 可以实现半导体器件的尺寸减小。

公开(公告)号：US08414133B2

公开(公告)日：2013-04-09

申请号：US13551034

申请日：2012-07-17

申请人： Takaharu Adachi ,  Shinichi Okuno ,  Ryuhei Amano ,  Takashi Ikeda ,  Takashi Miwa

发明人： Takaharu Adachi ,  Shinichi Okuno ,  Ryuhei Amano ,  Takashi Ikeda ,  Takashi Miwa

IPC分类号： G03B21/28 ,  G03B3/00

CPC分类号： G03B21/28

摘要： A projection display device comprises a projection lens section to which light modulated by a light modulating element is entered, a mirror section for reflecting the light emitted from the projection lens section to reflect to the projection lens section side and directing the light to a projection plane, and an operation section for displacing a lens in the projection lens section. The operation section is disposed in a region in which the operation section does not hinder an optical path of the light that has been passed through a projection port provided in a main body cabinet.

摘要翻译： 投影显示装置包括投影透镜部分，由光调制元件调制的光进入该投影透镜部分，用于反射从投影透镜部分发射的光以反射到投影透镜部分侧并将光引导到投影平面的反射镜部分 以及用于移动投影透镜部中的透镜的操作部。 操作部设置在操作部不妨碍通过设置在主体机壳中的突出口的光的光路的区域。

公开(公告)号：US08084869B2

公开(公告)日：2011-12-27

申请号：US12478837

申请日：2009-06-05

申请人： Takashi Miwa ,  Michiaki Sugiyama ,  Kazumasa Yanagisawa

发明人： Takashi Miwa ,  Michiaki Sugiyama ,  Kazumasa Yanagisawa

IPC分类号： H01L23/29

CPC分类号： H01L23/49838 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/4652 ,  H05K2201/09227 ,  H05K2201/099 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A technique permitting the reduction in size of a semiconductor device is provided. In a BGA type semiconductor device with a semiconductor chip flip-chip-bonded onto a wiring substrate, bump electrodes of the semiconductor chip are coupled to lands formed at an upper surface of the wiring substrate. The lands at the upper surface of the wiring substrate are coupled electrically to solder balls formed on a lower surface of the wiring substrate. Therefore, the lands include first type lands with lead-out lines coupled thereto and second type lands with lead-out lines not coupled thereto but with vias formed just thereunder. The lands are arrayed in six or more rows at equal pitches in an advancing direction of the rows. However, a row-to-row pitch is not made an equal pitch. In land rows which are likely to cause a short-circuit, the pitch between adjacent rows is made large, while in land rows which are difficult to cause a short-circuit, the pitch between adjacent rows is made small. By so doing, both prevention of a short-circuit and improvement of the layout density of lands are attained at a time.

摘要翻译： 提供了允许半导体器件的尺寸减小的技术。 在具有倒装芯片接合在布线基板上的半导体芯片的BGA型半导体器件中，半导体芯片的突起电极被耦合到在布线基板的上表面上形成的焊盘。 布线基板的上表面的焊盘电连接到形成在布线基板的下表面上的焊球。 因此，焊盘包括具有与其耦合的引出线的第一类型的焊盘和没有耦合到其上的导出线，但是具有刚好形成的通孔的第二类型的焊盘。 焊盘沿着行的前进方向以等间距排列成六行或更多行。 然而，行到行间距不是相等的音高。 在可能导致短路的陆地列中，相邻行之间的间距变大，而在难以引起短路的陆地行中，相邻行之间的间距变小。 通过这样做，一次可以实现防止短路的改善和布局密度的提高。

公开(公告)号：US08084003B2

公开(公告)日：2011-12-27

申请号：US12444845

申请日：2007-10-17

申请人： Takashi Miwa ,  Yasuko Maruo ,  Jiro Nakamura ,  Tatsuya Kunioka ,  Seizo Sakata

发明人： Takashi Miwa ,  Yasuko Maruo ,  Jiro Nakamura ,  Tatsuya Kunioka ,  Seizo Sakata

IPC分类号： G01N33/52

CPC分类号： G01N31/224 ,  G01N21/783 ,  Y10T436/206664

摘要： A vessel (102) containing a detector solution (101) is prepared. The detector solution (101) is an aqueous solution prepared by dissolving a detector component containing a dye which changes its color when reacting with ozone gas, a humectant, and an ultraviolet absorber having a hydrophilic group. A prepared sheet-like carrier (103) is dipped in the detector solution (101) for, e.g., 30 sec, thereby forming an impregnated sheet (104) by impregnating the sheet-like carrier (103) with the detector solution (101). The impregnated sheet (104) is then dried by evaporating the solvent (medium) such as water contained in the impregnated sheet (104), thereby forming a sheet-like ozone detecting device (105).

摘要翻译： 制备容纳检测器溶液（101）的容器（102）。 检测器溶液（101）是通过将含有与臭氧气体，湿润剂和具有亲水基团的紫外线吸收剂反应而变色的染料的检测剂成分溶解而成的水溶液。 将准备的片状载体（103）浸渍在检测器溶液（101）中，例如30秒，由此通过用检测器溶液（101）浸渍片状载体（103）形成浸渍片材（104） 。 然后通过蒸发包含在浸渍片材（104）中的水的溶剂（介质）干燥浸渍的片材（104），从而形成片状臭氧检测装置（105）。