公开(公告)号：US20160247608A1

公开(公告)日：2016-08-25

申请号：US15021502

申请日：2014-08-28

Applicant: SUNAM CO., LTD.

Inventor： Kyu Han CHOI ,  Seung Hyun MOON ,  Soon Chul HWANG ,  Hun Ju LEE ,  Cheol Yeong JANG ,  Woong KWON

IPC: H01B12/06 ,  C23C28/00 ,  C23C2/10 ,  C23C2/08 ,  C23C14/08 ,  C23C14/14

CPC classification number: H01B12/06 ,  C23C2/08 ,  C23C2/10 ,  C23C14/08 ,  C23C14/081 ,  C23C14/088 ,  C23C14/14 ,  C23C28/321 ,  C23C28/3455 ,  H01L39/143 ,  H01L39/247

Abstract: The present invention relates to a superconductor and a method of manufacturing the same. The superconductor comprises: a substrate having a tape shape that extends in a first direction and having surfaces which are defined as a top surface, a bottom surface, and both side surfaces; a superconductive layer positioned on the top surface of the substrate; a first stabilizing layer disposed on the superconductive layer and containing a first metal; a protective layer disposed on the first stabilizing layer and containing a second metal which is different from the first metal; and an first alloy layer disposed between the stabilizing layer and the protective layer and containing the first and second metals.

Abstract translation: 超导体及其制造方法技术领域本发明涉及超导体及其制造方法。 超导体包括：具有沿第一方向延伸并且具有被定义为顶表面，底表面和两个侧表面的表面的带状的基底; 位于所述基板的顶表面上的超导层; 第一稳定层，设置在超导层上并含有第一金属; 保护层，设置在所述第一稳定层上并且包含不同于所述第一金属的第二金属; 以及设置在所述稳定层和所述保护层之间并且包含所述第一和第二金属的第一合金层。

公开(公告)号：US20160204474A1

公开(公告)日：2016-07-14

申请号：US14912871

申请日：2014-08-15

Applicant: SASIT INDUSTRIETECHNIK GMBH

Inventor： Andre FRIEDENBERGER ,  Jochen MEIER

IPC: H01M10/12 ,  C23C2/10

CPC classification number: H01M10/128 ,  C23C2/10 ,  H01M2/28 ,  H01M10/0404 ,  H01M10/14 ,  H01M10/16 ,  H01M2220/20

Abstract: An installation for producing batteries is disclosed, having a lead bath station with two heatable and mobile lead bath carriages arranged in an assignable manner at the stationary lead melting pot. Both carriages having a pumping-sucking device that serves for the changing of the lead bath. Molten lead is pumped out of the lead pot into an empty carriage. Both the pumping-sucking devices are arranged pivotably about the axis of rotation (B) and the pivot pin that is fixedly arranged on the carriage is arranged such that it can be separately pivoted about the axis of rotation (A), thus, making it possible for the suction tube and a discharge tube to be moved between the carriage and the led pot.

Abstract translation: 公开了一种用于生产电池的装置，其具有带有两个可加热和移动的铅浴槽的铅浴台，其中可移动的铅浴槽以可分配的方式设置在固定铅熔炉中。 两个滑架具有用于更换铅浴的抽吸装置。 熔化的铅被从铅锅中抽出来，进入一个空的托架。 两个抽吸装置都围绕旋转轴线（B）可枢转地布置，并且固定地布置在滑架上的枢轴销布置成使得它可以围绕旋转轴线（A）分开枢转，从而使其 可能的吸管和放电管在托架和引导的锅之间移动。

公开(公告)号：US20150174678A1

公开(公告)日：2015-06-25

申请号：US14407040

申请日：2013-06-10

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Isamu Sato ,  Koji Watanabe ,  Kota Kikuchi ,  Michio Suzuki ,  Naoto Kameda ,  Hideki Nakamura

IPC: B23K3/06 ,  C23C2/36 ,  C23C2/00 ,  C23C2/16 ,  B23K1/20 ,  C23C2/04

CPC classification number: B23K3/0676 ,  B23K1/012 ,  B23K1/08 ,  B23K1/20 ,  B23K31/02 ,  C23C2/003 ,  C23C2/04 ,  C23C2/10 ,  C23C2/16 ,  C23C2/20 ,  C23C2/36 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K3/3468 ,  H05K2203/044 ,  H05K2203/1545 ,  Y10T428/12701 ,  H01L2924/00

Abstract: A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few μm and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG. 1, this apparatus comprises a solder bath 17 of accommodating the molten solder 7; a second conveying section 23 for drawing up a strip member 31 from the solder bath; and a blower section 19 for blowing hot gas on the strip member 31 immediately after being drawn up from the solder bath by a second conveying section 23; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder 7. According to this configuration, the excess molten solder 7 can be trimmed from the strip member 31 corresponding to composition of the molten solder 7. Thus, the film thickness of the molten solder 7 coated on the strip member 31 can be controlled evenly and in increments of a few μm.

Abstract translation: 用于电镀薄熔融焊料膜的热浸镀装置可以均匀地以几μm的增量控制基材上的熔融焊料的膜厚度，并且实现薄膜焊接电镀，其膜厚度小于常规 系统。 如图所示。 如图1所示，该装置包括容纳熔融焊料7的焊料槽17; 用于从焊料槽中拉出带状部件31的第二输送部23; 以及用于通过第二输送部23从焊料槽吸引之后，立即在带状部件31上吹出热气体的送风部19; 热气体具有预定的流动体积和等于或高于熔融焊料7的熔融温度的预定温度。根据该构造，可以从带状部件31对多余的熔融焊料7进行修整，对应于熔融 因此，可以均匀地以几μm的增量控制涂覆在带状部件31上的熔融焊料7的膜厚。

公开(公告)号：US20150050418A1

公开(公告)日：2015-02-19

申请号：US14302677

申请日：2014-06-12

Applicant: Mathew GREER ,  Robert GRAY

Inventor： Mathew GREER ,  Robert GRAY

IPC: H05K3/12 ,  H05K3/00

CPC classification number: H05K3/1216 ,  B05D1/26 ,  B23K1/0016 ,  B23K3/0638 ,  B23K2101/42 ,  C23C2/006 ,  C23C2/08 ,  C23C2/10 ,  H05K3/0091 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/163

Abstract: It is described a method for changing parameters for controlling a transfer of solder paste onto a printed circuit board (150, 250). The described method comprises (a) identifying first subareas (256, 258) of the printed circuit board (150, 250), which exhibit a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), (b) identifying second subareas (252, 254) of the printed circuit board (150, 250), which exhibit a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), wherein the first repeatability is smaller than the second repeatability, (c) transferring solder paste onto the printed circuit board (150, 250) at least at the second subareas (252, 254) of the printed circuit board (150, 250), (d) measuring the amount of solder paste which has been transferred to the second subareas (252, 254), and (e) changing the parameters for controlling a transfer of solder paste onto the printed circuit board (150, 250) in response to the measured amount of solder paste which has been transferred to the second subareas (252, 254). It is further described a corresponding processing device, a system comprising such a processing device and a computer program for controlling and/or for carrying out such a method.

Abstract translation: 描述了一种用于改变用于控制焊膏转移到印刷电路板（150,250）上的参数的方法。 所描述的方法包括（a）识别印刷电路板（150,250）的第一子区域（256,258），其相对于假定要传送到印刷电路板上的焊膏的量显示出第一可重复性（ 150,250），（b）识别印刷电路板（150,250）的第二子区域（252,254），其相对于假定要传送到印刷电路板上的焊膏的量显示出第二可重复性 （150,250），其中所述第一重复性小于所述第二重复性，（c）至少在所述印刷电路板的所述第二子区（252,254）处将焊膏转移到所述印刷电路板（150,250）上 （d）测量已经转移到第二子区（252,254）的焊膏的量，以及（e）改变用于控制焊膏向印刷电路板（150,250）的转移的参数， 250）响应于测量的溶胶量 已经转移到第二子区（252,254）的糊状物。 进一步描述相应的处理装置，包括这种处理装置的系统和用于控制和/或执行这种方法的计算机程序。

公开(公告)号：US08828485B2

公开(公告)日：2014-09-09

申请号：US13249558

申请日：2011-09-30

Applicant: Kun Lian ,  Qinglin Wu

Inventor： Kun Lian ,  Qinglin Wu

IPC: B05D3/12 ,  B05D7/22 ,  B32B5/16 ,  B01J13/02 ,  B27K3/00 ,  B27K3/32 ,  A01N59/16 ,  B27K3/16 ,  A01N59/20 ,  A01N25/28 ,  A01N25/26 ,  B27K3/52

CPC classification number: C09K15/02 ,  A01N25/26 ,  A01N25/28 ,  A01N59/16 ,  A01N59/20 ,  B01D53/9413 ,  B01D2255/1021 ,  B01D2255/1023 ,  B01D2255/9202 ,  B01J13/02 ,  B01J21/18 ,  B01J23/10 ,  B01J23/42 ,  B01J23/44 ,  B01J23/50 ,  B01J23/72 ,  B01J23/755 ,  B01J23/8926 ,  B01J33/00 ,  B01J35/0006 ,  B01J35/0013 ,  B01J37/0201 ,  B01J37/084 ,  B01J37/088 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/0074 ,  B22F1/0085 ,  B22F1/02 ,  B27K3/007 ,  B27K3/16 ,  B27K3/22 ,  B27K3/32 ,  B27K3/52 ,  B27K2200/10 ,  B27K2200/30 ,  B27K2240/20 ,  B82Y30/00 ,  B82Y40/00 ,  C01P2004/64 ,  C01P2004/80 ,  C08J5/005 ,  C08J5/045 ,  C08J2323/06 ,  C08J2497/02 ,  C09C1/627 ,  C09C3/066 ,  C23C2/04 ,  C23C2/06 ,  C23C2/08 ,  C23C2/10 ,  C23C2/12 ,  C23C2/26 ,  C23C2/28 ,  C23C2/34 ,  H01M4/8626 ,  H01M4/921 ,  Y10S977/773 ,  Y10S977/896 ,  Y10T428/24479 ,  Y10T428/256 ,  Y10T428/2989 ,  Y10T428/2991 ,  Y10T428/2998 ,  Y10T428/662

Abstract: We disclose novel metallic nanoparticles coated with a thin protective carbon shell, and three-dimensional nano-metallic sponges; methods of preparation of the nanoparticles; and uses for these novel materials, including wood preservation, strengthening of polymer and fiber/polymer building materials, and catalysis.

Abstract translation: 我们公开了涂覆有薄保护性碳壳和三维纳米金属海绵的新型金属纳米粒子; 制备纳米颗粒的方法; 并用于这些新型材料，包括木材保存，聚合物和纤维/聚合物建筑材料的强化和催化。

公开(公告)号：US4372995A

公开(公告)日：1983-02-08

申请号：US271128

申请日：1981-06-08

Applicant: John J. Rausch ,  Ray J. Van Thyne

Inventor： John J. Rausch ,  Ray J. Van Thyne

IPC: C23C2/10 ,  C23C10/22 ,  C23C12/02 ,  C23C1/08 ,  C23C1/10

CPC classification number: C23C12/02 ,  C23C10/22 ,  C23C2/10

Abstract: Predetermined diffusing elements such as chromium and/or aluminum are diffused into the surface of a ferrous-based part while preventing, or at least minimizing, bonding of portions of such part to each other or to a fixture with which the part is processed, by constructing the fixture of a barrier material or placing a barrier layer between the member and the part. The barrier has a composition to substantially preclude diffusion therein of the predetermined element and that is capable of withstanding a molten-lead alloy bath. Then the part is contacted by a molten alloy bath consisting essentially of lead and the diffusing elements. Thereafter, the part is separated from the member. The process finds particular use when the part is coiled sheet steel, in which case adjacent flights of coil are spaced by separator means which is made of a barrier material or carries a barrier layer.

Abstract translation: 预定的扩散元素如铬和/或铝扩散到铁基部件的表面中，同时防止或至少最小化粘合这些部件的部分彼此或部件被加工的夹具，通过 构造阻挡材料的夹具或将阻挡层放置在构件和部件之间。 阻挡层具有基本上防止其中预定元件扩散并且能够耐受熔融铅合金浴的组成。 然后通过基本上由铅和扩散元件组成的熔融合金浴接触该部件。 此后，该部件与该部件分离。 当该部件是卷绕钢板时，该过程会发现特别的用途，在这种情况下，线圈的相邻翼片由隔离材料隔开或由阻挡材料制成或承载阻挡层隔开。

公开(公告)号：US4233067A

公开(公告)日：1980-11-11

申请号：US1955

申请日：1979-01-08

Applicant: Kazuo Sawada

Inventor： Kazuo Sawada

IPC: C22C9/00 ,  C23C2/08 ,  C23C2/10 ,  H01B1/02 ,  C22F1/08

CPC classification number: H01B1/026 ,  C22C9/00 ,  C23C2/08 ,  C23C2/10 ,  Y10T428/12694 ,  Y10T428/12715

Abstract: Soft copper alloy conductors having a 0.2% proof stress of 12 kg/mm.sup.2 or less which contains 5-200 p.p.m. of calcium, the balance substantially consisting of copper, and hot-dip coated copper alloy conductors made by coating the surface of copper alloy conductors of said composition with tin or lead or their alloy by hot-dipping, and a method of manufacturing said copper alloy conductors.

Abstract translation: 软铜合金导体的0.2％弹性应力为12 kg / mm2以下，含有5-200 p.p.m。 的钙，余量基本上由铜组成，热浸镀铜合金导体是用锡或铅或其合金通过热浸涂覆所述组合物的铜合金导体的表面而制成的，以及制造所述铜合金的方法 导体

公开(公告)号：US3843417A

公开(公告)日：1974-10-22

申请号：US30989072

申请日：1972-11-27

Applicant: NIPPON STEEL CORP

Inventor： OHBU M ,  ASAKAWA K

IPC: C21D9/46 ,  C23C2/02 ,  C23C2/06 ,  C23C2/10 ,  C23C2/40 ,  B44D1/34 ,  C23C1/02 ,  C23C1/04

CPC classification number: C23C2/10 ,  C23C2/02 ,  C23C2/06

Abstract: 1. IN A METHOD FOR HOT DIPPING AN ALUMINIUM-KILLED STEEL SHEET IN A HOT DIPPING LINE INVOLVING A REDUCTION ANNEALING PRETREATMENT PROCESS WHICH INCLUDES THE STEPS OF HOT ROLLING SAID STEEL SHEET, DESCALING THE SHEET BY ACID PICKLING, COLD ROLLING THE SHEET, AND THEN DEGREASING THE SHEET IN HOT DIPPING EQUIPMENT, REDUCTION ANNEALING THE SHEET, COOLING THE SHEET TO A SUITABLE DIPPING TEMPERATURE AND IMMERSING THE SHEET IN A HOT DIPPING BATH, THE IMPROVEMENT WHICH COMPRISES WINDING SAID ALUMINIUMKILLED STEEL SHEET AT A TEMPERAUTRE HIGHER THAN 650* C. AFTER THE HOT ROLLING.

公开(公告)号：US3689941A

公开(公告)日：1972-09-12

申请号：US3689941D

申请日：1970-06-23

Applicant: CHAUSSON USINES SA

Inventor： CHARTET ANDRE

IPC: B23K1/20 ,  B21D53/02 ,  B23K1/00 ,  B23K35/00 ,  C23C2/10 ,  F28D1/03 ,  F28D21/00 ,  F28F9/18 ,  F28F21/08

CPC classification number: F28F21/082 ,  B21D53/02 ,  B23K1/0012 ,  B23K35/004 ,  C23C2/10 ,  F28D1/03 ,  F28F9/18 ,  Y10S29/037 ,  Y10T29/49393 ,  Y10T29/49982

Abstract: The two faces of a sheet or thin strip of stainless steel are covered with a thin coating of lead, and is used for constituting the tubes, collector, water-boxes as well as the pipes of a radiator, and the parts thus made are soldered together with a tin-lead alloy by the same operational cycle as with corresponding parts made of brass or copper.

Abstract translation: 不锈钢板或薄钢带的两面用薄涂层的铅覆盖，用于构成管，收集器，水箱以及散热器的管道，并将这样制成的零件焊接 与锡铅合金一样，与由黄铜或铜制成的相应部件相同的操作周期。

公开(公告)号：US3652337A

公开(公告)日：1972-03-28

申请号：US3652337D

申请日：1969-08-25

Applicant: GEN MOTORS CORP

Inventor： MIX RENARD E

IPC: B23K1/08 ,  C23C2/10 ,  H01M2/28 ,  H01M35/32

CPC classification number: H01M2/28 ,  B23K1/08 ,  C23C2/10 ,  Y10S164/01

Abstract: A process for consistently producing welds between portions of a plurality of Pb-acid storage battery plates and in-situ cast-on battery plate straps, including the essential step of coating a portion of the battery plate with a molten film of an alloy having a melting point at least about 200* F. lower than the melting point of the battery plate and contacting the coated portion with molten battery plate strap material while said film is in a molten condition. The process is most particularly applicable when using Pb-Ca alloys in the plate groups.

Abstract translation: 一种用于在多个Pb酸蓄电池板和原位浇铸电池板带的部分之间始终产生焊接的方法，其包括用熔融膜涂覆电池板的一部分的必要步骤，该熔融膜具有 熔点比电池板的熔点低至少约200°F，并且当所述膜处于熔融状态时，将涂覆部分与熔融电池板带材料接触。 当在板组中使用Pb-Ca合金时，该方法最特别适用。