公开(公告)号：US20240040704A1

公开(公告)日：2024-02-01

申请号：US18356419

申请日：2023-07-21

申请人： Via Mechanics, Ltd.

发明人： Yasushi ITO ,  Takumi OSANAI

IPC分类号： H05K3/00

CPC分类号： H05K3/007 ,  H05K3/0052 ,  H05K3/0029 ,  H05K3/4688

摘要： A purpose of the present invention is to provide a method of processing a substrate to improve a processing efficiency of the substrate. The method includes steps of: dividing a raw ceramic substrate into small substrates; annealing the divided small substrates; arraying the annealed small substrates; fixing the arrayed small substrates by using an organic member to form a large substrate; emitting laser beam to the arrayed small substrates in the large substrate to process a through hole; filling the through hole with a conductor; printing a wiring on the arrayed small substrates in the large substrate; stacking a new layer on front and back surfaces of the arrayed small substrates in the large substrate; and cutting the organic member of the large substrate to divide the large substrate into the small substrates.

公开(公告)号：US20210187667A1

公开(公告)日：2021-06-24

申请号：US17132987

申请日：2020-12-23

申请人： Via Mechanics, Ltd.

发明人： Yuki Saeki

IPC分类号： B23K26/382 ,  B23K26/00 ,  B23K26/04 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/082

摘要： A purpose of the present invention is to quickly change a focal point of a laser emission system so that processing with high quality and good processing efficiency can be performed. In a laser processing apparatus including: a laser oscillator configured to output a laser pulse; a laser polarizer configured to polarize the laser pulse in a two-dimensional direction; and a controller configured to control the laser oscillator and the laser polarizer, the laser processing apparatus being configured to emit the laser pulse to a workpiece for processing the workpiece, the laser processing apparatus has a feature in which an electrooptic device capable of, under control of the controller, electrically changing a focal point of the laser pulse to be input to the laser polarizer is arranged in an input side of the laser polarizer.

公开(公告)号：US20200004057A1

公开(公告)日：2020-01-02

申请号：US16447474

申请日：2019-06-20

申请人： Via Mechanics, Ltd.

发明人： Kazuya MATSUMOTO ,  Kazuo WATANABE ,  Atsushi SAKAMOTO ,  Masanori SATO ,  Mitsuru KATO ,  Masaru KIKUCHI

IPC分类号： G02F1/11 ,  H01S3/00 ,  H05K3/00 ,  B23K26/382

摘要： A laser processing apparatus disclosed in the present application includes: an optical deflection unit capable of changing a deflection direction of and outgoing energy of an incoming laser pulse by changes of a frequency of and an amplitude of a driving signal to be supplied; and a control unit configured to supply driving signals with amplitudes corresponding to respective frequencies. In a laser processing apparatus configured to process a workpiece by leading outgoing laser pulse of the optical deflection unit to the workpiece and irradiating the workpiece with the laser pulse, as the amplitude corresponding to each of the frequencies, the control unit supplies an amplitude having the ratio that is close to the lowest ratio among ratios of the outgoing energy with respect to the incoming energy of the laser pulse at an amplitude having the largest outgoing energy of the optical deflection unit.

公开(公告)号：US10086472B2

公开(公告)日：2018-10-02

申请号：US14262055

申请日：2014-04-25

申请人： Via Mechanics, Ltd.

发明人： Kentaro Yamagami ,  Tatsuya Nishibe ,  Takashi Sasaki

IPC分类号： B23K26/08 ,  B23K26/38 ,  B23K26/0622 ,  B23K26/364 ,  H05K3/00 ,  B23K103/00

摘要： A laser machining method for cutting or cutting grooves on a workpiece using an apparatus having an X-Y table for mounting the workpiece, a laser source emitting a continuous wave or a quasi-continuous wave laser beam, modulator forming a pulsed laser beam by a high-speed modulation of the continuous wave or quasi-continuous wave laser beam, and an optical system capable of converging the pulsed laser beam on the workpiece, wherein the method comprising cutting with the pulsed laser beams along a locus including a portion where the moving speed of the X-Y table is decreased, and the pitch of holes machined with said laser pulses is kept constant by adjusting the intervals between successive said laser pulses in accordance with the moving speed of said workpiece, the method further comprising increasing the pulse widths of the laser pulses in accordance with the decrease in moving speed of the X-Y table in the portion where the moving speed of the X-Y table is decreased.

公开(公告)号：US09030061B2

公开(公告)日：2015-05-12

申请号：US14296576

申请日：2014-06-05

申请人： Via Mechanics, Ltd.

发明人： Akihiro Yamamoto ,  Akira Doi ,  Daisuke Matsuka ,  Souichi Toyama ,  Hiroyuki Sugawara

IPC分类号： H02K33/00 ,  G02B26/08 ,  G02B26/10 ,  H02K1/27 ,  H02K26/00 ,  H02K21/14 ,  H02K21/12

CPC分类号： H02K33/00 ,  G02B26/105 ,  H02K1/276 ,  H02K1/2766 ,  H02K21/12 ,  H02K21/14 ,  H02K26/00 ,  H02K2213/03

摘要： A galvanoscanner including: a rotor including a shaft as a rotational center, and permanent magnets disposed around the shaft and polarized to a plurality of poles in a circumferential direction of the shaft; and a stator disposed in the outside of the rotor through a clearance and including coils, a yoke, and an outer casing so that the rotor swings in a predetermined angle range; wherein: the permanent magnets are provided with grooves which are formed in a direction of the rotation shaft so as to straddle circumferentially adjacent magnetic poles of the permanent magnets; and the permanent magnets are parted into at least two parts per pole by parting lines. Thus, the ratio of the torque constant to the moment of inertia can be improved so that the current required for driving can be reduced and reduction of power consumption at driving time can be attained.

公开(公告)号：US09008143B2

公开(公告)日：2015-04-14

申请号：US14470148

申请日：2014-08-27

申请人： Via Mechanics, Ltd.

发明人： Hideho Yamamura ,  Goichi Ohmae ,  Nobuyoshi Ohtani

IPC分类号： H01S3/22 ,  H01S3/032 ,  H01S3/07 ,  H01S3/036 ,  H01S3/097 ,  H01S3/134

CPC分类号： H01S3/032 ,  H01S3/03 ,  H01S3/0305 ,  H01S3/034 ,  H01S3/036 ,  H01S3/09705 ,  H01S3/134

摘要： The present invention aims to prevent, in a gas laser resonator, the deterioration in quality of discharge by reduction of the change of the pressure in a discharge chamber and the inflow of impurity gases, such as air, into the discharge chamber. A bracket 6 is attached to one end of a tube 1 interposing a gasket 13 only for sealing an opening of the discharge chamber 2 only and a gasket 14 for sealing both openings of the discharge chamber 2 and a buffer chamber 12. Also, a glass plate 8 and further a bracket 9 are attached to the other end of the tube 1 interposing a gasket 15 only for sealing the opening of the discharge chamber 2 and a gasket 16 for sealing both openings of the discharge chamber 2 and the buffer chamber 12. The pressure in the buffer chamber 12 is set lower than that of the discharge chamber 2 or set higher than the atmospheric pressure to decrease the inflow of the impurity gases to the discharge chamber 2.

摘要翻译： 本发明旨在通过减小放电室中的压力变化和诸如空气的杂质气体的流入而在气体激光谐振器中防止放电质量的劣化进入放电室。 托架6安装在插入垫圈13的管1的一端，仅用于密封排出室2的开口和用于密封排出室2和缓冲室12的两个开口的垫圈14。 板8和另外的支架9附接到管1的另一端，该管1插入仅用于密封排出室2的开口的垫圈15和用于密封排出室2和缓冲室12的两个开口的垫圈16。 缓冲室12中的压力被设定为低于排放室2的压力或设定为高于大气压，以减少杂质气体流入排放室2。

公开(公告)号：US08278594B2

公开(公告)日：2012-10-02

申请号：US12396584

申请日：2009-03-03

申请人： Kunio Arai ,  Hiroyuki Sugawara ,  Hiroaki Ashizawa ,  Hiromi Nishiyawa

发明人： Kunio Arai ,  Hiroyuki Sugawara ,  Hiroaki Ashizawa ,  Hiromi Nishiyawa

IPC分类号： B23K26/06 ,  B23K26/38

CPC分类号： H05K3/0038 ,  B23K26/03 ,  B23K26/032 ,  B23K26/06 ,  B23K26/082 ,  C23F4/02 ,  H01L21/31116 ,  H01L21/32131 ,  H05K3/0035 ,  H05K2203/163

摘要： A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.

摘要翻译： 提供了一种用于穿孔印刷电路板的方法和装置，从而可以提高处理效率和电路板致密化。 在测试处理中，用脉冲激光束4a照射导体层50i，脉冲激光束4a的能量密度设定为足够高的值来处理导体层50i，同时监视来自处理部分的发射23a。 因此，获得了在导体层50i中处理窗口所需的照射脉冲数。 用脉冲激光束5a照射绝缘层51i，脉冲激光束5a的能量密度设定为足够高的值来处理绝缘层51i但足够低，不能在绝缘层51i下方处理导体层50i + 1。 因此，获得了在绝缘层51i中处理窗口所需的照射脉冲数。 导体层50i用激光束4a照射所获得的照射脉冲数，绝缘层51i用激光束5a照射获得的照射脉冲数。 因此，在印刷电路板中处理孔。

公开(公告)号：US08151455B2

公开(公告)日：2012-04-10

申请号：US12143214

申请日：2008-06-20

申请人： Kazunori Hamada ,  Hiroshi Kawasaki ,  Tomoaki Ozaki

发明人： Kazunori Hamada ,  Hiroshi Kawasaki ,  Tomoaki Ozaki

IPC分类号： H05K3/02

CPC分类号： H05K3/0047 ,  H05K1/0237 ,  H05K1/0268 ,  H05K3/429 ,  H05K2203/0207 ,  H05K2203/0242 ,  Y10T29/49124 ,  Y10T29/49156 ,  Y10T29/49167

摘要： A method of manufacturing a printed circuit board is provided. The method includes preliminarily forming a plurality of test pattern layers for detecting the depth of an inner layer in a multilayer printed circuit board such that at least a part of a lower test pattern layer is not overlaid with any upper test pattern layer when viewed from a drill entrance side, and preliminarily forming a surface conductor layer; applying a voltage between the surface conductor layer and the test pattern layers; performing drilling toward one test pattern layer, and detecting a current produced when the drill comes into contact with the test pattern to measure the depth of the layer (D1); performing drilling toward the other test pattern layer, and measuring the depth of the layer (D2); and performing drilling up to just before the conductor-wiring layer based on a depth calculated from D1 and D2.

摘要翻译： 提供一种制造印刷电路板的方法。 该方法包括预先形成多个用于检测多层印刷电路板中的内层的深度的测试图案层，使得当从一个多层印刷电路板观察时，下部测试图案层的至少一部分不与任何上部测试图案层重叠 钻入口侧，并预先形成表面导体层; 在表面导体层和测试图案层之间施加电压; 对一个测试图案层执行钻孔，并且检测当钻头与测试图案接触时产生的电流以测量层（D1）的深度; 对另一测试图案层执行钻孔，并测量层的深度（D2）; 并且基于从D1和D2计算的深度，在导体布线层之前执行钻孔。

公开(公告)号：US20110136265A1

公开(公告)日：2011-06-09

申请号：US12962212

申请日：2010-12-07

申请人： Keigo SHIGENOBU ,  Hiroshi HONDA ,  Yasuhiko KANAYA

发明人： Keigo SHIGENOBU ,  Hiroshi HONDA ,  Yasuhiko KANAYA

IPC分类号： H01L21/66 ,  B23K26/00

CPC分类号： H01L31/208 ,  B23K26/364 ,  H01L31/0463 ,  Y02E10/50 ,  Y02P70/521

摘要： The present invention provides a method of manufacturing a thin-film solar panel with a laser scribing process to perform linear groove processing by irradiating a thin-film layer formed on a substrate with laser light to be separated from adjacent structure, including steps of: specifying an accurate position, size, shape of a adhered foreign matter on a glass substrate, a glass scratch, an air-bubble in the glass substrate causing an imperfection by inspecting a scribe line; and performing repair processing to form a new scribe line to bypass a portion of the imperfection after a final scribe line is formed.

摘要翻译： 本发明提供一种制造具有激光划线工艺的薄膜太阳能电池板的方法，通过用形成在衬底上的薄膜层进行线性沟槽处理，该激光与相邻结构分离，包括以下步骤：指定 在玻璃基板上的粘合异物的精确位置，尺寸，形状，玻璃刮痕，玻璃基板中的气泡，通过检查划线而导致不完美; 并且在形成最终划线之后进行修复处理以形成新的划线以绕过缺陷的一部分。

公开(公告)号：US07933675B2

公开(公告)日：2011-04-26

申请号：US12034317

申请日：2008-02-20

申请人： Yasunobu Ueno

发明人： Yasunobu Ueno

IPC分类号： G06F19/00 ,  B23K26/16 ,  B23K26/02 ,  B23K26/14

CPC分类号： B23K26/382 ,  B23K2101/42 ,  B23K2103/50 ,  H05K1/0266 ,  H05K3/0008 ,  H05K3/0026 ,  H05K2201/09063

摘要： A machining apparatus in which the machining efficiency can be improved even if characters are machined in a printed circuit board. A coordinate transformation unit is provided for transforming central coordinates of each dot d of each character of a character string into coordinates in a machining coordinate system with which the holes will be machined. Prior to machining, based on a character string and position information of the character string described in a machining program, central coordinates of each dot of each character of the character string are transformed into coordinates in the machining coordinate system with which the holes will be machined. Each dot d is regarded as a hole and machined. The number of times of movement of a table can be thus minimized so that the machining efficiency can be improved.

摘要翻译： 即使在印刷电路板中加工了字符，也能够提高加工效率的加工装置。 提供了一个坐标变换单元，用于将字符串的每个字符的每个点d的中心坐标转换成加工坐标系中加工孔的坐标。 在加工之前，基于加工程序中描述的字符串的字符串和位置信息，将字符串的每个字符的每个点的中心坐标转换成加工坐标系中的加工坐标系的坐标，其中将加工孔 。 每个点d被认为是一个孔并加工。 因此，能够使台的移动次数最小化，能够提高加工效率。