公开(公告)号：US20250069900A1

公开(公告)日：2025-02-27

申请号：US18943381

申请日：2024-11-11

Applicant: Rashid Mavliev

Inventor： Rashid Mavliev

IPC: H01L21/48 ,  B29C33/42 ,  B29C43/50 ,  C25D5/02 ,  C25D7/06 ,  C25D17/00 ,  H01L21/683 ,  H01L21/768 ,  H01L23/528 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24

Abstract: Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template May be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

公开(公告)号：US12234560B2

公开(公告)日：2025-02-25

申请号：US18234270

申请日：2023-08-15

Applicant: LG INNOTEK CO., LTD.

Inventor： Jee Heum Paik ,  Yoon Tai Kim

IPC: C25D7/06 ,  B32B15/01 ,  C23C14/04 ,  C23F1/02 ,  C23F1/28 ,  C25D5/12 ,  C25D5/50 ,  C23C14/12

Abstract: Discussed is a deposition mask including a metal plate. The metal plate includes an alloy of nickel (Ni) and iron (Fe) having a plurality of through-holes. Each of the through-holes includes a first surface hole, a second surface hole opposite to the first surface hole, and a connecting part through which the first surface hole and the second surface hole communicate with each other. The metal plate includes a first outer portion, a second outer portion opposite to the first outer portion and a central portion between the first outer portion and the second outer portion. Nickel contents of the first outer portion and the second outer portion are greater than that of the central portion.

公开(公告)号：US20250063931A1

公开(公告)日：2025-02-20

申请号：US18393508

申请日：2023-12-21

Applicant: Olum Material Corporation

Inventor： Taek Yong JANG ,  Young Ho LEE

IPC: H10K71/16 ,  C25D1/10

Abstract: The present invention relates to a mask-support assembly and a producing method thereof. The mask-support assembly according to the present invention is used in a process of forming organic light emitting diode (OLED) pixels on a semiconductor wafer, and may include a support including an edge portion and a grid portion; and a mask connected onto the support and including a plurality of cell portions with mask patterns formed therein, wherein at least a part of the mask is disposed in a trench portion recessed in the support.

公开(公告)号：US20250062366A1

公开(公告)日：2025-02-20

申请号：US18684042

申请日：2022-09-02

Applicant: BLue-O Technology Inc.

Inventor： Hai Xiong Ruan ,  Emad Azmy Sultan Girgis

IPC: H01M4/88 ,  C25B11/054 ,  C25B11/065 ,  C25B11/081 ,  C25D15/00 ,  H01M4/86 ,  H01M4/92

Abstract: A novel catalyst layer (CL) composition and structure that provides exceptional durability with sustained catalytic performance for intended heavy duty vehicle (HDV) application. This inventive composition and structure of the CL includes an internal composition composed of binder-coated nanoparticles, binder-free catalyst nanoparticles and orderly electric, ionic, gas and liquid pathways; a multi-layered structure of different packing densities among multiple sublayers; and external patterning of an outer surface of the CL. Extended durability and catalytic performance of the CL is achieved, and through use of the inventive CL, a novel solid-state electroplating process is demonstrated to achieve a novel thin-film coated catalyst product. The binder-coated nanoparticles serve as an interconnection base or site to whose binder-coated surface the uncoated nanoparticles are attached in glue-like fashion, achieving an orderly structure in which binder-free catalyst nanoparticles are consistently interspersed between binder-coated nanoparticles and agglomerates thereof.

公开(公告)号：US20250059665A1

公开(公告)日：2025-02-20

申请号：US18722176

申请日：2022-12-20

Applicant: Shenzhen Institute of Advanced Electronic Materials

Inventor： Zhe Li ,  Zhiquan Liu ,  Liyin Gao ,  Rong Sun

IPC: C25D1/04 ,  H01M4/66 ,  H05K1/09 ,  H05K9/00

Abstract: An electrolytic solution for a copper foil, and the preparation and use of an electrolytic copper foil. The electrolytic solution for a copper foil comprises an additive, wherein the additive comprises an inhibitor and an auxiliary agent. The auxiliary agent comprises at least one of polystyrene sulfonate, polyethylene sulfonate, alkyl sulfonate and alkylbenzene sulfonate, wherein both the alkyl sulfonate and the alkyl benzene sulfonate have ≥12 carbon atoms. By means of simple and convenient chemical regulation and control means such as the selection and combination of additives for an electrolytic (electroplating) solution, a pre-electroplated copper material resulting from electroplating using the electrolytic solution can form a high-proportion annealing twin boundary after a heat treatment at a temperature of ≥200° C., and has the unique mechanical characteristic of “annealing-induced strengthening and toughening”.

公开(公告)号：US20250059649A1

公开(公告)日：2025-02-20

申请号：US18450515

申请日：2023-08-16

Applicant: Schlumberger Technology Corporation

Inventor： Manuel Marya

IPC: C23C28/02 ,  C22C18/00 ,  C23C2/06 ,  C25D3/22 ,  E21B17/10 ,  E21B43/12

Abstract: Embodiments presented provide for a Lead-free metallic barrier coating. In some aspects, a metallic barrier coating for Copper and/or Zinc-rich surfaces for downhole equipment and components is provided.

公开(公告)号：US12232287B2

公开(公告)日：2025-02-18

申请号：US17682158

申请日：2022-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kidoc Son ,  Youngchun Kim ,  Byounggyu Park ,  Kyunghwan Song ,  Hyuckki Lee

IPC: H05K5/00 ,  B23H3/00 ,  C25D11/26 ,  C25D11/34 ,  G06F1/16 ,  H05K5/04

Abstract: According to various embodiments of the disclosure, an electronic device may include: a housing, a processor disposed inside the housing, the housing may include a metal member comprising a metal and including a first convex and concave pattern formed in a shape corresponding to a shape of a second convex and concave pattern formed on a jig, wherein the jig is formed for use in electro chemical machining (ECM), and the first convex and concave pattern may have at least a portion formed at a substantially uniform pitch and a substantially uniform height.

公开(公告)号：US12232273B2

公开(公告)日：2025-02-18

申请号：US18337706

申请日：2023-06-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Yun Mi Bae ,  Soon Gyu Kwon ,  Sang Hwa Kim ,  Sang Young Lee ,  Jin Hak Lee ,  Han Su Lee ,  Dong Hun Jeong ,  In Ho Jeong ,  Dae Young Choi ,  Jung Ho Hwang

IPC: H05K1/02 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/12 ,  H05K1/09 ,  H05K1/11 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  C25D3/38

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

公开(公告)号：US12227869B2

公开(公告)日：2025-02-18

申请号：US15698522

申请日：2017-09-07

Applicant: Modumetal, Inc.

Inventor： Christina Ann Lomasney ,  Guohua Li

IPC: B29C64/147 ,  B29C33/04 ,  B29C33/56 ,  C23C18/16 ,  C25D1/10 ,  C25D3/02 ,  C25D5/00 ,  C25D5/10 ,  C25D5/12 ,  C25D5/56 ,  B29C33/38 ,  B29C49/00 ,  B29L31/50 ,  C23C18/20 ,  C23C18/24 ,  C23C18/30

Abstract: Embodiments of the present disclosure provide molds made by additive manufacturing coupled with electrodeposition. Such methods comprise subjected a workpiece to one or more deposition process(es), such as electrodeposition, that provide a coating that possesses desirable chemical, physical, and/or mechanical properties. In some embodiments, the methods further comprise forming at least one workpiece for the mold by, for example, an additive manufacturing process such as three-dimensional printing (3D printing). Additionally, the present disclosure provides methods for the use of a mold for molding polymerizable, settable, thermoplastic, or thermoset materials.

公开(公告)号：US12227865B2

公开(公告)日：2025-02-18

申请号：US17872366

申请日：2022-07-25

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

Inventor： Che-Min Lin ,  Hung-San Lu ,  Chao-Lung Chen ,  Chao Yuan Chang ,  Chun-An Kung ,  Chin-Hsin Hsiao ,  Wen-Chun Hou ,  Szu-Hung Yang ,  Ping-Ching Jiang

IPC: C25D17/00 ,  C25D7/12 ,  H01L21/288

Abstract: A plating apparatus for electroplating a wafer includes a housing defining a plating chamber for housing a plating solution. A voltage source of the apparatus has a first terminal having a first polarity and a second terminal having a second polarity different than the first polarity. The first terminal is electrically coupled to the wafer. An anode is within the plating chamber, and the second terminal is electrically coupled to the anode. A membrane support is within the plating chamber and over the anode. The membrane support defines apertures, wherein in a first zone of the membrane support a first aperture-area to surface-area ratio is a first ratio, and in a second zone of the membrane support a second aperture-area to surface-area ratio is a second ratio, different than the first ratio.