SUBSTRATE CONTAINING BOROSILICATE GLASS for HEAT REJECTION OR MITIGATION AND ENHANCED DURABILITY AND STRENGTH

    公开(公告)号:US20230044264A1

    公开(公告)日:2023-02-09

    申请号:US17362395

    申请日:2021-06-29

    摘要: The present disclosure relates to materials, and specifically to materials such as sheet, molded or extruded polymer materials containing flake, formed, powdered, granulated or splintered borosilicate glass for heat rejection or mitigation and enhanced durability and strength. The invention provides a synthetic substrate that includes: 1 to 70 wt % borosilicate glass having an average size of 0.1 to 50 um; and 30 to 99 wt % polymer material, wherein the synthetic substrate has either a denier ranging between 0.1 to 20.0 or a thickness ranging between 0.1 to 20 MIL, which provides thermal management properties including reduction in solar absorptance and net power absorbed by surfaces. The greater the intensity of the solar radiation the more reactive the borosilicate becomes, reflecting and dissipating an increased level of energy.