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    Laser processing apparatus and laser processing method
    1.
    发明授权
    Laser processing apparatus and laser processing method 有权

    公开(公告)号：US11980971B2

    公开(公告)日：2024-05-14

    申请号：US17132987

    申请日：2020-12-23

    申请人： Via Mechanics, Ltd.

    发明人： Yuki Saeki

    IPC分类号： B23K26/382 ,  B23K26/00 ,  B23K26/04 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/082

    CPC分类号： B23K26/382 ,  B23K26/0006 ,  B23K26/043 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/082

    摘要： A purpose of the present invention is to quickly change a focal point of a laser emission system so that processing with high quality and good processing efficiency can be performed. In a laser processing apparatus including: a laser oscillator configured to output a laser pulse; a laser deflector configured to deflect the laser pulse in a two-dimensional direction; and a controller configured to control the laser oscillator and the laser deflector, the laser processing apparatus being configured to emit the laser pulse to a workpiece for processing the workpiece, the laser processing apparatus has a feature in which an electrooptic device capable of, under control of the controller, electrically changing a focal point of the laser pulse to be input to the laser deflector is arranged in an input side of the laser deflector.

    Laser processing apparatus and laser processing method
    3.
    发明授权
    Laser processing apparatus and laser processing method 有权

    公开(公告)号：US11454836B2

    公开(公告)日：2022-09-27

    申请号：US16447474

    申请日：2019-06-20

    申请人： Via Mechanics, Ltd.

    发明人： Kazuya Matsumoto ,  Kazuo Watanabe ,  Atsushi Sakamoto ,  Masanori Sato ,  Mitsuru Kato ,  Masaru Kikuchi

    IPC分类号： G02F1/11 ,  H01S3/00 ,  B23K26/382 ,  H05K3/00

    摘要： A laser processing apparatus disclosed in the present application includes: an optical deflection unit capable of changing a deflection direction of and outgoing energy of an incoming laser pulse by changes of a frequency of and an amplitude of a driving signal to be supplied; and a control unit configured to supply driving signals with amplitudes corresponding to respective frequencies. In a laser processing apparatus configured to process a workpiece by leading outgoing laser pulse of the optical deflection unit to the workpiece and irradiating the workpiece with the laser pulse, as the amplitude corresponding to each of the frequencies, the control unit supplies an amplitude having the ratio that is close to the lowest ratio among ratios of the outgoing energy with respect to the incoming energy of the laser pulse at an amplitude having the largest outgoing energy of the optical deflection unit.

    LASER MACHINING METHOD
    5.
    发明申请
    LASER MACHINING METHOD 审中-公开
    激光加工方法

    公开(公告)号：US20140319107A1

    公开(公告)日：2014-10-30

    申请号：US14262055

    申请日：2014-04-25

    申请人： Via Mechanics, Ltd.

    发明人： Kentaro YAMAGAMI ,  Tatsuya NISHIBE ,  Takashi SASAKI

    IPC分类号： B23K26/06 ,  B23K26/36 ,  B23K26/08 ,  B23K26/38

    CPC分类号： B23K26/0853 ,  B23K26/0622 ,  B23K26/364 ,  B23K26/38 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/0026

    摘要： A laser machining method for cutting or cutting grooves on a workpiece using an apparatus having an X-Y table for mounting the workpiece, a laser source emitting a continuous wave or a quasi-continuous wave laser beam, modulator forming a pulsed laser beam by a high-speed modulation of the continuous wave or quasi-continuous wave laser beam, and an optical system capable of converging the pulsed laser beam on the workpiece, wherein the method comprising cutting with the pulsed laser beams along a locus including a portion where the moving speed of the X-Y table is decreased, and the pitch of holes machined with said laser pulses is kept constant by adjusting the intervals between successive said laser pulses in accordance with the moving speed of said workpiece, the method further comprising increasing the pulse widths of the laser pulses in accordance with the decrease in moving speed of the X-Y table in the portion where the moving speed of the X-Y table is decreased.

    摘要翻译： 一种用于使用具有用于安装工件的XY工作台的装置，发射连续波的激光源或准连续波激光束来切割或切割工件上的凹槽的激光加工方法，通过高速形成脉冲激光束的调制器， 连续波或准连续波激光束的速度调制，以及能够将脉冲激光束会聚在工件上的光学系统，其中，该方法包括用脉冲激光束沿一个轨迹进行切割，该轨迹包括一部分，其中移动速度 XY台减小，并且通过根据所述工件的移动速度调节连续的所述激光脉冲之间的间隔，用所述激光脉冲加工的孔的间距保持恒定，该方法还包括增加激光脉冲的脉冲宽度 根据XY台的移动速度减小的部分中的XY台的移动速度的降低。

    Method and apparatus for laser drilling
    6.
    发明申请
    Method and apparatus for laser drilling 审中-公开
    激光钻孔的方法和装置

    公开(公告)号：US20040217093A1

    公开(公告)日：2004-11-04

    申请号：US10854214

    申请日：2004-05-27

    申请人： Hitachi Via Mechanics, Ltd.

    发明人： Kunio Arai ,  Kazuhisa Ishii

    IPC分类号： B23K026/00 ,  B23K026/14

    CPC分类号： B23K26/0846 ,  B23K26/18 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/35 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/0393 ,  H05K3/0038 ,  H05K2201/0394 ,  H05K2203/0156 ,  H05K2203/1545 ,  Y10T156/1158 ,  Y10T156/19

    摘要： There is provided a laser drilling method that prevents hanging, expansion, or crinkles of copper foil caused when an ultraviolet laser beam that requires no surface roughening is used for a thin double-sided copper-clad film. The drilling method of the copper-clad film comprises the steps of: using an ultraviolet laser as a laser beam; drilling after bonding a resin film to the backside of the film which is the opposite side to the laser-beam-incidence; and delaminating the resin film on the backside after drilling. The resin film bonded to the backside prevents the copper foil from hanging, thus allowing the laser beam to be efficiently applied to the copper foil, and allowing the copper foil to be completely removed by ablation. In the case of a blind hole, the resin film bonded to the backside prevents expansion of the copper foil. Crinkles can be also prevented.

    摘要翻译： 提供了一种激光打孔方法，当不需要表面粗糙化的紫外线激光束用于薄的双面覆铜膜时，防止铜箔的悬挂，膨胀或皱缩。 铜包膜的钻孔方法包括以下步骤：使用紫外线激光器作为激光束; 在将树脂膜粘合到与激光束入射的相反侧的膜的背面之后进行钻孔; 并在钻孔后在背面剥离树脂膜。 结合到背面的树脂膜防止铜箔悬垂，从而允许激光束有效地施加到铜箔上，并且通过烧蚀使铜箔完全去除。 在盲孔的情况下，结合到背面的树脂膜防止铜箔膨胀。 也可以防止皱纹。

    Multibeam laser drilling apparatus
    7.
    发明申请
    Multibeam laser drilling apparatus 有权
    多波束激光钻孔设备

    公开(公告)号：US20040129685A1

    公开(公告)日：2004-07-08

    申请号：US10740817

    申请日：2003-12-22

    申请人： HITACHI VIA MECHANICS, LTD.

    发明人： Kunio Arai ,  Kenji Suzuki

    IPC分类号： B23K026/38 ,  B23K026/067

    CPC分类号： B23K26/0673 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/067 ,  B23K26/082 ,  B23K26/382 ,  B23K2103/50 ,  H05K3/0026

    摘要： Provided is a multi-beam laser drilling apparatus for drilling a workpiece, simultaneously at two positions while telecentric errors are suppressed, in which a conventional optical system in which galvanometer mirrors are used for a first laser beam, and a galvanometer-mirror system is located close to an fnull lens in order to prevent occurrence of telecentric error. A second laser beam which has been deflected by a second galvanometer-mirror system, transmits through a polarized beam mixers and is incident upon the first galvanometer-mirror system and the fnull lens, and accordingly, the workpiece is drilled simultaneously at two positions with the use of both first and second laser beams.

    摘要翻译： 本发明提供一种多光束激光钻孔装置，用于在远心误差被抑制的同时位于两个位置的同时进行钻孔，其中将检流计镜用于第一激光束的常规光学系统和电流计镜系统位于 靠近ftheta镜头，以防止发生远心错误。 已经被第二电流计反射镜系统偏转的第二激光束透射通过偏振光束混合器并且入射到第一电流计反射镜系统和透镜上，因此在两个位置上同时钻出工件 使用第一和第二激光束。

    Printed circuit board processing machine
    8.
    发明申请
    Printed circuit board processing machine 失效
    印刷电路板加工机

    公开(公告)号：US20020152619A1

    公开(公告)日：2002-10-24

    申请号：US09840062

    申请日：2001-04-24

    申请人： Hitachi Via Mechanics, Ltd.

    发明人： Yasushi Ito ,  Akira Irie

    IPC分类号： G01B005/004

    CPC分类号： H05K13/0452 ,  H05K3/0047 ,  H05K3/0097 ,  H05K13/0406 ,  H05K13/0409

    摘要： A printed circuit board processing machine has: a table that can travel in a X-direction carrying a printed circuit board thereon; a cross rail arranged so as to straddle the table; a plurality of sliders supported for independently movement in a Y-direction by the cross rail; a plurality of spindles supported for movement in a Z-direction by the sliders; a magnetic rail of a linear-motor fixed to the cross rail; and a plurality of coils of the linear-motor fixed to the sliders so as to oppose the magnetic rail.

    摘要翻译： 印刷电路板加工机具有：能够在其上携带印刷电路板的X方向上行进的工作台; 一个跨轨道，以便跨越桌子; 多个滑块，用于通过横梁独立地在Y方向上移动; 多个主轴通过滑块支撑在Z方向上移动; 固定在横梁上的线性马达的磁轨; 以及固定到所述滑动件上以与所述磁轨相对的所述线性电动机的多个线圈。

    Laser processing method and laser processing apparatus
    9.
    发明授权
    Laser processing method and laser processing apparatus 有权

    公开(公告)号：US10350704B2

    公开(公告)日：2019-07-16

    申请号：US15418174

    申请日：2017-01-27

    申请人： Via Mechanics, Ltd.

    发明人： Haruaki Otsuki ,  Kyosuke Suzuki ,  Satoshi Fukushima

    IPC分类号： B23K26/035 ,  B23K26/08 ,  B23K26/402 ,  B23K26/082 ,  B23K26/0622 ,  B23K26/382 ,  B23K101/36 ,  B23K101/42

    摘要： The object of the present invention is to achieve the combination processing that accelerates the processing speed while keeping the accuracy of finishing. In the combination processing consisting combination of stationary processing and synchronization processing, the processing of the section in the rows in an processing area is performed from a first end to a second end of a row, and then from the second end to the first end of the next row so that the processing is performed from side to side. The stationary processing is performed in sections having relatively low processing densities and the synchronization processing is performed in the other sections than the sections for the stationary processing.