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    Semiconductor devices including multiple stress films in interface area
    5.
    发明授权
    Semiconductor devices including multiple stress films in interface area 失效
    半导体器件包括界面区域中的多个应力膜

    公开(公告)号：US07902609B2

    公开(公告)日：2011-03-08

    申请号：US12621079

    申请日：2009-11-18

    申请人： Seo-woo Nam ,  Ki-chul Kim ,  Young-joon Moon ,  Jae-ouk Choo ,  Hong-jae Shin ,  Nae-in Lee

    发明人： Seo-woo Nam ,  Ki-chul Kim ,  Young-joon Moon ,  Jae-ouk Choo ,  Hong-jae Shin ,  Nae-in Lee

    IPC分类号： H01L23/62

    CPC分类号： H01L21/823412 ,  H01L21/823807 ,  H01L27/088 ,  H01L27/092 ,  H01L29/665 ,  H01L29/6659 ,  H01L29/7843 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor substrate includes a first transistor area having a first gate electrode and first source/drain areas, a second transistor area having a second gate electrode and second source/drain areas, and an interface area provided at an interface of the first transistor area and the second transistor area and having a third gate electrode. A first stress film is on the first gate electrode and the first source/drain areas of the first transistor area and at least a portion of the third gate electrode of the interface area. A second stress film is on the second gate electrode and the second source/drain areas of the second transistor area and not overlapping the first stress film on the third gate electrode of the interface area or overlapping at least a portion of the first stress film. The second stress film overlapping at least the portion of the first stress film is thinner than the second stress film in the second transistor area. Related methods are also described.

    摘要翻译： 半导体衬底包括具有第一栅极电极和第一源极/漏极区域的第一晶体管区域，具有第二栅电极和第二源极/漏极区域的第二晶体管区域，以及设置在第一晶体管区域和 第二晶体管区域并具有第三栅电极。 第一应力膜位于第一栅极电极和第一晶体管区域的第一源极/漏极区域和界面区域的第三栅极电极的至少一部分之间。 第二应力膜位于第二晶体管区域的第二栅极电极和第二源极/漏极区域上，并且不与界面区域的第三栅电极上的第一应力膜重叠或与第一应力膜的至少一部分重叠。 与第一应力膜的至少部分重叠的第二应力膜比第二晶体管区域中的第二应力膜更薄。 还描述了相关方法。

    CMOS integrated circuit devices and substrates having buried silicon germanium layers therein and method of forming same
    6.
    发明申请
    CMOS integrated circuit devices and substrates having buried silicon germanium layers therein and method of forming same 有权
    具有埋入硅锗层的CMOS集成电路器件和衬底及其形成方法

    公开(公告)号：US20070117297A1

    公开(公告)日：2007-05-24

    申请号：US11656717

    申请日：2007-01-23

    申请人： Geum-jong Bae ,  Tae-hee Choe ,  Sang-su Kim ,  Hwa-sung Rhee ,  Nae-in Lee ,  Kyung-wook Lee

    发明人： Geum-jong Bae ,  Tae-hee Choe ,  Sang-su Kim ,  Hwa-sung Rhee ,  Nae-in Lee ,  Kyung-wook Lee

    IPC分类号： H01L21/8234

    CPC分类号： H01L29/66916 ,  H01L21/76254 ,  H01L21/76256 ,  H01L21/76259 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/1054 ,  H01L29/66742 ,  H01L29/78609 ,  H01L29/78612 ,  H01L29/78621 ,  H01L29/78687 ,  H01L29/802

    摘要： CMOS integrated circuit devices include an electrically insulating layer and an unstrained silicon active layer on the electrically insulating layer. An insulated gate electrode is also provided on a surface of the unstrained silicon active layer. A Si1-xGex layer is also disposed between the electrically insulating layer and the unstrained silicon active layer. The Si1-xGex layer forms a first junction with the unstrained silicon active layer and has a graded concentration of Ge therein that decreases monotonically in a first direction extending from a peak level towards the surface of the unstrained silicon active layer. The peak Ge concentration level is greater than x=0.15 and the concentration of Ge in the Si1-xGex layer varies from the peak level to a level less than about x=0.1 at the first junction. The concentration of Ge at the first junction may be abrupt. More preferably, the concentration of Ge in the Si1-xGex layer varies from the peak level where 0.2

    摘要翻译： CMOS集成电路器件包括电绝缘层和电绝缘层上的非限制性硅有源层。 绝缘栅电极也设置在未应变硅有源层的表面上。 Si 1-x Ge Ge层还设置在电绝缘层和未应变硅有源层之间。 Si 1-x N Ge x S层与未应变的硅有源层形成第一结，并且其中的Ge的分级浓度在从第一方向延伸的第一方向上单调减小 峰值电平朝向未应变硅活性层的表面。 峰值Ge浓度水平大于x = 0.15，并且Si 1-x Ga x层中的Ge浓度从峰值水平变化到小于约 x = 0.1。 Ge在第一结处的浓度可能是突然的。 更优选的是，Si 1-x Ge 2 x层中的Ge的浓度从0.2

    Methods of producing semiconductor devices including multiple stress films in interface area
    9.
    发明授权
    Methods of producing semiconductor devices including multiple stress films in interface area 失效
    在界面区域生产包括多个应力膜的半导体器件的方法

    公开(公告)号：US07642148B2

    公开(公告)日：2010-01-05

    申请号：US11851500

    申请日：2007-09-07

    申请人： Seo-woo Nam ,  Ki-chul Kim ,  Young-joon Moon ,  Jae-ouk Choo ,  Hong-jae Shin ,  Nae-in Lee

    发明人： Seo-woo Nam ,  Ki-chul Kim ,  Young-joon Moon ,  Jae-ouk Choo ,  Hong-jae Shin ,  Nae-in Lee

    IPC分类号： H01L21/8238

    CPC分类号： H01L21/823412 ,  H01L21/823807 ,  H01L27/088 ,  H01L27/092 ,  H01L29/665 ,  H01L29/6659 ,  H01L29/7843 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor substrate includes a first transistor area having a first gate electrode and first source/drain areas, a second transistor area having a second gate electrode and second source/drain areas, and an interface area provided at an interface of the first transistor area and the second transistor area and having a third gate electrode. A first stress film is on the first gate electrode and the first source/drain areas of the first transistor area and at least a portion of the third gate electrode of the interface area. A second stress film is on the second gate electrode and the second source/drain areas of the second transistor area and not overlapping the first stress film on the third gate electrode of the interface area or overlapping at least a portion of the first stress film. The second stress film overlapping at least the portion of the first stress film is thinner than the second stress film in the second transistor area. Related methods are also described.

    摘要翻译： 半导体衬底包括具有第一栅极电极和第一源极/漏极区域的第一晶体管区域，具有第二栅极电极和第二源极/漏极区域的第二晶体管区域，以及设置在第一晶体管区域和 第二晶体管区域并具有第三栅电极。 第一应力膜位于第一栅极电极和第一晶体管区域的第一源极/漏极区域和界面区域的第三栅极电极的至少一部分之间。 第二应力膜位于第二晶体管区域的第二栅极电极和第二源极/漏极区域上，并且不与界面区域的第三栅电极上的第一应力膜重叠或与第一应力膜的至少一部分重叠。 与第一应力膜的至少部分重叠的第二应力膜比第二晶体管区域中的第二应力膜更薄。 还描述了相关方法。

    Semiconductor device and method of fabricating the same
    10.
    发明申请
    Semiconductor device and method of fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号：US20080272436A1

    公开(公告)日：2008-11-06

    申请号：US11853187

    申请日：2007-09-11

    申请人： Seo-woo Nam ,  Young-joon Moon ,  Hong-jae Shin ,  Nae-in Lee

    发明人： Seo-woo Nam ,  Young-joon Moon ,  Hong-jae Shin ,  Nae-in Lee

    IPC分类号： H01L21/8234 ,  H01L27/088 ,  H01L21/283

    CPC分类号： H01L21/823807 ,  H01L21/76802 ,  H01L21/76816 ,  H01L21/76829 ,  H01L21/76832 ,  H01L21/823871 ,  H01L29/7843 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor device includes a first stress film covering a first gate electrode and first source/drain areas of a first transistor area and at least a portion of a third gate electrode of an interface area, a second stress film covering a second gate electrode and second source/drain areas of a second transistor area and overlapping at least a portion of the first stress film on the third gate electrode of the interface area, and an interlayer insulating film formed on the first and the second stress film. The semiconductor device further includes a plurality of first contact holes formed through the interlayer insulating film and the first stress film in the first transistor area to expose the first gate electrode and the first source/drain areas, a plurality of second contact holes formed through the interlayer insulating film and the second stress film in the second transistor area to expose the second gate electrode and the second source/drain areas, and a third contact hole formed through the interlayer insulating film, the second stress film, and the first stress film in the interface area to expose the third gate electrode. A depth of a recessed portion of an upper side of the third gate electrode in which the third contact hole is formed is equal to or larger than a depth of a recessed portion of an upper side of the first gate electrode in which the first contact hole is formed.

    摘要翻译： 半导体器件包括覆盖第一栅电极的第一应力膜和第一晶体管区域的第一源极/漏极区域和界面区域的第三栅电极的至少一部分，覆盖第二栅电极的第二应力膜和第二应力膜 第二晶体管区域的源极/漏极区域，并且与界面区域的第三栅电极上的第一应力膜的至少一部分重叠，以及形成在第一和第二应力膜上的层间绝缘膜。 半导体器件还包括多个通过层间绝缘膜形成的第一接触孔和第一晶体管区域中的第一应力膜，以暴露第一栅极电极和第一源极/漏极区域，形成多个第二接触孔 层间绝缘膜和第二晶体管区域中的第二应力膜，以暴露第二栅电极和第二源极/漏极区，以及通过层间绝缘膜，第二应力膜和第一应力膜形成的第三接触孔 暴露第三栅电极的界面区域。 形成第三接触孔的第三栅电极的上侧的凹部的深度等于或大于第一栅电极的上侧的凹部的深度，其中第一接触孔 形成了。