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    Liquid Coating Device
    3.
    发明申请
    Liquid Coating Device 审中-公开
    液体涂装装置

    公开(公告)号：US20160346878A1

    公开(公告)日：2016-12-01

    申请号：US15164944

    申请日：2016-05-26

    申请人： Senju Metal Industry Co., Ltd.

    发明人： Manabu Muraoka ,  Takeo Saitoh ,  Shigeyuki Sekine ,  Takashi Obayashi ,  Kaichi Tsuruta ,  Takashi Hagiwara ,  Hiroyuki Yamasaki ,  Kota Kikuchi ,  Naoto Kameda

    IPC分类号： B23K35/40 ,  B23K1/08 ,  B23K35/36 ,  B05C3/12 ,  B05C13/00

    CPC分类号： B23K35/404 ,  B05C3/125 ,  B05C9/04 ,  B05C9/12 ,  B05C9/14 ,  B05C13/00 ,  B23K1/08 ,  B23K35/36

    摘要： In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.

    摘要翻译： 在助焊剂施加装置中，控制部控制输送辊等，从而控制施加于焊料的焊剂的厚度。 卷绕辊旋转，使得焊料以传送速度传送。 拉出焊料时，拉出辊沿着焊料的输送方向向焊料反向施加任何负载（反向张力）。 焊料以预定速度输送并浸入含有焊剂的焊剂罐中。 焊料以垂直的输送速度从焊剂罐中拉出。 通过以恒定的输送速度垂直地从焊剂罐中拉出焊料，界面张力作用在焊料9a和焊剂上，使得根据传送速度具有均匀厚度的焊剂保留在焊料的表面和背面上 焊接。

    Device for Coating Thin Molten Solder Film, Thin Solder Film-covered Component and Manufacturing Method Therefor
    8.
    发明申请
    Device for Coating Thin Molten Solder Film, Thin Solder Film-covered Component and Manufacturing Method Therefor 有权
    薄熔膜涂膜装置，薄膜​​覆膜组件及其制造方法

    公开(公告)号：US20150174678A1

    公开(公告)日：2015-06-25

    申请号：US14407040

    申请日：2013-06-10

    申请人： Senju Metal Industry Co., Ltd.

    发明人： Isamu Sato ,  Koji Watanabe ,  Kota Kikuchi ,  Michio Suzuki ,  Naoto Kameda ,  Hideki Nakamura

    IPC分类号： B23K3/06 ,  C23C2/36 ,  C23C2/00 ,  C23C2/16 ,  B23K1/20 ,  C23C2/04

    CPC分类号： B23K3/0676 ,  B23K1/012 ,  B23K1/08 ,  B23K1/20 ,  B23K31/02 ,  C23C2/003 ,  C23C2/04 ,  C23C2/10 ,  C23C2/16 ,  C23C2/20 ,  C23C2/36 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K3/3468 ,  H05K2203/044 ,  H05K2203/1545 ,  Y10T428/12701 ,  H01L2924/00

    摘要： A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few μm and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG. 1, this apparatus comprises a solder bath 17 of accommodating the molten solder 7; a second conveying section 23 for drawing up a strip member 31 from the solder bath; and a blower section 19 for blowing hot gas on the strip member 31 immediately after being drawn up from the solder bath by a second conveying section 23; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder 7. According to this configuration, the excess molten solder 7 can be trimmed from the strip member 31 corresponding to composition of the molten solder 7. Thus, the film thickness of the molten solder 7 coated on the strip member 31 can be controlled evenly and in increments of a few μm.

    摘要翻译： 用于电镀薄熔融焊料膜的热浸镀装置可以均匀地以几μm的增量控制基材上的熔融焊料的膜厚度，并且实现薄膜焊接电镀，其膜厚度小于常规 系统。 如图所示。 如图1所示，该装置包括容纳熔融焊料7的焊料槽17; 用于从焊料槽中拉出带状部件31的第二输送部23; 以及用于通过第二输送部23从焊料槽吸引之后，立即在带状部件31上吹出热气体的送风部19; 热气体具有预定的流动体积和等于或高于熔融焊料7的熔融温度的预定温度。根据该构造，可以从带状部件31对多余的熔融焊料7进行修整，对应于熔融 因此，可以均匀地以几μm的增量控制涂覆在带状部件31上的熔融焊料7的膜厚。