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公开(公告)号：US20080149369A1
公开(公告)日：2008-06-26
申请号：US11944498
申请日：2007-11-23
CPC分类号： H01L21/4846 , H01L21/563 , H01L23/498 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16237 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01088 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H05K3/305 , H05K3/3436 , H05K3/3452 , H05K3/381 , H05K3/4602 , H05K2201/10674 , H05K2201/10977 , H05K2203/0278 , Y02P70/613 , Y10T29/49117 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T428/2804 , Y10T428/31511 , Y10T428/31681 , H01L2224/16225 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of manufacturing a printed wiring board includes preparing a wiring substrate having a conductive circuit, coating a solder-resist layer over the conductive circuit, leveling a surface of the solder-resist layer so as to obtain a maximum surface roughness in a predetermined range, removing the resin film from the surface of the solder-resist layer, and forming multiple openings in the surface of the solder-resist layer to expose multiple portions of the conductive circuit so as to form multiple conductive pads for mounting an electronic components.
摘要翻译： 一种制造印刷电路板的方法包括制备具有导电电路的布线基板，在导电电路上涂覆阻焊层，使阻焊层的表面平整，以获得预定范围内的最大表面粗糙度 从阻焊层的表面除去树脂膜，在阻焊层的表面形成多个开口以暴露导电电路的多个部分，以形成用于安装电子部件的多个导电焊盘。
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2.发明申请公开(公告)号：US20120031659A1
公开(公告)日：2012-02-09
申请号：US13274897
申请日：2011-10-17
IPC分类号： H05K1/02
CPC分类号： H05K3/3457 , H01L21/4853 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16225 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H05K3/3436 , H05K3/3478 , H05K2201/094 , H05K2203/0278 , H05K2203/041 , H05K2203/043 , Y10T29/49121 , Y10T29/49142 , Y10T29/49144 , Y10T29/49149 , Y10T29/49167 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm.
摘要翻译： 制造具有焊料凸块的印刷线路板的方法包括形成具有小的和大的孔的阻焊层，暴露印刷线路板的各自的导电焊盘，使用具有 与阻焊层的孔相对应的孔径区域，从小孔中的焊球形成具有第一高度的第一凸起，以及从大孔中的焊球形成具有第二高度的第二凸起， 第一高度大于第二高度，并且按压第一凸起的顶部，使得第一高度变得与第二高度基本相同。 多层印刷布线板包括具有不同尺寸的孔的阻焊层和具有基本相等体积但高度差不大于10μm的焊料凸块。
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公开(公告)号：US20090026250A1
公开(公告)日：2009-01-29
申请号：US12180830
申请日：2008-07-28
CPC分类号： H05K3/3478 , B23K3/0623 , H01L21/4853 , H01L24/11 , H01L24/742 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13099 , H01L2224/16225 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H05K2203/041 , H05K2203/0557 , H05K2203/082 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having of openings that correspond to pads of the printed wiring board, one or more cylinder members positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member gathering solder balls on the surface of the ball array mask under the cylinder member by suctioning air through the opening portion of the cylinder member, and a conveyor mechanism for moving the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the printed wiring board through the openings of the ball array mask held by the holding device.
摘要翻译： 一种用于将焊球加载到印刷线路板的焊盘上的焊球加载装置，包括：保持装置，用于保持具有焊盘的印刷线路板，并且保持具有对应于印刷线路板的焊盘的开口的球形阵列掩模，一个或多个 气缸构件定位在保持装置上方，使得气缸构件的开口部分面向保持装置，气缸构件通过吸入空气通过气缸构件的开口部分而在气缸构件下收集球阵列的表面上的焊球 以及用于相对于圆筒部件移动球形阵列掩模和印刷线路板的传送机构，使得聚集在圆筒部件的开口部分下方的焊球可以通过所述印刷线路板的开口装载到印刷线路板的焊盘上 球形阵列掩模由保持装置保持。
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