公开(公告)号：US20180158757A1

公开(公告)日：2018-06-07

申请号：US15578867

申请日：2016-05-23

申请人： SIEMENS AKTIENGESELLSCHAFT

发明人： Hubert Baueregger ,  Volkmar Sommer ,  Stefan Stegmeier

IPC分类号： H01L23/49 ,  H01L23/50 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  C25D3/38 ,  C25D5/18 ,  C25D21/14 ,  H05K3/42

CPC分类号： H01L23/49 ,  C25D3/38 ,  C25D5/18 ,  C25D21/14 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/4922 ,  H01L23/49513 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49811 ,  H01L23/50 ,  H01L24/05 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/75 ,  H01L24/77 ,  H01L24/82 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/24105 ,  H01L2224/24227 ,  H01L2224/24245 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/3207 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37005 ,  H01L2224/37111 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/37166 ,  H01L2224/3719 ,  H01L2224/37211 ,  H01L2224/37224 ,  H01L2224/37239 ,  H01L2224/37244 ,  H01L2224/37247 ,  H01L2224/37255 ,  H01L2224/37266 ,  H01L2224/3729 ,  H01L2224/373 ,  H01L2224/37395 ,  H01L2224/376 ,  H01L2224/4007 ,  H01L2224/40227 ,  H01L2224/40499 ,  H01L2224/756 ,  H01L2224/75703 ,  H01L2224/776 ,  H01L2224/77703 ,  H01L2224/821 ,  H01L2224/82101 ,  H01L2224/83007 ,  H01L2224/831 ,  H01L2224/834 ,  H01L2224/83411 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83466 ,  H01L2224/8349 ,  H01L2224/83511 ,  H01L2224/83524 ,  H01L2224/83539 ,  H01L2224/83544 ,  H01L2224/83547 ,  H01L2224/83555 ,  H01L2224/83566 ,  H01L2224/8359 ,  H01L2224/836 ,  H01L2224/83695 ,  H01L2224/8385 ,  H01L2224/83907 ,  H01L2224/84007 ,  H01L2224/841 ,  H01L2224/8485 ,  H01L2224/8492 ,  H01L2224/84951 ,  H01L2224/9201 ,  H01L2224/9205 ,  H01L2224/9221 ,  H01L2224/97 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K3/424 ,  H01L2924/00012 ,  H05K3/4661 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0105 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/82 ,  H01L2924/01014

摘要： The invention relates to a method for electrically contacting a component (10) (for example a power component and/or a (semiconductor) component having at least one transistor, preferably an IGBT (insulated-gate bipolar transistor)) having at least one contact (40, 50), at least one open-pored contact piece (60, 70) is galvanically (electrochemically or free of external current) connected to at least one contact (40, 50). In this way, a component module is achieved. The contact (40, 50) is preferably a flat part or has a contact surface, the largest planar extent thereof being greater than an extension of the contact (40, 50) perpendicular to said contact surface. The temperature of the galvanic connection is at most 100° C., preferably at most 60° C., advantageously at most 20° C. and ideally at most 5° C. and/or deviates from the operating temperature of the component by at most 50° C., preferably by at most 20° C., in particular by at most 10° C. and ideally by at most 5° C., preferably by at most 2° C. The component (10) can be contacted by means of the contact piece (60, 70) with a further component, a current conductor and/or a substrate (90). Preferably, a component (10) having two contacts (40, 50) on opposite sides of the component (10) is used, wherein at least one open-pored contact piece (60, 70) is galvanically connected to each contact (40, 50).