摘要:
Semiconductor epitaxial wafers consisting of an epitaxial film and its substrate can be removed, in accordance with the present invention, from a substrate supporting component, without breaking the wafers into pieces after completion of vapor growth. The carbonaceous powder according to the present invention can greatly and effectively decrease the breaking of wafers, as compared with the conventional SiO.sub.2 or SiC-coated substrate supporting components.
摘要:
When the growth of a single crystalline III.sub.b -V.sub.b group compound is carried out employing the horizontal Bridgeman method or the gradient freeze method, it is likely that polycrystals will be grown, crystal defects will form, and the distribution of impurities will not be uniform, especially if the diameter of the single crystal is large. In the present invention, the cooling rate of the melt is controlled in an inconstant manner. Namely, crystal growth is interrupted at least once and/or the cooling rate at an earlier growth period is controlled at a high value. From 40 to 65% of the total melt crystallizes at the time when 30% of the total time required for growth has elapsed. The high yield of a single crystal is attained according to the present invention.
摘要:
An epitaxial wafer for producing arrays of GaAsP-LEDs comprises, in the GaAs.sub.1-x P.sub.x layer with varying X, a layer region(s) with a discontinuous variance of x along the thickness of the GaAs.sub.1-x P.sub.x layer. This layer region(s) contribute to a uniformity in the brightness of the light emission of LEDs formed in the epitaxial wafer.
摘要:
A method of manufacturing a mixed crystal compound semiconductor wafer suitable for the production of LED having a high light output. Upon a monocrystalline substrate of III-V semiconductor material a base layer is epitaxially grown of the same material as the substrate. An initial gradient layer is grown on the base layer having a mixed crystal ratio varying continuously from that of the base layer to a first value at a constant temperature. A combination sublayer is grown on the initial gradient sublayer which includes at least one constant sublayer having a constant crystal mixture ratio and at least one gradient sublayer having a crystal mixture ratio varying continuously between the mixed crystal ratios of its adjacent constant layers.
摘要:
A substrate for a high-intensity LED and the method of epitaxially growing the substrate according to the invention are based on the fact that, in using an AuZn alloy or the like as the ohmic electrode of the p-type Al.sub.x Ga.sub.1-x As layer (2), the higher the carrier concentration of this layer, the smaller the contact resistance and the lower the applied voltage (V.sub.F) necessary for passing a forward current of 10 mA. Joint use is made of gas-phase epitaxy and liquid-phase epitaxy. A layer having a carrier concentration three to five times that of an epitaxial layer formed by liquid-phase epitaxy (LPE) can be realized with excellent reproducibility by gas-phase epitaxy (MOCVD process, MBE process, etc.). By utilizing this p-type Al.sub.x Ga.sub.1-x As layer (2) as an electrode contact layer, contact resistance can be reduced and variance diminished.
摘要翻译:PCT No.PCT / JP88 / 00677 Sec。 371日期:1989年3月8日 102(e)日期1989年3月8日PCT Filed 1988年7月6日PCT Pub。 出版物WO89 / 00769 日本1989年1月26日。根据本发明的高强度LED用基板和外延生长基板的方法是基于以下事实:在使用AuZn合金等作为对位基板的欧姆电极的情况下, 类型的Al x Ga 1-x As层(2),该层的载流子浓度越高,接触电阻越小,通过10mA的正向电流所需的施加电压(VF)越低。 联合使用气相外延和液相外延。 可以通过气相外延(MOCVD工艺,MBE工艺等)以优异的再现性实现具有通过液相外延(LPE)形成的外延层的载流子浓度的三至五倍的层。 通过利用该p型Al x Ga 1-x As层(2)作为电极接触层,可以降低接触电阻,减少方差。
摘要:
Biaxially drawn polyamide films having an excellent levelness are prepared as follows. A substantially unoriented polyamide film is heated at 45.degree.-65.degree. C., and then drawn in the longitudinal direction at a deformation rate of at least 10,000%/min. and a draw ratio of 2.7-3.5 by a roll stretcher. The drawn film is immediately transferred to the lateral drawing position at 45.degree.-60.degree. C. within a time (t):t=e.sup.(3.9-0.053T.sbsp.1.sup.) where e=the base of natural logarithm and T.sub.1 =film temperature during this period of time (t), which is 45.degree.-60.degree. C. The thickness profile of the film at the starting position of lateral drawing is gradually reduced from the side and portions toward the central portion of the width so that the film thickness at the central portion is 75-90% of the film thickness at the side end portions. The film is drawn in the lateral direction at an average deformation rate of 2,000-10,000%/min. and a draw ratio of 3-5 by a tenter type stretcher in such a manner that, until the mechanically set draw ratio between respective tenter clips exceeds 1.4 times the original distance, the film is expanded at an angle of up to 6.degree. with respect to the travelling direction at a tenter clip temperature T.sub.2 (T.sub.2
摘要:
The reproducibility of Te doping in III-V group compounds is improved by using as the dopant a III-V group compound containing Te at a concentration of at least 1.times.10.sup.17 cm.sup.-3.
摘要翻译:通过使用浓度为至少1×10 17 cm -3的含有Te的III-V族化合物作为掺杂剂,III-V族化合物中Te掺杂的再现性得到改善。
摘要:
An epitaxial wafer of a compound semiconductor comprising a single crystalline semiconductor substrate consisting of GaP and an active layer consisting of GaAs.sub.1-x P.sub.x, having a mixed crystal ratio (x) in the range of from 0.5 to 1 is used for an LED. According to the present invention, between the single crystalline semiconductor substrate and the active layer, a light-absorbing layer consisting of GaAs.sub.1-x P.sub.x having the mixed crystal ratio (x) smaller than that of the active layer, is formed to suppress the reflection of light from the surface of the substrate.
摘要:
A method for producing a semiconductor device comprises the steps of: preparing a III.sub.b -V.sub.b group compound single crystalline semiconductor substrate produced by a liquid encapsulated Czochralski process, the single crystalline semiconductor substrate having a carbon concentration of 1.times.10.sup.15 cm.sup.-3 or less, implanting conductive impurity ions into the single crystalline semiconductor substrate and then annealing, and a semiconductor device produced by this method.
摘要翻译:一种制造半导体器件的方法包括以下步骤:制备通过液体封装的Czochralski工艺制备的IIIb -Vb族化合物单晶半导体衬底,该单晶半导体衬底的碳浓度为1×10 15 cm -3以下,注入导电 杂质离子进入单晶半导体衬底,然后退火,以及通过该方法制造的半导体器件。