摘要:
A system and method for displaying font in a wireless telephone. The system and method employ the operations of converting base font data into converted font data, wherein the converted font data has a data bits equal in number to data bits of a background screen into which the converted font data will be transcribed; generating a mask for the converted font data; storing the converted font data and the mask in a memory of the wireless telephone; retrieving the mask stored in the memory. The system and method further employ the operations of executing an AND operation to logically AND the retrieved mask and the background screen to generate; a background screen base; retrieving the converted font data stored in the memory; executing an AND operation to logically AND the retrieved font data and a color data, thereby coloring the converted font data which are white data; and executing an OR operation to logically OR the background screen base and the colored converted font data in order to display a character on the background screen.
摘要:
A working panel includes first array board patterns arranged in a first region and including first and second guide bar patterns facing each other and N first unit board patterns, where N is a natural number greater than or equal to 2, positioned between the first and second guide bar patterns, and second array board patterns including third and fourth guide bar patterns facing each other, and M second unit board patterns, where 1≦M
摘要翻译:工作面板包括布置在第一区域中并包括彼此面对的第一和第二导杆图案的第一阵列板图案,以及N个大于或等于2的自然数,N个第一单元板图案,位于第一和第二 引导杆图案和包括彼此面对的第三和第四导杆图案的第二阵列板图案,以及位于第三和第四导杆图案之间的第二单元板图案,其中1< NlE; M
摘要:
A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.
摘要:
Disclosed herein is an optical connection. In the present invention, an element wire is removably fastened to the optical connector by tightening a main wire connection member using a tightening member from a state in which a plug, a main wire aligning member, a spring, a fastening member, the main wire connection member and the tightening member are previously assembled together. Consequently, only a related optical line need be repaired or replaced with another one, so that the optical line connection work is markedly simplified and can be performed conveniently. Furthermore, there is an advantage of efficient reuse of components.
摘要:
In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.
摘要:
In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.
摘要:
The present invention provides a process for preparing benzoprostacycline derivatives of formula (1), i.e. 5,6,7-trinor-4,8-inter-m-phenylene PGI2 derivatives, and vinyl tin compounds of formula (III) as starting materials for the same.
摘要:
The present invention relates to a process for effectively preparing prostaglandin derivatives and to a stereospecific alkyl halide containing 15S-alcohol group as a starting material.
摘要:
A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.
摘要:
Provided are a photo-electrode for dye-sensitized solar cells, and back contact dye-sensitized solar cells comprising the same. The photo-electrode includes a porous membrane having metal oxide nano-particles adsorbed in a photosensitive dye directly contacting a transparent substrate without intermediation of a conductive film, so that the photo-electrode has advanced light transmittance without absorption and scattering of incident light by the conductive film and application possibilities to a thin film retaining a high-level of electrical conductivity, as well as an easy forming method for the conductive film.