Silver Ink Composition and Substrate
    1.
    发明申请
    Silver Ink Composition and Substrate 有权
    银色墨水组成和基材

    公开(公告)号:US20130121872A1

    公开(公告)日:2013-05-16

    申请号:US13811840

    申请日:2011-07-27

    CPC classification number: C09D11/52 C09D11/037 C09D11/322

    Abstract: There is provided with a silver ink composition which is formed by blending one or more kinds of silver β-ketocarboxylates selected from the group consisting of silver isobutyrylacetate, silver benzoylacetate, silver propionylacetate, silver acetoacetate, silver α-methylacetoacetate, and silver α-ethylacetoacetate, and an aliphatic primary or secondary amine having 1 to 10 carbon atoms, and a substrate with a surface on which a metallic silver layer which is formed by heating the silver ink composition is provided. According to the invention, it is possible to obtain a silver ink composition suitable for forming a metallic silver layer which has superior glossiness and specularity, and a substrate with a surface on which a metallic silver layer is formed using the silver ink composition.

    Abstract translation: 提供了一种银墨水组合物,其通过将一种或多种选自异丁酰乙酸银,苯甲酰乙酸银,丙酰乙酸银,乙酰乙酸银,α-甲基乙酰乙酸银和α-乙酰乙酸乙酰乙酯银的β-酮羧酸银混合而形成 以及具有1-10个碳原子的脂族伯或仲胺,以及具有通过加热银墨组合物形成金属银层的表面的基材。 根据本发明,可以获得适于形成具有优异的光泽度和镜面反射性的金属银层的银墨组合物和使用银墨组合物形成金属银层的表面的基片。

    Silver ink composition and substrate
    5.
    发明授权
    Silver ink composition and substrate 有权
    银色墨水组成和基材

    公开(公告)号:US09328254B2

    公开(公告)日:2016-05-03

    申请号:US13811840

    申请日:2011-07-27

    CPC classification number: C09D11/52 C09D11/037 C09D11/322

    Abstract: There is provided with a silver ink composition which is formed by blending one or more kinds of silver β-ketocarboxylates selected from the group consisting of silver isobutyrylacetate, silver benzoylacetate, silver propionylacetate, silver acetoacetate, silver α-methylacetoacetate, and silver α-ethylacetoacetate, and an aliphatic primary or secondary amine having 1 to 10 carbon atoms, and a substrate with a surface on which a metallic silver layer which is formed by heating the silver ink composition is provided. According to the invention, it is possible to obtain a silver ink composition suitable for forming a metallic silver layer which has superior glossiness and specularity, and a substrate with a surface on which a metallic silver layer is formed using the silver ink composition.

    Abstract translation: 提供了一种银墨水组合物,其通过混合一种或多种选自异丁酰乙酸银,苯甲酰乙酸银,丙酰乙酸银,乙酰乙酸银,α-甲基乙酰乙酸银和α-甲基乙酰乙酸银的一种或多种银 - 乙酰乙酸乙酯和具有1-10个碳原子的脂族伯或仲胺,以及具有通过加热银墨组合物形成金属银层的表面的基材。 根据本发明,可以获得适于形成具有优异的光泽度和镜面反射性的金属银层的银墨组合物和使用银墨组合物形成金属银层的表面的基片。

    Silver Ink Composition
    6.
    发明申请
    Silver Ink Composition 有权
    银色墨水组成

    公开(公告)号:US20150008376A1

    公开(公告)日:2015-01-08

    申请号:US14371913

    申请日:2013-01-25

    CPC classification number: C09D11/52 C08K5/01 C08K5/05 C08K5/098 C08K5/17 C09D11/30

    Abstract: A silver ink composition which includes a silver carboxylate having a group represented by a formula —COOAg, an aliphatic primary amine or secondary amine having 2 to 10 carbon atoms, an acetylene alcohol represented by a general formula (2) shown below, and a hydrocarbon having 6 to 20 carbon atoms, and has a viscosity at 27° C. of 40 mPa·s or less, (In the formula, each of R′ and R″ independently represents an alkyl group having 1 to 20 carbon atoms or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.)

    Abstract translation: 一种银墨水组合物,其包含具有由式-COOAg表示的基团的羧酸银,具有2至10个碳原子的脂族伯胺或仲胺,由以下通式(2)表示的乙炔醇和烃 具有6〜20个碳原子,在27℃下的粘度为40mPa·s以下(式中,R'和R“各自独立地表示碳原子数1〜20的烷基或苯基 基团,其中一个或多个氢原子可以被取代基取代。)

    IC CARD AND MANUFACTURING METHOD THEREOF
    9.
    发明申请
    IC CARD AND MANUFACTURING METHOD THEREOF 审中-公开
    IC卡及其制造方法

    公开(公告)号:US20100059899A1

    公开(公告)日:2010-03-11

    申请号:US12447731

    申请日:2007-11-07

    Abstract: This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.

    Abstract translation: 该IC卡设置有具有入口的模块,覆盖模块的粘合剂层,以及插入粘合剂层的第一基材和夹着模块的第二基材。 模块设置在第一基材的一个表面上,插入粘性层,该粘性层的厚度根据模块的每个区域处的厚度而变化,并且当从外部观察时,其两端比其它部分窄 第一基材的表面侧或第二基材的外表面侧。 根据该IC卡,可以提供具有平坦表面的IC卡,并且在嵌入式IC芯片中不产生应变。

    Tape with Built-In Ic Chip, Production Method Thereof, and Sheet with Built-In Ic Chip
    10.
    发明申请
    Tape with Built-In Ic Chip, Production Method Thereof, and Sheet with Built-In Ic Chip 审中-公开
    带内置IC芯片的胶带,其制作方法和内置IC芯片的片材

    公开(公告)号:US20070259175A1

    公开(公告)日:2007-11-08

    申请号:US11575131

    申请日:2005-09-13

    CPC classification number: G06K19/07 G07D7/01 Y10T428/249921 Y10T428/2848

    Abstract: The present invention relates to a sheet with at least one built-in IC chip, the sheet being scarcely influenced by a mechanical external force and being free from loss or damage of the IC chip, and relates to a tape with at least one built-in IC chip used for the sheet with at least one built-in IC chip. The tape with at least one built-in IC chip is characterized in that a part or all of the IC chip 10 is embedded in a recessed portion 20a formed on a tape body, and the tape body 20 includes: a first base material 21; an adhesive layer 22 laminated on the first base material and formed of an adhesive; and a second base material 23 laminated on the adhesive layer; the second base material 23 being removed from the recessed portion 20a and the periphery thereof, and the adhesive in the recessed portion 20a of the adhesive layer 22 being pushed to the periphery thereof, and the pushed adhesive filling in a gap between the periphery of the IC chip 10 and the second base material 23.

    Abstract translation: 本发明涉及具有至少一个内置IC芯片的片材,该片材几乎不受机械外力的影响并且不会损失或损坏IC芯片,并且涉及具有至少一个内置IC芯片的带, 在IC芯片中用于具有至少一个内置IC芯片的片材。 具有至少一个内置IC芯片的带的特征在于,IC芯片10的一部分或全部嵌入形成在带体上的凹部20a中,带体20包括:第一基材21 ; 层压在第一基材上并由粘合剂形成的粘合剂层22; 和层叠在粘合剂层上的第二基材23; 第二基材23从凹部20a及其周边除去,粘合剂层22的凹部20a中的粘合剂被推到其周围,并且被挤压的粘合剂填充在周边 的IC芯片10和第二基材23。

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