公开(公告)号：US08853312B2

公开(公告)日：2014-10-07

申请号：US13717009

申请日：2012-12-17

Applicant: Sumitomo Bakelite Co., Ltd.

Inventor： Hikaru Okubo ,  Nobuki Tanaka ,  Itaru Watanabe

IPC: C08K3/08 ,  C08L79/08 ,  H01L23/00 ,  C09J179/08 ,  C09J201/02 ,  C08G73/12 ,  C08F220/58 ,  C08K5/14 ,  C08K5/00 ,  C08K3/26 ,  C08F234/02

CPC classification number: C08F220/58 ,  C08F234/02 ,  C08G73/12 ,  C08K3/08 ,  C08K3/26 ,  C08K5/0025 ,  C08K5/14 ,  C08L79/085 ,  C09J179/08 ,  C09J201/025 ,  H01L23/145 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015

Abstract: A quick curing resin composition, which can be used in conventionally used ovens, and a semiconductor device, which is excellent in reliability such as solder crack resistance or the like when the resin composition, is used as a die attach material for semiconductor. The resin composition has a sufficient low stress property, good adhesion and excellent bleeding property. The resin composition includes a filler (A), compound (B) having the structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.

Abstract translation: 可用于常规使用的烘箱中的快速固化树脂组合物和当树脂组合物用作半导体的芯片附着材料时，其耐焊料裂纹等的可靠性优异的半导体器件。 该树脂组合物具有足够的低应力性，良好的粘附性和优异的渗出性。 树脂组合物包括具有由式（1）表示的结构的化合物（B）和由式（2）表示的官能团和热自由基引发剂（C）的填料（A），化合物（B），并且基本上不含有照片 聚合引发剂。

公开(公告)号：US06777090B2

公开(公告)日：2004-08-17

申请号：US10130934

申请日：2002-06-19

Applicant: Hubert Baumgart ,  Uwe Meisenburg ,  Heinz-Peter Rink ,  Paul J. Harris ,  Reinhold Schwalm

Inventor： Hubert Baumgart ,  Uwe Meisenburg ,  Heinz-Peter Rink ,  Paul J. Harris ,  Reinhold Schwalm

IPC: B32B3126

CPC classification number: C09D201/025 ,  C08G18/3831 ,  C08G18/672 ,  C09J201/025 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31938

Abstract: Composition curable thermally and with actinic radiation (dual-cure composition) comprising A) at least one constituent containing on average per molecule at least one primary or secondary carbamate group and at least one bond which can be activated with actinic radiation and preparable by from polyfunctional compounds containing at least two isocyanate-reactive, acid-reactive or epoxide-reactive functional groups and suitable monoisocyanates, monoacids or monoepoxides or from polyisocyanates, polyacids or polyepoxides and suitable compounds which contain an isocyanate-reactive, acid-reactive or epoxide-reactive functional group; and B) at least one constituent containing on average per molecule at least one carbamate-reactive functional group and also, where appropriate, at least one bond which can be activated with actinic radiation; and its use as adhesive, sealing compound and coating material.

Abstract translation: 包含可热固化和与光化辐射（双重固化组合物）组合的组合物，其包含：A）每分子平均含有至少一个伯或仲氨基甲酸酯基团和至少一个可以用光化辐射活化并可由多官能化合物制备的键的至少一种成分 含有至少两种异氰酸酯反应性，酸反应性或环氧化物反应性官能团和合适的单异氰酸酯，单酸或单环氧化物或由多异氰酸酯，多元酸或聚环氧化物和含有异氰酸酯反应性，酸反应性或环氧化物反应性官能团的合适化合物 ; 和B）每分子平均含有至少一个氨基甲酸酯反应性官能团的至少一种组分，并且在适当的情况下还可以使用至少一种可用光化辐射活化的键;以及其用作粘合剂，密封剂和涂料。

公开(公告)号：US20170247581A1

公开(公告)日：2017-08-31

申请号：US15507354

申请日：2015-09-01

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ying Zhang ,  Albert I. Everaerts ,  Dong-Wei Zhu ,  Ross E. Behling ,  Gregg A. Caldwell

IPC: C09J11/06 ,  C09J5/00 ,  H01B1/02 ,  C09D133/08

CPC classification number: C09J11/06 ,  C08K5/07 ,  C08K5/3435 ,  C08K5/3475 ,  C09D133/08 ,  C09J5/00 ,  C09J201/00 ,  C09J201/025 ,  C09J2433/00 ,  H01B1/02 ,  H01B1/026

Abstract: The present invention is an adhesive composition for stabilizing an electrical conductor. The adhesive composition includes a base polymer and an additive for absorbing UV light, such as a benzotriazole or a benzophenone. When the adhesive composition is in contact with the electrical conductor, the electrical conductor has less than about a 20% change in electrical resistance over a period of about 500 hours.

公开(公告)号：US20150315434A1

公开(公告)日：2015-11-05

申请号：US14646445

申请日：2013-11-21

Applicant: NANYANG TECHNOLOGICAL UNIVERSITY

Inventor： W. J. Terry STEELE ,  Vladislav PAPPER ,  Robert S. MARKS

IPC: C09J167/04 ,  C08K9/04 ,  A61N5/06 ,  C09J105/04 ,  A61L24/04 ,  C09J189/00 ,  C08K9/02

CPC classification number: C09J167/04 ,  A61K9/0014 ,  A61K9/0024 ,  A61K31/715 ,  A61K31/734 ,  A61K33/00 ,  A61K45/06 ,  A61L24/001 ,  A61L24/0031 ,  A61L24/046 ,  A61L2430/34 ,  A61N5/062 ,  C08B11/08 ,  C08B15/00 ,  C08B31/00 ,  C08B33/00 ,  C08B35/00 ,  C08B37/00 ,  C08B37/0021 ,  C08B37/003 ,  C08B37/0057 ,  C08B37/0072 ,  C08B37/0075 ,  C08B37/0084 ,  C08G63/6852 ,  C08H1/06 ,  C08J5/128 ,  C08J2300/16 ,  C08J2367/04 ,  C08J2389/00 ,  C08J2400/106 ,  C08K9/02 ,  C08K9/04 ,  C08L2205/16 ,  C09J101/08 ,  C09J101/284 ,  C09J103/04 ,  C09J103/14 ,  C09J105/00 ,  C09J105/02 ,  C09J105/04 ,  C09J105/08 ,  C09J105/10 ,  C09J189/00 ,  C09J189/06 ,  C09J201/025 ,  C08L79/00 ,  A61K2300/00

Abstract: A novel diazirine-based biocompatible polymer that can be used as on-demand or tunable bioadhesive and applied across various clinically important surfaces. The biocompatible polymer comprises a single strand of repeating units and up to 5,000 photoreactive diazirine groups covalently attached to it. A bioadhesive composition comprises the polymer of the present invention and suitable solvents, surfactants, stabilizers, fillers and other additives. The composition may additionally contain metallic particles of size less than 50 micron made of rare earth elements and has UV or NIR transparency less than 1 optical density unit per 1 centimetre. The poly-diazirine surface grafted thin films can be used for minimally invasive surgeries.

Abstract translation: 一种新的基于二氮丙啶的生物相容性聚合物，可用作按需或可调式生物粘合剂，并应用于各种临床上重要的表面。 生物相容性聚合物包含单链重复单元和多达5,000个共价连接到其上的光反应性二氮丙啶基团。 生物粘合剂组合物包含本发明的聚合物和合适的溶剂，表面活性剂，稳定剂，填料和其它添加剂。 该组合物可另外含有尺寸小于50微米的由稀土元素制成的金属颗粒，并且每1厘米具有小于1个光密度单位的UV或NIR透明度。 聚二氮嗪表面接枝薄膜可用于微创手术。

公开(公告)号：US20140141255A1

公开(公告)日：2014-05-22

申请号：US14164867

申请日：2014-01-27

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Mitsuru KANO ,  JIN SATO ,  TOSHIAKI YOSHIHARA ,  MASATO KON

IPC: C23C16/40 ,  C23C16/02

CPC classification number: C23C16/403 ,  B05D3/007 ,  B05D3/107 ,  B05D3/141 ,  B05D3/145 ,  B05D3/148 ,  B32B7/04 ,  C08K3/01 ,  C08K3/013 ,  C09J201/02 ,  C09J201/025 ,  C09J201/06 ,  C09J201/08 ,  C09J2400/10 ,  C09J2400/22 ,  C23C16/02 ,  C23C16/0227 ,  C23C16/0245 ,  C23C16/0272 ,  C23C16/04 ,  C23C16/405 ,  C23C16/44 ,  C23C16/455 ,  C23C16/45525 ,  C23C16/45555 ,  C23C28/00 ,  C23C28/042 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31562 ,  Y10T428/31721 ,  Y10T428/31757

Abstract: A laminate body includes a base material, a film-like or a membrane-like undercoat layer that is formed in at least a portion of the outer surface of the base material, and an atomic layer deposition film that is formed on a surface opposite to a surface coming into contact with the base material among both surfaces of the undercoat layer in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film bind to the undercoat layer, and the atomic layer deposition film is formed into a membrane shape covering the undercoat layer.

Abstract translation: 层压体包括形成在基材的外表面的至少一部分中的基材，膜状或膜状底涂层，以及形成在与基材的相反侧的表面上的原子层沉积膜 在底涂层的厚度方向的两面中与基材接触的表面。 原子层沉积膜的前体的至少一部分与底涂层结合，原子层沉积膜形成为覆盖底涂层的膜状。

公开(公告)号：US20180016481A1

公开(公告)日：2018-01-18

申请号：US15545786

申请日：2016-12-27

Applicant: NITTO DENKO CORPORATION ,  NITTO, Inc.

Inventor： Yoshio TERADA ,  Kyle Robert BARNES ,  Midori SEGAWA

IPC: C09J201/06 ,  C09J7/02 ,  C09J133/00 ,  C09J201/02

CPC classification number: C09J201/06 ,  C01B32/20 ,  C01B32/21 ,  C09J7/20 ,  C09J7/385 ,  C09J7/40 ,  C09J133/00 ,  C09J133/04 ,  C09J201/00 ,  C09J201/025 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2400/10

Abstract: Provided are a graphite pressure-sensitive adhesive tape that is suitable for improving thermal efficiency; and a graphite pressure-sensitive adhesive tape with a release liner, which contains the pressure-sensitive adhesive tape. This graphite pressure-sensitive adhesive tape with a release liner is provided with a graphite pressure-sensitive adhesive tape, which has a first pressure-sensitive adhesive layer and a graphite layer in this order, and a release liner that protects the surface of the first pressure-sensitive adhesive layer. The first pressure-sensitive adhesive layer has a single layer structure.

公开(公告)号：US09834639B2

公开(公告)日：2017-12-05

申请号：US14232702

申请日：2012-08-24

Applicant: Urs Burckhardt ,  Steffen Kelch ,  Ulrich Wolf

Inventor： Urs Burckhardt ,  Steffen Kelch ,  Ulrich Wolf

IPC: C09J175/04 ,  C09J163/00 ,  C09J183/00 ,  C08G18/00 ,  C08G18/10 ,  C08G18/83 ,  C08G59/02 ,  C08G59/40 ,  C09D175/04 ,  C09D163/00 ,  C09D183/00 ,  C09K3/10 ,  C09D201/10 ,  C09J201/10 ,  C09D201/02 ,  C09J201/02 ,  C09J183/04 ,  C08L83/06 ,  C08G59/36 ,  C08L75/04 ,  C08L63/00 ,  C08L75/00 ,  C08L83/00

CPC classification number: C08G59/02 ,  C08G18/10 ,  C08G18/831 ,  C08G59/36 ,  C08L63/00 ,  C08L75/00 ,  C08L75/04 ,  C08L83/00 ,  C08L83/06 ,  C09D163/00 ,  C09D175/04 ,  C09D201/025 ,  C09D201/10 ,  C09J163/00 ,  C09J175/04 ,  C09J183/04 ,  C09J201/025 ,  C09J201/10 ,  C08G18/307

Abstract: The present invention relates to a curing agent for moisture-curing compositions which includes at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated curing of moisture-curing compositions which are based on polyurethane polymers that have isocyanate groups or of silane-functional polymers.

公开(公告)号：US09574266B2

公开(公告)日：2017-02-21

申请号：US14164867

申请日：2014-01-27

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Mitsuru Kano ,  Jin Sato ,  Toshiaki Yoshihara ,  Masato Kon

IPC: C23C16/02 ,  C23C16/04 ,  C23C16/44 ,  C23C16/455 ,  C08K3/00 ,  C09J201/02 ,  C09J201/06 ,  C09J201/08 ,  B05D3/14 ,  B05D3/10 ,  B32B7/04 ,  C23C16/40 ,  C23C28/04 ,  C23C28/00 ,  B05D3/00

CPC classification number: C23C16/403 ,  B05D3/007 ,  B05D3/107 ,  B05D3/141 ,  B05D3/145 ,  B05D3/148 ,  B32B7/04 ,  C08K3/01 ,  C08K3/013 ,  C09J201/02 ,  C09J201/025 ,  C09J201/06 ,  C09J201/08 ,  C09J2400/10 ,  C09J2400/22 ,  C23C16/02 ,  C23C16/0227 ,  C23C16/0245 ,  C23C16/0272 ,  C23C16/04 ,  C23C16/405 ,  C23C16/44 ,  C23C16/455 ,  C23C16/45525 ,  C23C16/45555 ,  C23C28/00 ,  C23C28/042 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31562 ,  Y10T428/31721 ,  Y10T428/31757

Abstract: A laminate body includes a base material, a film-like or a membrane-like undercoat layer that is formed in at least a portion of the outer surface of the base material, and an atomic layer deposition film that is formed on a surface opposite to a surface coming into contact with the base material among both surfaces of the undercoat layer in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film bind to the undercoat layer, and the atomic layer deposition film is formed into a membrane shape covering the undercoat layer.

Abstract translation: 层压体包括形成在基材的外表面的至少一部分中的基材，膜状或膜状底涂层，以及形成在与基材的相反侧的表面上的原子层沉积膜 在底涂层的厚度方向的两面中与基材接触的表面。 原子层沉积膜的前体的至少一部分与底涂层结合，原子层沉积膜形成为覆盖底涂层的膜状。

公开(公告)号：US08088308B2

公开(公告)日：2012-01-03

申请号：US10593137

申请日：2005-03-16

Applicant: Hikaru Okubo ,  Nobuki Tanaka ,  Itaru Watanabe

Inventor： Hikaru Okubo ,  Nobuki Tanaka ,  Itaru Watanabe

IPC: H01B1/22 ,  C08K3/08 ,  C08F2/44 ,  C08F22/40

CPC classification number: C08F220/58 ,  C08F234/02 ,  C08G73/12 ,  C08K3/08 ,  C08K3/26 ,  C08K5/0025 ,  C08K5/14 ,  C08L79/085 ,  C09J179/08 ,  C09J201/025 ,  H01L23/145 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015

Abstract: A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property. A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (I) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.

Abstract translation: 用于快速固化并可用于常规使用的烘箱中的固化的树脂组合物，以及当树脂组合物用作半导体芯片附着材料时，具有优异的可焊性抗裂性等可靠性的半导体器件 。 进一步优选具有足够的低应力性，良好的粘合性和优异的渗出性的树脂组合物。 一种树脂组合物，其包含填料（A），包含由式（I）表示的结构的化合物（B）和由式（2）表示的官能团和热自由基引发剂（C），并且基本上不含 光聚合引发剂。

公开(公告)号：US20230323005A1

公开(公告)日：2023-10-12

申请号：US18022393

申请日：2021-08-20

Applicant: NISSHINBO CHEMICAL INC.

Inventor： Nami TSUKAMOTO ,  Naoki NISHIKAWA

IPC: C08G18/02 ,  C08G18/79 ,  C08L79/08 ,  C09D5/02 ,  C09D11/102 ,  C09J11/06 ,  C09J201/02

CPC classification number: C08G18/025 ,  C08G18/797 ,  C08L79/08 ,  C09D5/022 ,  C09D11/102 ,  C09J11/06 ,  C09J201/025

Abstract: A waterborne resin crosslinking agent is provided, wherein the waterborne resin crosslinking agent of the present invention includes a polycarbodiimide compound (A) and a polycarbodiimide compound (B); the polycarbodiimide compound (A) has a structure in which the isocyanate groups at both terminals are each capped with a predetermined hydrophilic organic compound; the polycarbodiimide compound (B) has a chain diisocyanate compound as a structural unit, and has a structure in which the isocyanate groups at both terminals are each capped with a predetermined organic compound, and the polycarbodiimide compound (A) is in an amount of 5 to 90 parts by mass per 100 parts by mass in total of the polycarbodiimide compounds (A) and (B).