Method for producing a single crystal of a III.sub.b -V.sub.b compound
    3.
    发明授权
    Method for producing a single crystal of a III.sub.b -V.sub.b compound 失效
    制备IIIb-Vb化合物的单晶的方法

    公开(公告)号:US4483736A

    公开(公告)日:1984-11-20

    申请号:US359204

    申请日:1982-03-18

    申请人: Fumio Orito

    发明人: Fumio Orito

    IPC分类号: C30B11/00 C30B13/32

    CPC分类号: C30B11/006 C30B11/003

    摘要: When the growth of a single crystalline III.sub.b -V.sub.b group compound is carried out employing the horizontal Bridgeman method or the gradient freeze method, it is likely that polycrystals will be grown, crystal defects will form, and the distribution of impurities will not be uniform, especially if the diameter of the single crystal is large. In the present invention, the cooling rate of the melt is controlled in an inconstant manner. Namely, crystal growth is interrupted at least once and/or the cooling rate at an earlier growth period is controlled at a high value. From 40 to 65% of the total melt crystallizes at the time when 30% of the total time required for growth has elapsed. The high yield of a single crystal is attained according to the present invention.

    摘要翻译: 当使用水平Bridgeman方法或梯度冷冻法进行单晶IIIb-Vb族化合物的生长时,可能生长多晶,晶体缺陷将形成,杂质分布不均匀, 特别是如果单晶的直径较大。 在本发明中,以不变的方式控制熔体的冷却速度。 即,晶体生长中断至少一次,和/或将较早生长期的冷却速度控制在高值。 总熔体的40%至65%在生长所需总时间的30%已经过去时结晶。 根据本发明获得单晶的高产率。

    Substrate for high-intensity led, and method of epitaxially growing same
    6.
    发明授权
    Substrate for high-intensity led, and method of epitaxially growing same 失效
    高强度基板,外延生长方法相同

    公开(公告)号:US4921817A

    公开(公告)日:1990-05-01

    申请号:US353652

    申请日:1989-03-08

    申请人: Masahiro Noguchi

    发明人: Masahiro Noguchi

    摘要: A substrate for a high-intensity LED and the method of epitaxially growing the substrate according to the invention are based on the fact that, in using an AuZn alloy or the like as the ohmic electrode of the p-type Al.sub.x Ga.sub.1-x As layer (2), the higher the carrier concentration of this layer, the smaller the contact resistance and the lower the applied voltage (V.sub.F) necessary for passing a forward current of 10 mA. Joint use is made of gas-phase epitaxy and liquid-phase epitaxy. A layer having a carrier concentration three to five times that of an epitaxial layer formed by liquid-phase epitaxy (LPE) can be realized with excellent reproducibility by gas-phase epitaxy (MOCVD process, MBE process, etc.). By utilizing this p-type Al.sub.x Ga.sub.1-x As layer (2) as an electrode contact layer, contact resistance can be reduced and variance diminished.

    摘要翻译: PCT No.PCT / JP88 / 00677 Sec。 371日期:1989年3月8日 102(e)日期1989年3月8日PCT Filed 1988年7月6日PCT Pub。 出版物WO89 / 00769 日本1989年1月26日。根据本发明的高强度LED用基板和外延生长基板的方法是基于以下事实:在使用AuZn合金等作为对位基板的欧姆电极的情况下, 类型的Al x Ga 1-x As层(2),该层的载流子浓度越高,接触电阻越小,通过10mA的正向电流所需的施加电压(VF)越低。 联合使用气相外延和液相外延。 可以通过气相外延(MOCVD工艺,MBE工艺等)以优异的再现性实现具有通过液相外延(LPE)形成的外延层的载流子浓度的三至五倍的层。 通过利用该p型Al x Ga 1-x As层(2)作为电极接触层,可以降低接触电阻,减少方差。

    Process for preparing biaxially drawn polyamide films
    7.
    发明授权
    Process for preparing biaxially drawn polyamide films 失效
    制备双轴拉伸聚酰胺薄膜的方法

    公开(公告)号:US4698195A

    公开(公告)日:1987-10-06

    申请号:US766632

    申请日:1985-08-16

    摘要: Biaxially drawn polyamide films having an excellent levelness are prepared as follows. A substantially unoriented polyamide film is heated at 45.degree.-65.degree. C., and then drawn in the longitudinal direction at a deformation rate of at least 10,000%/min. and a draw ratio of 2.7-3.5 by a roll stretcher. The drawn film is immediately transferred to the lateral drawing position at 45.degree.-60.degree. C. within a time (t):t=e.sup.(3.9-0.053T.sbsp.1.sup.) where e=the base of natural logarithm and T.sub.1 =film temperature during this period of time (t), which is 45.degree.-60.degree. C. The thickness profile of the film at the starting position of lateral drawing is gradually reduced from the side and portions toward the central portion of the width so that the film thickness at the central portion is 75-90% of the film thickness at the side end portions. The film is drawn in the lateral direction at an average deformation rate of 2,000-10,000%/min. and a draw ratio of 3-5 by a tenter type stretcher in such a manner that, until the mechanically set draw ratio between respective tenter clips exceeds 1.4 times the original distance, the film is expanded at an angle of up to 6.degree. with respect to the travelling direction at a tenter clip temperature T.sub.2 (T.sub.2

    摘要翻译: 如下制备具有优良水平度的双轴拉伸聚酰胺薄膜。 将基本上未取向的聚酰胺薄膜在45-65℃下加热,然后以至少10,000%/分钟的变形速率沿纵向拉伸。 拉伸倍数为2.7-3.5。 在t = e(3.9-0.053T1)的时间内(t),拉伸膜立即在45°-60℃转移到横向拉伸位置,其中e =自然对数的基底,T1 =膜的温度 时间(t),为45°-60℃。侧面起始位置处的膜的厚度分布从宽度的中心部分的侧面和部分逐渐减小,使得膜的厚度 中央部分是侧端部分的膜厚度的75-90%。 该膜以横向方向拉伸,平均变形率为2,000-10,000%/ min。 拉幅式拉伸机的拉伸比为3-5,直到各拉幅夹之间的机械设定拉伸倍数超过原始距离的1.4倍时,膜以6度的角度膨胀,相对于 在拉幅剪辑温度T2(T2

    Epitaxial wafer of compound semiconductor display device
    9.
    发明授权
    Epitaxial wafer of compound semiconductor display device 失效
    复合半导体显示装置的外延晶片

    公开(公告)号:US4510515A

    公开(公告)日:1985-04-09

    申请号:US578600

    申请日:1984-02-10

    CPC分类号: H01L33/025 H01L33/0025

    摘要: An epitaxial wafer of a compound semiconductor comprising a single crystalline semiconductor substrate consisting of GaP and an active layer consisting of GaAs.sub.1-x P.sub.x, having a mixed crystal ratio (x) in the range of from 0.5 to 1 is used for an LED. According to the present invention, between the single crystalline semiconductor substrate and the active layer, a light-absorbing layer consisting of GaAs.sub.1-x P.sub.x having the mixed crystal ratio (x) smaller than that of the active layer, is formed to suppress the reflection of light from the surface of the substrate.

    摘要翻译: 包括由GaP构成的单晶半导体衬底和由GaAs1-xPx组成的有源层的化合物半导体的外延晶片,其混晶比(x)为0.5〜1,用于LED。 根据本发明,在单晶半导体衬底和有源层之间形成由GaAs 1-xP x构成的具有比活性层小的混合晶体比(x)的光吸收层,以抑制反射 来自基板表面的光。