公开(公告)号：US5118556A

公开(公告)日：1992-06-02

申请号：US593020

申请日：1990-10-03

申请人： Yutaka Makino ,  Kazumi Ishimoto ,  Koichi Kumagai ,  Yasuo Izumi

发明人： Yutaka Makino ,  Kazumi Ishimoto ,  Koichi Kumagai ,  Yasuo Izumi

IPC分类号： H01L23/50 ,  H01L21/00 ,  H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H05K3/02

CPC分类号： H01L21/67132 ,  H01L23/49572 ,  H01L23/4985 ,  H05K3/027 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1532 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T428/24917

摘要： A film material for the manufacture of a film carrier has a lead pattern including an outer lead portion formed independent of the electrode arrangement of a semiconductor chip to be mounted on the film carrier, and an inner lead formation portion a part of which is selectively removable in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon, the inner lead formation portion being contiguous and connected to respective leads of the outer lead portion. A method for manufacturing the film carrier includes the steps of forming a conductive layer of material on a film; forming the lead pattern by etching part of the layer formed on the film into an outer lead portion having a pattern independent of the electrode arrangement of each semiconductor chip to be mounted thereon, and by leaving another part of the layer as it is to form an inner lead formation portion having a pattern which is changeable according to the electrode arrangement of the semiconductor chip to be mounted thereon; and selectively removing part of the inner lead formation portion by laser processing in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon.

摘要翻译： 用于制造薄膜载体的薄膜材料具有引线图案，其包括独立于要安装在薄膜载体上的半导体芯片的电极布置而形成的外部引线部分，以及内部引线形成部分，其一部分可选择性地移除 根据要安装在其上的半导体芯片的电极布置，内引线形成部分邻接并连接到外引线部分的相应引线。 制造薄膜载体的方法包括以下步骤：在薄膜上形成材料的导电层; 通过将形成在膜上的层的一部分蚀刻到具有独立于要安装在其上的每个半导体芯片的电极布置的图案的外引线部分中，并且通过使层的另一部分原样形成来形成引线图案 内引线形成部，其具有根据要安装在其上的半导体芯片的电极布置而可改变的图案; 并且根据要安装在其上的半导体芯片的电极布置，通过激光加工选择性地去除内部引线形成部分的一部分。

公开(公告)号：US5018936A

公开(公告)日：1991-05-28

申请号：US371973

申请日：1989-06-27

申请人： Yasuo Izumi ,  Kazumi Ishimoto ,  Yutaka Makino

发明人： Yasuo Izumi ,  Kazumi Ishimoto ,  Yutaka Makino

IPC分类号： H05K13/04

CPC分类号： H05K13/046 ,  H05K13/0417 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53191

摘要： An electronic parts engaging apparatus is equipped with a parts feed portion having a plurality of parts feed devices disposed to feed, for each type of part, parts having marks indicating their separate type. A suction nozzle is composed of a light transmitting material. A recognition device recognizes the parts through the suction nozzle. A memory stores the types of the parts of the respective parts feed devices in the parts feed portion. A control stores in the memory the types of the parts found through the recognition of the marks of the parts of the respective parts feed devices with the recognition device. A periodical washing operation has an effect in that the control operation is simplified.

公开(公告)号：US5017131A

公开(公告)日：1991-05-21

申请号：US545891

申请日：1990-06-29

申请人： Syoji Sato ,  Yutaka Makino ,  Kazumi Ishimoto ,  Yasuo Izumi

发明人： Syoji Sato ,  Yutaka Makino ,  Kazumi Ishimoto ,  Yasuo Izumi

IPC分类号： B23K1/008 ,  C23C2/28 ,  F27B9/02 ,  F27B9/04 ,  F27B9/24 ,  F27D3/00 ,  F27D7/04 ,  F27D19/00 ,  H05K3/34

CPC分类号： F27B9/24 ,  F27B9/028 ,  F27B9/04 ,  F27D2003/0061 ,  F27D2003/0087 ,  F27D2007/045 ,  F27D2019/0018

摘要： An atmosphere furnace including a plurality of divided furnace units, work transfer devices connecting the adjacent divided furnace units and those for the divided furnace units at both ends of the furnace. Each transfer device includes a tubular connecting frame and a work transfer member housed therein and the work transfer member has a work housing space in it. The work transfer member is rotatable, receives at a first position the work from outside or from an adjacent divided furnace unit into its work housing space, and send it out of the furnace or pass it to the adjacent divided furnace unit at a second position. When the work transfer member is at a middle position between the first and the second positions, the work housing space thereof faces an inner surface of the connecting frame so as to be sealed against the both end openings of the frame. Furthermore, it is provided with a channel for receiving the atmosphere from any divided furnace unit or outside space when the transfer member is at the middle position so as to have the work in the work housing space gradually heated or cooled through introduction of the atmosphere.

摘要翻译： 包括多个分割炉单元的气氛炉，连接相邻的分割炉单元的工件传送装置和炉两端的分割炉单元。 每个传送装置包括容纳在其中的管状连接框架和工件传送构件，并且工件传送构件在其中具有工作容纳空间。 工件传送构件是可旋转的，在第一位置将工件从外部或从相邻的分割炉单元接收到其工作容纳空间中，并将其从炉中送出或在第二位置将其传递到相邻的分割炉单元。 当工件传送构件处于第一位置和第二位置之间的中间位置时，其工作容纳空间面向连接框架的内表面，以便与框架的两端开口密封。 此外，当传送构件处于中间位置时，设置有用于从任何分开的炉单元或外部空间接收气氛的通道，以便通过引入气氛而使作业容纳空间中的工作逐渐加热或冷却。

公开(公告)号：US5003692A

公开(公告)日：1991-04-02

申请号：US524055

申请日：1990-05-16

申请人： Yasuo Izumi ,  Kazumi Ishimoto ,  Yutaka Makino

发明人： Yasuo Izumi ,  Kazumi Ishimoto ,  Yutaka Makino

IPC分类号： B23P21/00 ,  G06T1/00 ,  H05K13/04 ,  H05K13/08

CPC分类号： H05K13/0413 ,  H05K13/08 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53261

摘要： A component mounting method for successively mounting electric components on a printed circuit board, which method comprises the steps of recognizing the position of an electric component retained by a suction nozzle by the effect of a suction force; recognizing the predetermined mounting position on a printed circuit board or any other suitable substrate, at a location spaced a predetermined distance from the printed circuit board; mounting the electric component after the latter has been aligned with the predetermined mounting position on the printed circuit board; and recognizing, through the suction nozzle, the electric component to determine if the electric component has been mounted properly after the suction nozzle has been elevated to a position spaced a predetermined distance upwardly from the printed circuit board. In the event that the latter has been mounted incorrectly, information indicative of an incorrect mounting of the electric component is recorded in a control data.

摘要翻译： 一种用于在印刷电路板上连续安装电气部件的部件安装方法，该方法包括以下步骤：通过吸力来识别由吸嘴保持的电气部件的位置; 在与印刷电路板隔开预定距离的位置处识别印刷电路板或任何其它合适的基板上的预定安装位置; 在电气部件已经与印刷电路板上的预定安装位置对准之后安装电气部件; 并且通过吸嘴识别电气部件，以确定在吸嘴已经被升高到与印刷电路板之间向上隔开预定距离的位置之后电气部件是否已正确安装。 在后者安装不正确的情况下，表示电气部件安装不正确的信息被记录在控制数据中。

公开(公告)号：US5153707A

公开(公告)日：1992-10-06

申请号：US610046

申请日：1990-11-06

申请人： Yutaka Makino ,  Kazumi Ishimoto ,  Yasuo Izumi ,  Yuji Uesugi

发明人： Yutaka Makino ,  Kazumi Ishimoto ,  Yasuo Izumi ,  Yuji Uesugi

IPC分类号： H01L23/495 ,  H01L23/498 ,  H01L23/544 ,  H05K1/09 ,  H05K3/02

CPC分类号： H01L23/49572 ,  H01L23/4985 ,  H01L23/544 ,  H05K3/027 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/09

摘要： A film material for manufacturing film carriers and its manufacturing method wherein the film material common in all may be applied with respect to the various semiconductor chips which are different in the electrode layout, because the inner lead portions for bump connection use which are required to be changed each time the electrode layout of the semiconductor chip changes are not pattern formed, and are kept as the inner lead forming portion with the whole remaining covered with the conductive metallic layer, and, the manufacturing apparatus for etching mask and model and so on have only to be one in type.

摘要翻译： 用于制造薄膜载体的薄膜材料及其制造方法，其中可以相对于电极布局不同的各种半导体芯片，可以应用共同的薄膜材料，因为需要使用凸块连接用的内部引线部分 半导体芯片的电极布局每次改变都不会形成图案，并且保持为内部引线形成部分，整个仍然被导电金属层覆盖，并且用于蚀刻掩模和模型等的制造装置具有 只有一个在类型。

公开(公告)号：US5234105A

公开(公告)日：1993-08-10

申请号：US982041

申请日：1992-11-24

申请人： Syoji Sato ,  Yasuo Izumi ,  Kazumi Ishimoto ,  Yutaka Makino

发明人： Syoji Sato ,  Yasuo Izumi ,  Kazumi Ishimoto ,  Yutaka Makino

IPC分类号： B65B69/00 ,  B65D75/32 ,  B65D81/20 ,  B65D85/38 ,  H05K3/28

CPC分类号： H05K3/282 ,  B65B69/00 ,  B65D75/32 ,  B65D75/327 ,  B65D81/2023 ,  B65D81/2084 ,  B65D2575/3245 ,  B65D85/38

摘要： A package is used for keeping an electric circuit board with no electronic components provided thereon in an air-tight cavity thereof and for preventing from oxidation during the transportation to the process wherein the electronic components are mounted on the electric circuit board. The cavity is composed of the lower and upper sheet of gas-impermeable materials, which are bonded at the bonded area by the fusion bonding, adhesive agent or viscous agent. The cavity is kept in non-oxidizing atmosphere by filling inert gas or evacuating air therefrom. The lower and upper sheets are composed of single layer or multi-layers, which may be made of flexible material or rigid material. An electric circuit board accommodated in the cavity of the package is taken out by the device comprising a separation roller pair. The device weakens the bonding strength to enable easy pulling of the lower and upper sheets to unpackage the circuit board.

摘要翻译： 一种封装用于将其上没有设置有电子部件的电路板保持在其气密腔中，并且用于在运输到其中电子部件安装在电路板上的过程中防止氧化。 该空腔由不透气材料的下部和上部组成，它们通过熔融粘合剂，粘合剂或粘性剂粘合在粘合区域。 通过填充惰性气体或从其中排出空气将空腔保持在非氧化性气氛中。 下层和上层由单层或多层组成，其可以由柔性材料或刚性材料制成。 通过包括分离辊对的装置将容纳在包装体的空腔中的电路板取出。 该装置削弱了接合强度，以便容易地拉动下部和上部片材以将电路板打包。

公开(公告)号：US5113788A

公开(公告)日：1992-05-19

申请号：US571096

申请日：1990-08-21

申请人： Yasuo Izumi ,  Syoji Sato ,  Kazumi Ishimoto ,  Yutaka Makino ,  Shohzo Ueno

发明人： Yasuo Izumi ,  Syoji Sato ,  Kazumi Ishimoto ,  Yutaka Makino ,  Shohzo Ueno

IPC分类号： B41F15/08 ,  B41F15/26 ,  B41M1/12 ,  H05K1/02 ,  H05K3/12 ,  H05K3/40 ,  H05K13/04

CPC分类号： H05K3/4053 ,  B41F15/08 ,  H05K13/0469 ,  H05K3/1233 ,  H05K1/0269 ,  H05K2201/09981 ,  H05K2203/082 ,  H05K2203/163

摘要： A screen printing machine has a table on which a substrate is to be put, a substrate adjusting device on the table to adjust the position of the substrate on the table, a screen plate capable of being placed on the table, a squeegee movable on the plate, a suction unit connected with the table to apply suction to the substrate through through holes of the substrate, a measuring device arranged in the suction unit to measure the degree of vacuum in the suction unit, and an adjusting device arranged in the suction unit to adjust the degree of vacuum.

摘要翻译： 丝网印刷机具有要放置基板的工作台，工作台上的基板调节装置，用于调整工作台上的基板的位置，能够放置在工作台上的筛板，可在其上移动的刮板 板，与所述工作台连接的抽吸单元，以通过所述基板的通孔向所述基板施加吸力;布置在所述抽吸单元中以测量所述抽吸单元中的真空度的测量装置;以及布置在所述抽吸单元中的调节装置 调整真空度。

公开(公告)号：US5033783A

公开(公告)日：1991-07-23

申请号：US424367

申请日：1989-10-19

申请人： Yasuo Izumi ,  Kazumi Ishimoto ,  Yutaka Makino

发明人： Yasuo Izumi ,  Kazumi Ishimoto ,  Yutaka Makino

IPC分类号： B25J15/06 ,  B25J19/02 ,  H01L21/52 ,  H05K13/04 ,  H05K13/08

CPC分类号： B25J19/021 ,  B25J15/0616 ,  Y10S294/907 ,  Y10T29/53191

摘要： A parts mounting apparatus which picks up a part by using a suction nozzle provided in a mounting head and transports the part so as to mount the part at a predetermined position, has: a suction nozzle portion including a suction nozzle, a light transmitting plate and a suction cylinder assembled such that the suction nozzle, the light transmitting plate and the suction cylinder define a suction chamber; the suction nozzle is made of light transmitting material; the light transmitting plate is spaced a proper distance from the suction nozzle; and the suction nozzle, the light transmitting plate and the suction cylinder connected integrally with each other.

摘要翻译： 一种部件安装装置，其通过使用设置在安装头中的吸嘴来拾取部件并将部件运输以将部件安装在预定位置，具有：吸嘴部分，其包括吸嘴，透光板和 抽吸缸组装成使得吸嘴，透光板和抽吸缸限定吸入室; 吸嘴由透光材料制成; 透光板与吸嘴间隔适当的距离; 并且吸嘴，透光板和吸引筒彼此一体地连接。

公开(公告)号：US06371017B1

公开(公告)日：2002-04-16

申请号：US09708415

申请日：2000-11-09

申请人： Osamu Yamazaki ,  Kimihito Kuwabara ,  Kazumi Ishimoto ,  Toshiaki Yamauchi ,  Toshinori Mimura

发明人： Osamu Yamazaki ,  Kimihito Kuwabara ,  Kazumi Ishimoto ,  Toshiaki Yamauchi ,  Toshinori Mimura

IPC分类号： B41F1508

CPC分类号： B41F15/0813 ,  B41M1/12 ,  H05K3/1233 ,  H05K3/3484 ,  H05K2203/0783 ,  H05K2203/101 ,  H05K2203/1105

摘要： The temperature of a portion that belongs to a stencil and is located in the vicinity of a portion retaining a printing paste is increased to reduce the viscosity of printing paste that adheres to the portion retaining the printing paste, thereby allowing the printing paste to be easily separated from the retaining portion for the achievement of easy printing on an object on which a print is to be formed.

摘要翻译： 属于模版的位于保持印刷浆料的部分附近的部分的温度增加，以降低粘附到保持印刷浆料的部分的印刷浆料的粘度，从而允许印刷浆料容易 与保持部分分离，以便在要形成印刷品的物体上实现容易的印刷。

公开(公告)号：US5579981A

公开(公告)日：1996-12-03

申请号：US371776

申请日：1995-01-12

申请人： Nobuya Matsumura ,  Kazumi Ishimoto ,  Yoichi Nakamura ,  Kurayasu Hamasaki ,  Kimihito Kuwabara ,  Masahiro Taniguchi

发明人： Nobuya Matsumura ,  Kazumi Ishimoto ,  Yoichi Nakamura ,  Kurayasu Hamasaki ,  Kimihito Kuwabara ,  Masahiro Taniguchi

IPC分类号： H05K3/34 ,  B23K1/008 ,  B23K1/012

CPC分类号： B23K1/008 ,  B23K2201/42

摘要： A reflow apparatus includes a reflow furnace. A transfer device holds and transfers printed circuit boards with to-be-reflowed electronic components thereon from an inlet to an outlet of the furnace within the furnace. A plurality of adjusting/circulating sections separate an ambient gas for heating the printed circuit boards into predetermined temperature regions in the furnace in which the ambient gas is circulated in a heated state. A feed port is formed in the furnace to feed the ambient gas into the furnace under pressure. Residence parts each provided between adjacent adjusting/circulating sections regulate the amount of the ambient gas when the ambient gas, after having been sent to and heated in the adjusting/circulating section adjacent to the feed port, is circulated and sequentially moved to the adjusting/circulating sections at the inlet or the outlet and finally flows out through the inlet or outlet into atmosphere. Suction ports are open to the furnace to suck the ambient gas from the inside of the furnace. A flux removing unit is separate from the furnace and removes components of a flux from the ambient gas sucked through the suction ports from the inside of the furnace.

摘要翻译： 回流装置包括回流炉。 转移装置在炉内从炉内的入口到出口保持并转移其上具有待回流电子部件的印刷电路板。 多个调节/循环部分将用于将印刷电路板加热的环境气体分离成炉中的环境气体在加热状态下循环的预定温度区域。 在炉中形成进料口，以在压力下将环境气体进料到炉中。 每个设置在相邻的调节/循环部分之间的居间部分调节环境气体的量，当环境气体在已经被送​​入并在与进料口邻近的调节/循环部分中被加热并循环并顺序地移动到调节/ 在入口或出口处循环切片，最后通过入口或出口流入大气。 吸入口向炉内开放以从炉内吸入环境气体。 助熔剂去除单元与炉分离，并从炉内部从吸入口吸入的环境气体中除去助熔剂的组分。